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The Biden-Harris Administration announced leadership for the newly-established CHIPS for America offices. CHIPS for America Leadership Team Announced was posted by Pete Singer on Semiconductor Digest.
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Good adhesion, stress management, and warpage control are features of high performing RDLs. The post Improving Redistribution Layers for Fan-out Packages And SiPs appeared first on Semiconductor Engineering.
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Often designers are amazed at the diversity of requirements fabricators and manufacturers have for metal filled areas in advanced package designs. Package fabricators and manufacturers do not like solid metal planes or large metal areas. Their strict metal fill requirements address two main issues. The dielectric and metal… Read More The post Three Ways to […]
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The forecast for the second half of 2022 looks vastly different from earlier this year when there was no end in sight for chip demand. The post Samsung Sounds Alarm About ’22 Chip Market Landing appeared first on EETimes.
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Better standards, 3D DFT, and next-generation probes are a great start toward fully testing these complex systems. The post Enabling Test Strategies For 2.5D, 3D Stacked ICs appeared first on Semiconductor Engineering.
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With a strong history of leadership in manufacturing, Michigan is now paving the way as a world-leading innovation hub for the semiconductor industry. Latest Investments Boost Michigan’s Leadership in Semiconductor Industry was posted by Shannon Davis on Semiconductor Digest.
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In this episode, Françoise speaks with Dr. Juan Terrazas, the Director of the College of Engineering at CETYS University about the benefits of cross-border manufacturing relationships between the US and Mexico to help alleviate the strains of the semiconductor crisis. In the aftermath of President Biden’s signing of the CHIPS and Science Act, we’ve been […]
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The IMAPS International Symposium takes place October 4-7, 2022 at the Hynes Auditorium in Boston MA. This year’s Symposium theme is Packaging Technologies Enabling the New Normal, and will feature 20 sessions in five technical tracks, plus an Interactive Poster Session. The technical program will span three days of sessions with an emphasis on packaging […]
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Biden’s administration publishes strategy for implementing the CHIPS Act The post CHIPS Act: U.S. Releases New Implementation Strategy appeared first on Semiconductor Engineering.
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Industry analysts expect U.S. restrictions to hurt materials, EDA tool makers, and foundries outside of China. The post Effectiveness of Anti-China Chip Rules in Doubt appeared first on EETimes.
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Earlier this year, we brought you an episode about Roadtrip Nation – an initiative the SEMI Foundation sponsored to raise awareness among recent STEM graduates about opportunities in the semiconductor industry. We interviewed SEMI Foundation’s Shari Liss, to get all the details. You can listen to the episode here. In this follow-up episode, we’re speaking […]
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Intel announces a first-of-its-kind Semiconductor Co-Investment Program that introduces a new funding model to the capital-intensive semiconductor industry. Intel Signs Agreement with Brookfield to Jointly Invest up to $30 billion in Leading-edge Chip Factories in AZ was posted by Pete Singer on Semiconductor Digest.
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Choice of packaging technology is influenced by the communication interface between chiplets. The post Heterogeneous IC Packaging: Optimizing Performance And Cost appeared first on Semiconductor Engineering.
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Manufacturability reaches sufficient level to compete with flip-chip BGA and 2.5D. The post Fan-Out Packaging Gets Competitive appeared first on Semiconductor Engineering.
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This podcast episode was recorded live at SEMICON West 2022 at the Moscone Center in San Francisco, where critical discussions about the latest issues impacting the semiconductor industry took place. Chips aren’t the only thing in short supply, the semiconductor industry talent shortage continues, and SEMI has launched a workforce initiative to address this. In […]
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When you can’t out, you go up. 3D devices are coming and we’ll be ready. The post Can You Afford DFT For 3D Stacked Die? appeared first on Semiconductor Engineering.
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While the CHIPS Act escalates the long-standing U.S.-China tech rivalry, Intel, Samsung, SK Hynix, and TSMC are the non-Chinese companies that stand to suffer the most, a former TSMC exec writes. The post Opinion: CHIPS Act Escalates Long-Standing U.S.-China Tech Rivalry appeared first on EETimes.
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In this episode, Françoise von Trapp interviews Laura Matz, CEO of Athinia™ and Chief Science and Technology Officer of Merck KGaA, Darmstadt, Germany, about the growing need for data collaboration between materials suppliers and semiconductor device manufacturers, and the solution she helped create. Over the past 10 years, more new materials have been introduced into […]
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SemiWiki has been tracking the popularity of chiplets for two years now so it was not surprising to see that they played a key role at DAC. The other trend we foresaw was that the ASIC companies would be early chiplet adopters and that has proven true. One of the more vocal proponents of chiplets […]
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How to level the playing field with AI software engineers. Shortages of Equipment, Design Engineers, Face Booming Semiconductor Industry was posted by Pete Singer on Semiconductor Digest.
