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For this episode, recorded during the IMAPS International Symposium, Françoise von Trapp hands over the mike to Robin Davis, of 3D InCites Member company, Deca. Davis organized and moderated a Diversity, Equity, and Inclusion town hall discussion during IMAPS, on the topic of Equality vs. Equity. A distinguished panel of industry veterans shared their perceptions […]
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Cleaning is critical to yield and reliability, but cleaning what you can’t see requires new approaches, materials, and equipment The post Wafer Cleaning Becomes Key Challenge In Manufacturing 3D Structures appeared first on Semiconductor Engineering.
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Better materials and processes enable smaller, higher performing systems-in-package. The post SiPs: The Best Things in Small Packages appeared first on Semiconductor Engineering.
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25 of our community members participated in the 2022 IMAPS International Symposium in Boston, MA, which was held during the first week of October. This episode features conversations about what they were presenting and showcasing, and what they learned during the week. Craig North, of Gel-Pak, is on a mission to find out as much […]
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What’s needed to succeed with system-in-package. The post Heterogeneous Integration Co-Design Won’t Be Easy appeared first on Semiconductor Engineering.
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in this episode, Françoise von Trapp interviews three of the keynote speakers who presented during the 2022 IMAPS International Symposium. Featured guests include Lionel Kimmerling, Dr. Anu Agarwal (MIT Microphotonics Center); Glenn Daves (NXP), and Dave Bolognia (Analog Devices). We’re back on the road – recording a series of episodes at the IMAPS International Symposium. […]
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Following the news that TSMC reported strong Q3 2022 results; Josep Bori, Thematic Research Director at GlobalData, offers his view. TSMC Results Irrelevant, as U.S. Ban on Chip Technology Exports to China Will Define Semiconductor Sector in 2023 was posted by Shannon Davis on Semiconductor Digest.
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Micron’s designs on a megafab in New York, which could include four 600,000-square-foot cleanrooms, are partly the result of recent U.S. legislation, an analyst says. The post CHIPS Act Seen Facilitating Micron’s $100 Billion Plan appeared first on EE Times.
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It’s no secret that semiconductors are very much a male-dominated industry. In fact, according to Zippia, only 10.7% of engineers working in the semiconductor industry are women. And according to Deloitte and Touche’s Women in the Workplace, women are still vastly underrepresented at all levels of management. In this episode, Françoise von Trapp talks with […]
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The annual ITC event was held the last week of September, and I kept reading all of the news highlights from the EDA vendors, as the time spent on the tester can be a major cost and the value to catching defective chips from reaching production is so critical. Chiplets, 2.5D and 3D IC design […]
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EPFL and former Stanford professor recognized for his significant impact on the electronic system design industry through pioneering technical contributions. Dr. Giovanni De Micheli Honored with 2022 Phil Kaufman Award Presented by ESD Alliance and IEEE CEDA was posted by Shannon Davis on Semiconductor Digest.
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I just did a Google search for “3D IC”, and was stunned to see it return a whopping 476,000 results. This topic is trending, because more companies are using advanced IC packaging to meet their requirements, and yet the engineers doing the 3D IC design have new challenges to overcome. One of those challenges is […]
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In this episode, Françoise speaks with Riko Radojcic, veteran semiconductor engineer-turned-novelist, about his 30-year career in the semiconductor industry, what inspired him to turn to fiction writing, and what he hopes to teach his readers about the exciting world of semiconductor device technology. Ever since the chip shortage impacted your local car dealership, everyone in […]
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Electromagnetic analysis is essential for interposer designs. The post Holistic 3D-IC Interposer Analysis In Product Designs appeared first on Semiconductor Engineering.
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At a time when many pieces of an EDA flow are being fused together, pressure is mounting to make it a lot more open and amenable to external extension and enhancement. The post The End Of Closed EDA appeared first on Semiconductor Engineering.
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This SEMI Market intelligence Report podcast features Sanjay Malhotra, Vice President of SEMI’s Corporate Marketing and the Market Intelligence Team (MIT), and Christian Dieseldorff, Senior Principal Analyst. The conversation focuses on the World Fab Forecast, its history, how data is gathered, and how semiconductor manufacturers and suppliers use it to guide their business decisions. Sanjay […]
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The Biden-Harris Administration announced leadership for the newly-established CHIPS for America offices. CHIPS for America Leadership Team Announced was posted by Pete Singer on Semiconductor Digest.
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Good adhesion, stress management, and warpage control are features of high performing RDLs. The post Improving Redistribution Layers for Fan-out Packages And SiPs appeared first on Semiconductor Engineering.
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Often designers are amazed at the diversity of requirements fabricators and manufacturers have for metal filled areas in advanced package designs. Package fabricators and manufacturers do not like solid metal planes or large metal areas. Their strict metal fill requirements address two main issues. The dielectric and metal… Read More The post Three Ways to […]
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The forecast for the second half of 2022 looks vastly different from earlier this year when there was no end in sight for chip demand. The post Samsung Sounds Alarm About ’22 Chip Market Landing appeared first on EETimes.
