Recommended Reads

U.S. and India Semiconductor Groups Announce Initiative to Strengthen Public-Private Collaboration in Chip Ecosystem – Semiconductor Digest

Feb 02, 2023 | Semiconductor Digest

The U.S. Semiconductor Industry Association (SIA) and the India Electronics and Semiconductor Association (IESA) today jointly announced plans to form a private-sector task force that will strengthen collaboration between the two countries in the global semiconductor ecosystem. U.S. and India Semiconductor Groups Announce Initiative to Strengthen Public-Private Collaboration in Chip Ecosystem was posted by Shannon […]

ICYMI: Bill Chen and the Heterogeneous Integration Roadmap

Feb 02, 2023 | 3D InCites Podcast

Welcome to 3D InCites In Case You Missed It Series. We did a lot of podcasting in 2022. Some of our longer episodes consisted of multiple interviews, so you may have missed some of the juiciest conversations. So when there’s a break in the action, we’re taking you back to them. In this episode, we’re […]

Be Careful Who You Work For – SemiWiki

Feb 02, 2023 | SemiWiki.com

When one is looking for a job and that hunt extends from weeks into months or even years one is inclined to default to an any-port-in-a-storm mindset. Some recent experiences suggest to me that that mentality may need a reevaluation. I was surprised to learn recently, from conversations with industry acquaintances, that one’s… Read More The […]

10 Impactful Technologies in 2023 and Beyond – SemiWiki.com

Jan 26, 2023 | SemiWiki.com

There are many exciting technologies that are expected to shape the future, the following are some of the technologies that will impact our lives in the coming 5 years at different levels and depth: Generative AI, also known as generative artificial intelligence, is a type of #AI that is designed to generate new content or data … […]

A Conversation with SEMI’s Market Intelligence Team about ISS 2022 and the Semiconductor Manufacturing Monitor

Jan 19, 2023 | 3D InCites Podcast

For first episode of 2023, Françoise von Trapp handed over the microphone to Dean Freeman, the market analyst at 3D InCites. He attended SEMI’s Industry Strategy Symposium at Half Moon Bay, CA, in January and interviewed SEMI’s Market Intelligence team for the third episode in this four-part series. Part 3 focuses on the Semiconductor Manufacturing […]

Is AI Sustainable? Five Ways To Reduce Its Carbon Footprint – SemiEngineering

Jan 12, 2023 | SemiEngineering

Artificial intelligence (AI) can be part of the solution for tackling global warming – but it’s also a significant emitter of carbon itself. Can its net contribution be positive? The post Is AI Sustainable? Five Ways To Reduce Its Carbon Footprint appeared first on Semiconductor Engineering.

ICYMI: A Conversation about Addressing Material Challenges for Electric Mobility Technology

Jan 12, 2023 | 3D InCites Podcast

According to the International Energy Agency, road transportation accounts for 16% of global emissions. Electric vehicles are the key technology to decarbonize this. The EIA estimates that EVs will account for 13% of new cars sold in 2022. Many countries are setting goals to eliminate combustion engine cars to reach Net Zero emissions by 2050. […]

The Era of Chiplets and Heterogeneous Integration: Challenges and Emerging Solutions to Support 2.5D and 3D Advanced Packaging – SemiWiki

Dec 29, 2022 | SemiWiki.com

From the multi-chip-modules (MCM) of yester years to today’s System-in-Package (SiP) implementations, things have progressed a lot in terms of package technology. The chiplet movement is not only a big beneficiary of today’s advanced package technologies but drives further advances in this technology area. While a chiplets-based… Read More The post The Era of Chiplets […]

The March Toward Chiplets – SemiEngineering

Dec 15, 2022 | SemiEngineering

The benefits of heterogenous integration are well understood, but getting there isn’t easy. The post The March Toward Chiplets appeared first on Semiconductor Engineering.

A Conversation about the Future of Semiconductor Packaging and Test in Europe

Dec 15, 2022 | 3D InCites Podcast

This episode was recorded live during the Advanced Packaging Sympoisium at SEMICON Europa on November 16. 2022. Steffen Kröhnert, President & Founder, ESPAT-Consulting, moderates a panel discussion with members of the semiconductor packaging service provider community in Europe. The topic? The Future of semiconductor manufacturing in Europe – and specifically, back-end packaging and test. Kröhnert […]