How AI Will Define the Next Silicon Supercycle – EE Times
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AI could have a major impact on the silicon supercycle and the future of efficient computing. The post How AI Will Define the Next Silicon Supercycle appeared first on EE Times.
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Trump wants to kill the CHIPS Act – Tom’s Hardware
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Trump tells the Senate President to get rid of the CHIPS Act and use the money allocated for it to reduce debt instead.
TSMC’s $100 Billion Investment in U.S. Shores Up Top Foundry – EE Times
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TSMC invests $100 billion in U.S. for AI chip production, hoping to bolster U.S. semiconductor ecosystem. The post TSMC’s $100 Billion Investment in U.S. Shores Up Top Foundry appeared first on EE Times.
Chiplets: A Technology, Not A Market – SemiEngineering
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An open, plug-and-play chiplet ecosystem still faces significant hurdles in interconnect standardization and packaging. The post Chiplets: A Technology, Not A Market appeared first on Semiconductor Engineering.
Apple Says it will Spend $500B in US Over Next Four Years – Tom’s Hardware
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Apple announced $500 billion in US spending over the next four years as it faces town tariff threats.
Semiconductor Industry Faces a Seismic Shift – EE Times
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Semiconductor industry is undergoing a period of dramatic upheaval, marked by the potential breakup of Intel and sale to Broadcom and/or TSMC, the rise of Arm as a chip manufacturer, and increasing geopolitical tensions. It will have far-reaching implications for the global supply chain. The post Semiconductor Industry Faces a Seismic Shift appeared first on […]
What’s Next In Advanced Packaging? – SemiEngineering
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Momentum is building for organic interposers, 3D stacking, and photonics, but questions remain about how the industry gets there and what kinds of tradeoffs will be necessary. The post What’s Next In Advanced Packaging? appeared first on Semiconductor Engineering.
TSMC Will Not Take Over Intel Operations, Observers Say – EE Times
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TSMC won’t take over Intel’s chip operations despite talks. See how geopolitical tensions shape this possible outcome. The post TSMC Will Not Take Over Intel Operations, Observers Say appeared first on EE Times.
What’s In Store for IMAPS DPC 2025: Featuring Amy Lujan, Tim Olson, and Jan Vardaman
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Send us a text Explore the transformative world of microelectronics packaging with industry visionaries Amy Lujan, Tim Olson, and Jan Vardaman as they share their journey at the IMAPS Annual Device Packaging Conference (DPC). With the conference relocating to the vast Wild Horse Pass, expect an enriched experience with expanded technical tracks and exhibitor opportunities […]
Semiconductor Giants Navigate AI Boom & Trade War – EE Times
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TSMC, AMD, Intel, and Arm navigate AI boom, economic shifts, and trade war. Insights on growth, revenue, and future outlook. The post Semiconductor Giants Navigate AI Boom & Trade War appeared first on EE Times.
Using AI In Semiconductor Inspection – SemiEngineering
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Finding anomalies and defects faster in complex chip and package topographies. The post Using AI In Semiconductor Inspection appeared first on Semiconductor Engineering.
SEMI ISS 2025 Recap and Semiconductor Market Update
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Send us a text The episode explores the key insights from the recent SEMI ISS event, focusing on the semiconductor industry’s journey toward a trillion-dollar market by 2030. It discusses the significant themes of uncertainty and the transformative impact of AI, while also addressing industry challenges and emerging trends. Additionally, SEMI’s Market Intelligence team dive […]
Why UCIe is Key to Connectivity for Next-Gen AI Chiplets – EE Times
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UCIe can enhance AI chiplet connectivity for efficient, scalable data center solutions. The post Why UCIe is Key to Connectivity for Next-Gen AI Chiplets appeared first on EE Times.
Advanced Packaging Moving At Breakneck Pace – SemiEngineering
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A chiplet supermarket is still years off, but progress is being made on all fronts. The post Advanced Packaging Moving At Breakneck Pace appeared first on Semiconductor Engineering.
Ex-Intel CEO Pat Gelsinger says Market Reaction to DeepSeek is Wrong – Tom’s Hardware
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The need for AI compute power will not go anywhere and Nvidia will thrive, says Pat Gelsinger.
ICYMI: Comet’s Isabella Drolz Explains How 3D X-Ray Uses AI to Help Build AI Chips
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Send us a text In this episode, Francoise von Trapp speaks with Isabella Drolz from Comet about how AI is revolutionizing semiconductor inspection strategies, particularly in 3D X-ray systems. They discuss how AI is being used to find structural defects in advanced chip packages, and also how 3D inspection is being used to develop advanced […]
Nvidia’s Mid-January GPU Driver Update Addresses Several Vulnerabilities and Exploits – Tom’s Hardware
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Nvidia releases another series of security updates for its GPU drivers. https://www.tomshardware.com/pc-components/gpu-drivers/nvidias-mid-january-gpu-driver-update-addresses-several-vulnerabilities-and-exploits
Chip Industry Investments Kept Flowing In 2024 Even As Some Projects Stalled – Semiconductor Engineering
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Companies poured billions into fabs and facilities around the world as regions continue to build self-sufficiency and form hubs with friendly nations. The post Chip Industry Investments Kept Flowing In 2024 Even As Some Projects Stalled appeared first on Semiconductor Engineering.
ICYMI: Can Photonics Solve the AI Energy Problem? Why is Process Control so Critical to Advanced Packaging?
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Send us a Text Message. Recorded live at the 2024 Electronic Component Technology Conference, this episode features conversations Francoise von Trapp has with Keynote Speaker Keren Bergman, Columbia University and co-founder of Xscape Photonics, and Chet Lennox, of KLA. Bergman explains the potential of photonics in AI applications to improve energy efficiency and bandwidth. You’ll […]
Nvidia Shifts to CoWoS-L Packaging for Blackwell GPU Production Ramp-up – Tom’s Hardware
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As demand shifts for dual-die Blackwell products, Nvidia reportedly increases CoWoS-L orders while possibly reducing orders for CoWoS-S packaging technology.
