Recommended Reads
SEMI Europe’s 3D System Summit Panel: Partnering to Overcome Challenges in 3D Integration
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For this week’s episode, we’re taking you to SEMI Europe’s 3D and System Summit, which took place last month in Dresden Germany. If you didn’t get to attend, you’re in luck, because in this episode, Françoise hands over the microphone to Jan Vardaman, who moderated a panel Panel Discussion titled: Customer-Supplier Partnering to Overcome Challenges […]
KLA’s Dave Thomas Talks about Advanced Plasma Processes for Wafer Level Packaging
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Françoise von Trapp interviews Dave Thomas, of the SPTS Division at KLA, to talk about the evolution of wafer-level packaging, what’s been driving the market to adopt more advanced processes over the past 20 years, and the role KLA and specifically the SPTS division has played in bringing these technologies to commercialization. The specific technology […]
Arizona State University and Applied Materials to Create “Materials-to-Fab” Center – Semiconductor Digest
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More than $270 million in corporate and state investment will help advance Arizona’s semiconductor industry. Arizona State University and Applied Materials to Create “Materials-to-Fab” Center was posted by Shannon Davis on Semiconductor Digest.
The Siemens Digital Industries Software View of AI and its Impact on System Design – SemiWiki
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The impact of AI seems to be everywhere. Products are smarter, doing more of what used to be done by the humans. Complex tasks can be completed quicker and with greater accuracy and failures can now be predicted more reliably and repaired before they even occur. The AI technologies used to make all this happen […]
AI Can’t Design Chips Without People – EE Times
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AI needs human domain expertise to solve chip design challenges. The post AI Can’t Design Chips Without People appeared first on EE Times.
The Password is Hybrid Bonding – Insights from ECTC 2023
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This episode of the 3D InCites podcast is brought to you by our sustaining members. Shout out to our first official sustaining members Lori McDonald of Deca, and Brian Schieman, of IMAPS. Thanks for helping us continue to create great content! At ECTC 2023, which took place earlier this month, the password was hybrid bonding. […]
Leti Innovation Days: Do More With Less – EE Times
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An exclusive EE Times video interview with CEA-Leti CEO Sebastien Dauvé. The post Leti Innovation Days: Do More With Less appeared first on EE Times.
Tom Sonderman of SkyWater Talks about Growing the Semiconductor Workforce
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In this SEMICON West podcast preview episode, Françoise talks with SkyWater’s CEO Tom Sonderman, who will deliver a keynote talk, “Creating a Path to Talent”. addressing the workforce shortage currently facing the semiconductor industry. Semiconductor manufacturing is on a path to becoming a $1Trillion industry somewhere around 2030. New fabs are being constructed all over […]
Optimism Prevailed at CEO Outlook, though Downturn Could Bring Unpredictable Challenges – SemiWiki
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Chances are anyone who attended the CEO Outlook will say it was an engaging, entertaining and enlightening view of the chip design space, though CEO Outlook may be a misnomer as four of the seven panelists had C-Suite titles other than CEO. Regardless, the collective view was optimistic, though caution prevailed as the economic… Read […]
Purdue, TSMC Extend Partnership on Semiconductor Research and Workforce Development – Semiconductor Digest
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Semiconductor contract manufacturer stands as latest industry leader to join university’s global partnerships. Purdue, TSMC Extend Partnership on Semiconductor Research and Workforce Development was posted by Shannon Davis on Semiconductor Digest.
TSMC Doubles Down on Semiconductor Packaging – SemiWiki
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Last week TSMC announced the opening of an advanced backend fab for the expansion of the TSMC 3DFabric System Integration Technology. It’s a significant announcement as the chip packaging arms race with Intel and Samsung is heating up. Fab 6 is TSMC’s first all-in-one advanced packaging and testing fab which is part of the… Read […]
The Next Chip Shortages? – SemiEngineering
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Why geopolitics and technology could drive a new supply and demand imbalance. The post The Next Chip Shortages? appeared first on Semiconductor Engineering.
Member Spotlight: What Happened at ECTC 2023
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The 3D InCites community had 24 of its members who were either presenting, exhibiting, or both. This episode features conversations Françoise had with many of the participating members about the key takeaways they got from the event, as it relates to their company’s technology goals. Rozalia Beica and Venkata Mokkapati, AT&S talk about the important […]
Using Advanced Analytics To Meet ESG Goals – SemiEngineering
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Improving sustainability without impacting yield and throughput. The post Using Advanced Analytics To Meet ESG Goals appeared first on Semiconductor Engineering.
U.S. Department of Commerce Announces CHIPS for America R & D Leaders – Semiconductor Digest
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CHIPS for America was established by historic legislation to bring semiconductor manufacturing back to the U.S. and to solidify the country’s leadership in technology and innovation. U.S. Department of Commerce Announces CHIPS for America R&D Leaders was posted by Shannon Davis on Semiconductor Digest.
Pioneering Engineer in Semiconductor Industry Lisa Su Receives Honorary Doctorate from NTHU – Semiconductor Digest
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Pioneering engineer in the semiconductor industry and the Chair and CEO of Advanced Micro Devices (AMD), Lisa Su was awarded an honorary doctorate by National Tsing Hua University (NTHU) in Taiwan. Pioneering Engineer in Semiconductor Industry Lisa Su Receives Honorary Doctorate from NTHU was posted by Shannon Davis on Semiconductor Digest.
ECTC 2023: Key Takeaways from the Keynote and Panels, Changes and Future Plans
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In this episode, recorded live at ECTC 2023, Françoise interviews some of the key speakers about the hot topics of the week: Quantum computing, the Chips and Science Act, and workforce development. Additionally, she speaks with the winner of the first-ever, IEEE EPS William Chen Distinguished Service Award. The episode concludes with a conversation with […]
SEMI’s Joe Stockunas Talks about Changes for SEMICON West
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We are just about 5 weeks away from the biggest event of the year for the semiconductor industry – SEMICON West, which takes place July 11-13 at the Moscone Center in San Francisco. This annual event is the flagship of SEMI. The days are packed with conference sessions, the show floor showcases the latest and […]
Welcome To EDA 4.0 And The AI-Driven Revolution – SemiEngineering
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The verification challenges that are addressable by ML and the techniques and algorithms that show promise. The post Welcome To EDA 4.0 And The AI-Driven Revolution appeared first on Semiconductor Engineering.
