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Why new approaches are required to design complex multi-chip systems. The post Customization, Heterogenous Integration, And Brute Force Verification appeared first on Semiconductor Engineering.
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Françoise von Trapp interviews Thomas Smelker, of Mercury Systems, about what is meant by “Trusted and Secure” microelectronics, and why it is critical to Mercury’s military, aerospace, space, and industrial customers. He then does a deep dive into the geopolitical climate, the “actors” are trying to take away the technological advantage the US and its […]
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Choosing components from a multi-vendor menu holds huge promise for reducing costs and time-to-market, but it’s not as simple as it sounds. The post Security Risks Widen With Commercial Chiplets appeared first on Semiconductor Engineering.
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So far there is little agreement on the best alternative to gasoline engines, but semiconductor technology is required for all of them. The post Which Fuel Will Drive Next-Generation Autos? appeared first on Semiconductor Engineering.
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Supplyframe today announced that it is a Gold-level sponsor of Women in Electronics, a community of progressive women leaders at all stages of their careers dedicated to expanding the opportunities for women in the fast-paced electronics industry. Supplyframe Invests in Women in Electronics was posted by Shannon Davis on Semiconductor Digest.
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ASE’s Mark Gerber, Amkor’s Curtis Zwenger, and Quorvo’s Matthew Poulton talk about 5G Technology Challenges; Synopsys’ Ming Zhen talks about the Era of SysMoore; Start-up competition competitors give mini-pitches. While the rollout of 5G is underway, there are remaining technology challenges that must be solved before we can really experience the full benefits of 5G. […]
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CBRS is about to start its time in the sun with 5G. The post CBRS and 5G: Boosting the Data Rates? appeared first on EETimes.
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What’s missing from tool chains and methodologies as chiplets and advanced packaging become more popular. The post EDA Gaps At The Leading Edge appeared first on Semiconductor Engineering.
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Qualcomm’s Chidi Chidambaram talks about system technology co-optimization; ASE’s Mark Gerber Talks about the VIPack Platform; Daniel Graf, Zero EC, talks about solving data bottlenecks. This episode was recorded live at the 2022 IMAPS Advanced SiP Conference, where the focus is on SiP technology developments, solutions and business trends. The first interview is with keynote […]
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When the problem statement changes, it sometimes pays to use a completely different approach. The post A New Breed Of EDA Required appeared first on Semiconductor Engineering.
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We are excited to share that we’ve partnered with SEMI’s Market Intelligence team to bring you quarterly semiconductor industry market updates. Each episode will feature one of SEMI’s market analysts, who will discuss different market trends driving specific areas of the market. They’ll also provide some high-level intelligence to help you in your day-to-day business […]
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Fab equipment investment in 2023 is expected to remain strong. Global Fab Equipment Spending Expected to Reach Record $109 Billion in 2022 was posted by Shannon Davis on Semiconductor Digest.
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From neon gas to tool components, the industry is creating more resilient supply chains. The post Ways To Address The Materials Crunch appeared first on Semiconductor Engineering.
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Françoise hit Technology Corner at the IEEE Electronic Components Technology Conference 2022, May 31-June 3, interviewing 3D InCites member companies about being back in person, and their perspectives of some of the key industry challenges such as supply chain issues, sustainability; diversity, equity, and inclusion efforts, new technology advancements, and much more. Tanja Braun, Fraunhofer […]
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In Part 1 of ECTC 2022 coverage, Françoise catches up with some of the industry visionaries at key companies in the microelectronics space, as well as 3D technology research institutes to find out what they shared and learned at ECTC 2022. The episode kicks off with a conversation with Marvell’s Kevin O’Buckley who talked about […]
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Engineers are finding ways to effectively thermally dissipate heat from complex modules. The post Keeping IC Packages Cool appeared first on Semiconductor Engineering.
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The emergence of 2.5D packaging technology for heterogeneous die integration offers significant benefits to system architects. Functional units may be implemented using discrete die – aka “chiplets” – which may be fabricated in different process nodes. The power, performance, and cost for each unit may be optimized separately.… Read More The post Standardization of Chiplet […]
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Challenges involving reliability, integration and chiplet availability will take time to iron out. The post Who Benefits From Chiplets, And When appeared first on Semiconductor Engineering.
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The semiconductor industry is on a rapid growth trajectory, with a goal of becoming a $1 trillion industry by 2030 – that’s only 8 years away! Getting there will require a tremendous amount of innovation, investment, and risk-taking – all characteristics that define an entrepreneur. But what does it really mean to be an entrepreneur […]
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Key executives from leading semiconductor companies, market analysts, economists and policymakers gather today for insights into the latest electronics industry trends, challenges and opportunities in Brussels, Belgium at the annual Industry Strategy Symposium Europe (ISS Europe) 2022. SEMI ISS Europe Opens With Spotlight on Sustainability, Supply Chain Resilience and Talent was posted by Shannon Davis on […]
