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I just did a Google search for “3D IC”, and was stunned to see it return a whopping 476,000 results. This topic is trending, because more companies are using advanced IC packaging to meet their requirements, and yet the engineers doing the 3D IC design have new challenges to overcome. One of those challenges is […]
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In this episode, Françoise speaks with Riko Radojcic, veteran semiconductor engineer-turned-novelist, about his 30-year career in the semiconductor industry, what inspired him to turn to fiction writing, and what he hopes to teach his readers about the exciting world of semiconductor device technology. Ever since the chip shortage impacted your local car dealership, everyone in […]
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Electromagnetic analysis is essential for interposer designs. The post Holistic 3D-IC Interposer Analysis In Product Designs appeared first on Semiconductor Engineering.
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At a time when many pieces of an EDA flow are being fused together, pressure is mounting to make it a lot more open and amenable to external extension and enhancement. The post The End Of Closed EDA appeared first on Semiconductor Engineering.
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This SEMI Market intelligence Report podcast features Sanjay Malhotra, Vice President of SEMI’s Corporate Marketing and the Market Intelligence Team (MIT), and Christian Dieseldorff, Senior Principal Analyst. The conversation focuses on the World Fab Forecast, its history, how data is gathered, and how semiconductor manufacturers and suppliers use it to guide their business decisions. Sanjay […]
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The Biden-Harris Administration announced leadership for the newly-established CHIPS for America offices. CHIPS for America Leadership Team Announced was posted by Pete Singer on Semiconductor Digest.
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Good adhesion, stress management, and warpage control are features of high performing RDLs. The post Improving Redistribution Layers for Fan-out Packages And SiPs appeared first on Semiconductor Engineering.
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Often designers are amazed at the diversity of requirements fabricators and manufacturers have for metal filled areas in advanced package designs. Package fabricators and manufacturers do not like solid metal planes or large metal areas. Their strict metal fill requirements address two main issues. The dielectric and metal… Read More The post Three Ways to […]
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The forecast for the second half of 2022 looks vastly different from earlier this year when there was no end in sight for chip demand. The post Samsung Sounds Alarm About ’22 Chip Market Landing appeared first on EETimes.
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Better standards, 3D DFT, and next-generation probes are a great start toward fully testing these complex systems. The post Enabling Test Strategies For 2.5D, 3D Stacked ICs appeared first on Semiconductor Engineering.
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With a strong history of leadership in manufacturing, Michigan is now paving the way as a world-leading innovation hub for the semiconductor industry. Latest Investments Boost Michigan’s Leadership in Semiconductor Industry was posted by Shannon Davis on Semiconductor Digest.
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In this episode, Françoise speaks with Dr. Juan Terrazas, the Director of the College of Engineering at CETYS University about the benefits of cross-border manufacturing relationships between the US and Mexico to help alleviate the strains of the semiconductor crisis. In the aftermath of President Biden’s signing of the CHIPS and Science Act, we’ve been […]
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The IMAPS International Symposium takes place October 4-7, 2022 at the Hynes Auditorium in Boston MA. This year’s Symposium theme is Packaging Technologies Enabling the New Normal, and will feature 20 sessions in five technical tracks, plus an Interactive Poster Session. The technical program will span three days of sessions with an emphasis on packaging […]
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Biden’s administration publishes strategy for implementing the CHIPS Act The post CHIPS Act: U.S. Releases New Implementation Strategy appeared first on Semiconductor Engineering.
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Industry analysts expect U.S. restrictions to hurt materials, EDA tool makers, and foundries outside of China. The post Effectiveness of Anti-China Chip Rules in Doubt appeared first on EETimes.
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Earlier this year, we brought you an episode about Roadtrip Nation – an initiative the SEMI Foundation sponsored to raise awareness among recent STEM graduates about opportunities in the semiconductor industry. We interviewed SEMI Foundation’s Shari Liss, to get all the details. You can listen to the episode here. In this follow-up episode, we’re speaking […]
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Intel announces a first-of-its-kind Semiconductor Co-Investment Program that introduces a new funding model to the capital-intensive semiconductor industry. Intel Signs Agreement with Brookfield to Jointly Invest up to $30 billion in Leading-edge Chip Factories in AZ was posted by Pete Singer on Semiconductor Digest.
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Choice of packaging technology is influenced by the communication interface between chiplets. The post Heterogeneous IC Packaging: Optimizing Performance And Cost appeared first on Semiconductor Engineering.
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Manufacturability reaches sufficient level to compete with flip-chip BGA and 2.5D. The post Fan-Out Packaging Gets Competitive appeared first on Semiconductor Engineering.
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This podcast episode was recorded live at SEMICON West 2022 at the Moscone Center in San Francisco, where critical discussions about the latest issues impacting the semiconductor industry took place. Chips aren’t the only thing in short supply, the semiconductor industry talent shortage continues, and SEMI has launched a workforce initiative to address this. In […]
