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Plasma-Therm LLC of St Petersburg, FL, USA (which makes plasma-process equipment for the semiconductor and compound semiconductor markets) says that its site in Grenoble, France will serve as regional headquarters to support customers in central Europe, Middle East and North Africa (EMEA) markets focused on developing power, wireless, memory, sensor and MEMS, and other advanced […]
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The impact of hardware-assisted verification and the growth of semiconductor R&D spending on EDA fortunes. The post Wall Street View Of EDA Industry appeared first on Semiconductor Engineering.
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This collaboration will expand advanced semiconductor package testing capabilities in the US. Tektronix Partners with BRIDG to Boost Domestic Semiconductor Package Testing was posted by Shannon Davis on Semiconductor Digest.
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Chips are getting more complex; that’s a given. Whether it’s for enabling more computing performance in less space or embedding more intelligence into sensors and endpoint devices, designs are becoming more sophisticated; require more design expertise to optimize for power, performance, and area (PPA); and take longer for the whole design cycle, which includes verification […]
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In this episode, Françoise speaks with Beth Keser, Ph.D., about her latest book co-authored with Steffen Kröhnert, ESPAT Consulting. Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces was published in December 2021. It is essentially a companion to the wafer-level packaging handbook titled, Advances in Embedded and Fan-Out Wafer-Level Packaging […]
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The U.S. CHIPS Act spurred a rush to build new chip fabs in the U.S., but a lack of skilled labor to operate these fabs could be a challenge. The post Finding Talent to Run New Fabs Might Be Challenging appeared first on EE Times.
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Connected devices contain a wealth of information that is of great interest to attackers. The post Security Solutions In A World Of IoT Devices appeared first on Semiconductor Engineering.
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SIA-BCG study calls for new federal funds to be directed at five key areas of semiconductor R&D. New Report Identifies Target Areas for CHIPS R&D Investments was posted by Shannon Davis on Semiconductor Digest.
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Access to dies or chiplets is problematic, but a new standard may help. The post Testing 2.5D And 3D-ICs appeared first on Semiconductor Engineering.
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For this episode, recorded during the IMAPS International Symposium, Françoise von Trapp hands over the mike to Robin Davis, of 3D InCites Member company, Deca. Davis organized and moderated a Diversity, Equity, and Inclusion town hall discussion during IMAPS, on the topic of Equality vs. Equity. A distinguished panel of industry veterans shared their perceptions […]
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Cleaning is critical to yield and reliability, but cleaning what you can’t see requires new approaches, materials, and equipment The post Wafer Cleaning Becomes Key Challenge In Manufacturing 3D Structures appeared first on Semiconductor Engineering.
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Better materials and processes enable smaller, higher performing systems-in-package. The post SiPs: The Best Things in Small Packages appeared first on Semiconductor Engineering.
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25 of our community members participated in the 2022 IMAPS International Symposium in Boston, MA, which was held during the first week of October. This episode features conversations about what they were presenting and showcasing, and what they learned during the week. Craig North, of Gel-Pak, is on a mission to find out as much […]
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What’s needed to succeed with system-in-package. The post Heterogeneous Integration Co-Design Won’t Be Easy appeared first on Semiconductor Engineering.
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in this episode, Françoise von Trapp interviews three of the keynote speakers who presented during the 2022 IMAPS International Symposium. Featured guests include Lionel Kimmerling, Dr. Anu Agarwal (MIT Microphotonics Center); Glenn Daves (NXP), and Dave Bolognia (Analog Devices). We’re back on the road – recording a series of episodes at the IMAPS International Symposium. […]
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Following the news that TSMC reported strong Q3 2022 results; Josep Bori, Thematic Research Director at GlobalData, offers his view. TSMC Results Irrelevant, as U.S. Ban on Chip Technology Exports to China Will Define Semiconductor Sector in 2023 was posted by Shannon Davis on Semiconductor Digest.
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Micron’s designs on a megafab in New York, which could include four 600,000-square-foot cleanrooms, are partly the result of recent U.S. legislation, an analyst says. The post CHIPS Act Seen Facilitating Micron’s $100 Billion Plan appeared first on EE Times.
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It’s no secret that semiconductors are very much a male-dominated industry. In fact, according to Zippia, only 10.7% of engineers working in the semiconductor industry are women. And according to Deloitte and Touche’s Women in the Workplace, women are still vastly underrepresented at all levels of management. In this episode, Françoise von Trapp talks with […]
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The annual ITC event was held the last week of September, and I kept reading all of the news highlights from the EDA vendors, as the time spent on the tester can be a major cost and the value to catching defective chips from reaching production is so critical. Chiplets, 2.5D and 3D IC design […]
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EPFL and former Stanford professor recognized for his significant impact on the electronic system design industry through pioneering technical contributions. Dr. Giovanni De Micheli Honored with 2022 Phil Kaufman Award Presented by ESD Alliance and IEEE CEDA was posted by Shannon Davis on Semiconductor Digest.
