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Achieving the full potential of 3D-IC requires front-end design approaches that enable evaluation of different microarchitectures. The post Ready, Set, Go: Outrunning Moore’s Law With 3D-IC appeared first on Semiconductor Engineering.
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Why chiplets are a better choice for many applications than monolithic designs. The post Edge AI And Chiplets appeared first on Semiconductor Engineering.
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In this episode recorded live at SEMICON Europa 2022, Françoise hands over the mike to Cassandra Melvin, Senior Director of Business Development and Operations at SEMI Europe. At SEMICON Europa, Cassandra led a panel discussion on the topic of Leveraging Generational Differences in the Shifting Workplace. The panel comprised industry professionals representing different generational cohorts, […]
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What were once PCB scale problems are now squeezed into a single stacked or interconnected device. The post The Computational Electromagnetics Simulation Challenge Of 3D-IC appeared first on Semiconductor Engineering.
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In this episode, recorded live at SEMICON Europa in Munich the week of November 14-18, 2022, Françoise von Trapp speaks with 3D InCites member companies that either exhibited, presented, or in some cases, both, at the event. Conversations range from discussions about this year’s event compared with the 2021 show, the impact of the respective […]
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Nokia, Microsoft, and Qualcomm executives presented at the Brooklyn 6G Summit. The post A 6G Tree Grows in Brooklyn? appeared first on EE Times.
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A technical paper titled “A 100-Gb/s PAM4 Optical Transmitter in a 3-D-Integrated SiPh-CMOS Platform Using Segmented MOSCAP Modulators” was published by researchers at CalTech and University of Southampton. “The resulting… » read more The post Chip Sandwich: Electronics Chip & Photonics Chip Co-Optimized To Work Together (CalTech/Univ. of Southampton) appeared first on Semiconductor Engineering.
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This podcast episode was recorded live at SEMICON Europa 2022, in Munich Germany. It features interviews with select keynote speakers representing the depth and breadth of topics discussed throughout the week. Luc Van den hove, President and CEO of imec, in Belgium talks about the rollercoaster ride we’ve been on in the aftermath of the […]
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Why developing a multi-vendor standard for plug-and-play chiplets is so difficult. The post Is UCIe Really Universal? appeared first on Semiconductor Engineering.
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University experts share insights on the technology driving our world. Why Is ASU a Major Player in Microelectronics? was posted by Shannon Davis on Semiconductor Digest.
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Incorporating parts that have unique chemistries, optical characteristics, or specialized requirements into biotech devices. The post Heterogeneous Chip Assembly Helps Optimize Medical And Wearable Devices appeared first on Semiconductor Engineering.
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Plasma-Therm LLC of St Petersburg, FL, USA (which makes plasma-process equipment for the semiconductor and compound semiconductor markets) says that its site in Grenoble, France will serve as regional headquarters to support customers in central Europe, Middle East and North Africa (EMEA) markets focused on developing power, wireless, memory, sensor and MEMS, and other advanced […]
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The impact of hardware-assisted verification and the growth of semiconductor R&D spending on EDA fortunes. The post Wall Street View Of EDA Industry appeared first on Semiconductor Engineering.
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This collaboration will expand advanced semiconductor package testing capabilities in the US. Tektronix Partners with BRIDG to Boost Domestic Semiconductor Package Testing was posted by Shannon Davis on Semiconductor Digest.
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Chips are getting more complex; that’s a given. Whether it’s for enabling more computing performance in less space or embedding more intelligence into sensors and endpoint devices, designs are becoming more sophisticated; require more design expertise to optimize for power, performance, and area (PPA); and take longer for the whole design cycle, which includes verification […]
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In this episode, Françoise speaks with Beth Keser, Ph.D., about her latest book co-authored with Steffen Kröhnert, ESPAT Consulting. Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces was published in December 2021. It is essentially a companion to the wafer-level packaging handbook titled, Advances in Embedded and Fan-Out Wafer-Level Packaging […]
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The U.S. CHIPS Act spurred a rush to build new chip fabs in the U.S., but a lack of skilled labor to operate these fabs could be a challenge. The post Finding Talent to Run New Fabs Might Be Challenging appeared first on EE Times.
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Connected devices contain a wealth of information that is of great interest to attackers. The post Security Solutions In A World Of IoT Devices appeared first on Semiconductor Engineering.
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SIA-BCG study calls for new federal funds to be directed at five key areas of semiconductor R&D. New Report Identifies Target Areas for CHIPS R&D Investments was posted by Shannon Davis on Semiconductor Digest.
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Access to dies or chiplets is problematic, but a new standard may help. The post Testing 2.5D And 3D-ICs appeared first on Semiconductor Engineering.
