Recommended Reads

The Era of Chiplets and Heterogeneous Integration: Challenges and Emerging Solutions to Support 2.5D and 3D Advanced Packaging – SemiWiki

Dec 29, 2022 | SemiWiki.com

From the multi-chip-modules (MCM) of yester years to today’s System-in-Package (SiP) implementations, things have progressed a lot in terms of package technology. The chiplet movement is not only a big beneficiary of today’s advanced package technologies but drives further advances in this technology area. While a chiplets-based… Read More The post The Era of Chiplets […]

The March Toward Chiplets – SemiEngineering

Dec 15, 2022 | SemiEngineering

The benefits of heterogenous integration are well understood, but getting there isn’t easy. The post The March Toward Chiplets appeared first on Semiconductor Engineering.

A Conversation about the Future of Semiconductor Packaging and Test in Europe

Dec 15, 2022 | 3D InCites Podcast

This episode was recorded live during the Advanced Packaging Sympoisium at SEMICON Europa on November 16. 2022. Steffen Kröhnert, President & Founder, ESPAT-Consulting, moderates a panel discussion with members of the semiconductor packaging service provider community in Europe. The topic? The Future of semiconductor manufacturing in Europe – and specifically, back-end packaging and test. Kröhnert […]

Edge AI And Chiplets – SemiEngineering

Dec 08, 2022 | SemiEngineering

Why chiplets are a better choice for many applications than monolithic designs. The post Edge AI And Chiplets appeared first on Semiconductor Engineering.

A Conversation about Leveraging Generational Differences in the Shifting Workplace

Dec 08, 2022 | 3D InCites Podcast

In this episode recorded live at SEMICON Europa 2022, Françoise hands over the mike to Cassandra Melvin, Senior Director of Business Development and Operations at SEMI Europe. At SEMICON Europa, Cassandra led a panel discussion on the topic of Leveraging Generational Differences in the Shifting Workplace. The panel comprised industry professionals representing different generational cohorts, […]

SEMICON Europa Member Spotlight: Conversations about the EU & US Chips Act and What’s New

Dec 01, 2022 | 3D InCites Podcast

In this episode, recorded live at SEMICON Europa in Munich the week of November 14-18, 2022, Françoise von Trapp speaks with 3D InCites member companies that either exhibited, presented, or in some cases, both, at the event. Conversations range from discussions about this year’s event compared with the 2021 show, the impact of the respective […]

Chip Sandwich: Electronics Chip & Photonics Chip Co-Optimized To Work Together (CalTech/Univ. of Southampton) – SemiEngineering

Dec 01, 2022 | SemiEngineering

A technical paper titled “A 100-Gb/s PAM4 Optical Transmitter in a 3-D-Integrated SiPh-CMOS Platform Using Segmented MOSCAP Modulators” was published by researchers at CalTech and University of Southampton. “The resulting… » read more The post Chip Sandwich: Electronics Chip & Photonics Chip Co-Optimized To Work Together (CalTech/Univ. of Southampton) appeared first on Semiconductor Engineering.

Is UCIe Really Universal? – SemiEngineering

Nov 23, 2022 | SemiEngineering

Why developing a multi-vendor standard for plug-and-play chiplets is so difficult. The post Is UCIe Really Universal? appeared first on Semiconductor Engineering.

Plasma-Therm’s Grenoble Site Made EMEA HQ – Semiconductor Today

Nov 18, 2022 | Semiconductor Today

Plasma-Therm LLC of St Petersburg, FL, USA (which makes plasma-process equipment for the semiconductor and compound semiconductor markets) says that its site in Grenoble, France will serve as regional headquarters to support customers in central Europe, Middle East and North Africa (EMEA) markets focused on developing power, wireless, memory, sensor and MEMS, and other advanced […]

Wall Street View Of EDA Industry – SemiEngineering

Nov 18, 2022 | SemiEngineering

The impact of hardware-assisted verification and the growth of semiconductor R&D spending on EDA fortunes. The post Wall Street View Of EDA Industry appeared first on Semiconductor Engineering.

EDA 2.0: Catalyzing the Human – EE Times

Nov 10, 2022 | EE Times

Chips are getting more complex; that’s a given. Whether it’s for enabling more computing performance in less space or embedding more intelligence into sensors and endpoint devices, designs are becoming more sophisticated; require more design expertise to optimize for power, performance, and area (PPA); and take longer for the whole design cycle, which includes verification […]

A Conversation with Beth Keser About Writing A Book on Advanced Fanout Wafer Level Packaging

Nov 10, 2022 | 3D InCites Podcast

In this episode, Françoise speaks with Beth Keser, Ph.D., about her latest book co-authored with Steffen Kröhnert, ESPAT Consulting. Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces was published in December 2021. It is essentially a companion to the wafer-level packaging handbook titled, Advances in Embedded and Fan-Out Wafer-Level Packaging […]