Recommended Reads

European Chips Skills Academy Unveils Comprehensive Skills Strategy to Boost Competitiveness of Semiconductor Ecosystem – Semiconductor Digest

Nov 06, 2024 | Semiconductor Digest

The European Chips Skills Academy (ECSA), an EU-funded initiative coordinated by SEMI, today announced the publication of the Skills Strategy report by DECISION Etudes & Conseil that outlines the strategic approaches required to tackle Europe’s growing talent shortage in the semiconductor sector. European Chips Skills Academy Unveils Comprehensive Skills Strategy to Boost Competitiveness of Semiconductor Ecosystem was posted by Shannon Davis on […]

LIVE from Boston MA: Member Highlights from IMAPS Symposium 2024

Oct 25, 2024 | 3D InCites Podcast

Send us a text Recorded live at the IMAPS Symposium 2024 in Boston MA, where 3D InCites member companies presented their latest technologies and showcased their products. This episode features conversations with nine of our member companies. Brendan Wells, Amkor Technologies, Inc., explains the difference between laminate and strip-based substrates for advanced packaging and when […]

SEMICON Europa Spotlighting Innovation and Collaboration Powering Sustainable Growth – Semiconductor Today

Oct 22, 2024 | Semiconductor Today

Themed ‘Innovation and Collaboration: Powering Sustainable Exponential Growth’, SEMICON Europa 2024 is gathering industry experts at Messe München in Munich, Germany (12–15 November) for insights into the latest innovations and trends in sustainability, mobility, healthcare, materials, packaging, fab management and workforce. Co-located with electronica, it features keynotes from the electronics design and manufacturing ecosystem, academia […]

Live from IMAPS Symposium 2024: Updates on the NAPMP, Silicon Photonics and RDL Packaging

Oct 11, 2024 | 3D InCites Podcast

Send us a text This episode was recorded live at the IMAPS International Symposium in Boston MA.  Françoise von Trapp speaks with Dev Palmer, director of the National Advanced Packaging Manufacturing Program; Sandeep Sane of Lightmatter; Craig Bishop, Deca and Brett Wilkerson, AMD. Dev Palmer explains Chips Act’s funding distribution and its impact on the […]

Maximizing 3DIC Design Productivity with 3DBlox – SemiWiki

Oct 09, 2024 | SemiWiki.com

At the 2024 TSMC OIP Ecosystem Forum, one of the technical talks by TSMC focused on maximizing 3DIC design productivity and rightfully so. With rapid advancements in semiconductor technology, 3DICs have become the next frontier in improving chip performance, energy efficiency, and density. TSMC’s focus on streamlining the… Read More The post Maximizing 3DIC Design […]

SEMI Sets Sights on Security – EE Times

Oct 09, 2024 | EE Times

The SEMI SMCC will develop a semiconductor manufacturing industry profile for NIST Cybersecurity Framework 2.0. The post SEMI Sets Sights on Security appeared first on EE Times.

Lam Research’s Chee Ping Lee Explains the Role of HBM in Generative AI

Oct 04, 2024 | 3D InCites Podcast

Send us a text In this episode, Françoise von Trapp speaks with Chee Ping Lee, of Lam Research, about the critical role of high bandwidth memory (HBM) in generative AI, emphasizing its high bandwidth and compact design. HBM memory has received a lot of attention as one of the first technologies to implement 2.5D and […]

Barriers To Chiplet Sockets – SemiEngineering

Oct 02, 2024 | SemiEngineering

Perfection sometimes stands in the way of progress, and there is evidence this may be happening with chiplets. It may be time to slow down and make real progress. The post Barriers To Chiplet Sockets appeared first on Semiconductor Engineering.

Global Semiconductor Packaging Material Market Outlook Shows Return to Growth – Semiconductor Digest

Oct 02, 2024 | Semiconductor Digest

Powered by strong semiconductor demand across diverse end applications, the global semiconductor packaging materials market is expected to start a growth cycle with a 5.6% compound annual growth rate (CAGR) projected through 2028. Global Semiconductor Packaging Material Market Outlook Shows Return to Growth Starting in 2024 was posted by Shannon Davis on Semiconductor Digest.

Comet’s Isabella Drolz Explains How 3D X-Ray Uses AI to Help Build AI Chips

Sep 27, 2024 | 3D InCites Podcast

Send us a text In this episode, Francoise von Trapp speaks with Isabella Drolz from Comet about how AI is revolutionizing semiconductor inspection strategies, particularly in 3D X-ray systems. They discuss how AI is being used to find structural defects in advanced chip packages, and also how 3D inspection is being used to develop advanced […]

So You Want To Be an Interconnectologist? A Conversation with Simon McElrea of LQDX

Sep 20, 2024 | 3D InCites Podcast

Send us a text In this episode, Francoise speaks with Simon McElrea, an interconnectologist, about his career in and the evolution of interconnectology, emphasizing its importance in semiconductor packaging. McElrea discusses his roles at semiconductor start-ups like Vertical Circuits and Invensas;  his foray into wireless charging at Energous and FreePower; and his return to the […]

What Comes After HBM For Chiplets? – SemiEngineering

Sep 18, 2024 | SemiEngineering

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible? The post What Comes After HBM For Chiplets appeared first on Semiconductor Engineering.