USA Rare Earth Aims to Break China’s Grip – EE Times
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The company hopes to mine a ridge full of rare-earth elements near El Paso, Texas. The post USA Rare Earth Aims to Break China’s Grip appeared first on EE Times.
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imec’s Cédric Rolin Talks about the Sustainable Semiconductor Technologies and Systems Research Program
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Continuing our focus on sustainable semiconductor manufacturing, in this episode Françoise speaks with Cédric Rolin, project manager at imec, about its Sustainable Semiconductor Technologies & Systems (SSTS) research program. Launched by imec in 2021, the SSTS rallies stakeholders from across the semiconductor industry to help reduce the ecological impact of the IC value chain. In […]
Chiplet Planning Kicks Into High Gear – SemiEngineering
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Issues involving design, manufacturing, packaging, and observability all need to be solved before this approach goes mainstream for many applications. The post Chiplet Planning Kicks Into High Gear appeared first on Semiconductor Engineering.
SEMI Start Up Series Episode 3: The Role of the Venture Capital Companies
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In the first two episodes of this series, we heard from startup finalists who participated in last year’s program about their sustainability solutions, their experience with the program – including making strong industry connections and some securing funding, and advice for startups participating this year. In this third and final episode of the SEMI Startups […]
Challenges Of Packaging 5G And 6G – SemiEngineering
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From package-defined antennas to antenna-defined packages, and lots of tradeoffs in between. The post Challenges Of Packaging 5G And 6G appeared first on Semiconductor Engineering.
Emerging Stronger from the Downturn – SemiWiki
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It was refreshing to hear a talk focused on emerging stronger from the downturn when the news and media are focused on the gloom. At the recent Siemens EDA User2User conference, Joe Sawicki, executive vice president, IC, gave an uplifting keynote talk to the audience. He highlighted a secular growth trend happening in the semiconductor… […]
Save the Date: Gordon Moore Tribute, June 1 – Semiconductor Digest
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An event to commemorate the life, work and legacy of Intel’s co-founder is planned for June 1. Save the Date: Gordon Moore Tribute, June 1 was posted by Shannon Davis on Semiconductor Digest.
From Known Good Die To Known Good System With UCIe IP – SemiEngineering
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Ensuring the reliability of multi-die systems with UCIe test and repair. The post From Known Good Die To Known Good System With UCIe IP appeared first on Semiconductor Engineering.
SEMI MIT Discusses the Electronic Design Market Data Report
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In this fourth episode of the SEMI MIT podcast series, you’ll learn about the semiconductor device design market, the latest SEMI Electronic Design Market Data (EDMD) report, and the Electronic System Design Alliance (ESDA) whose members contribute to it. Speakers include: · Paul Cohen, Senior Program Manager of ESDA · Bob […]
Data Analytics For The Chiplet Era – SemiEngineering
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Silicon lifecycle management and machine learning help predict and optimize device reliability. The post Data Analytics For The Chiplet Era appeared first on Semiconductor Engineering.
When Facing a Severe Shortage of Automotive-grade ICs… EE Times
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Key causes and answers for the semiconductor shortage affecting the automotive industry. The post When Facing a Severe Shortage of Automotive-grade ICs… appeared first on EE Times.
Gartner Forecasts Worldwide Semiconductor Revenue to Decline 11% in 2023 – Semiconductor Digest
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Global semiconductor revenue is projected to decline 11.2% in 2023, according to the latest forecast from Gartner, Inc. In 2022, the market totaled $599.6 billion, which was marginal growth of 0.2% from 2021. Gartner Forecasts Worldwide Semiconductor Revenue to Decline 11% in 2023 was posted by Shannon Davis on Semiconductor Digest.
TSMC 2023 North America Technology Symposium Overview Part 1 – SemiWiki
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The TSMC 2023 North America Technology Symposium happened today so I wanted to start writing about it as there is a lot to cover. I will do summaries and other bloggers will do more in-depth coverage on the technology side in the coming weeks. Having worked in the fabless semiconductor ecosystem the majority of my […]
Andy Mackie Talks About His Decoder Ring for Semiconductor Packaging
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In this episode, recorded at IMAPS DPC 2023, Françoise von Trapp talks with Indium’s Andy Mackie, about his latest mission to address the confusing and complex lexicon of Advanced Packaging technology. He shares the backstory on the idea, he has come up with to change the way we talk about semiconductor device packaging, that will […]
True 3D-IC Problems – SemiEngineering
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Stacking logic requires solving some hidden issues; concerns about thermal dissipation may be the least of them. The post True 3D-IC Problems appeared first on Semiconductor Engineering.
Purdue Convenes CHIPS Summit in D.C. With Sec. Raimondo and Sen. Young – Semiconductor Digest
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Leaders from industry, government and academia convened at a summit Tuesday (April 18) in Washington, D.C. to forge national solutions at scale to address the future of U.S. innovation in microelectronics and the semiconductor workforce. Purdue Convenes CHIPS Summit in D.C. With Sec. Raimondo and Sen. Young was posted by Shannon Davis on Semiconductor Digest.
How Chip Engineers Plan To Use AI – SemiEngineering
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Checks, balances, and unknowns for AI/ML in semiconductor design. The post How Chip Engineers Plan To Use AI appeared first on Semiconductor Engineering.
DEI: It Takes A Village – A Panel Discussion
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At IMAPS DPC, Françoise von Trapp moderated a town hall discussion, DEI: It Takes a Village. The target audience was not HR or hiring managers, but the regular attendees who may be wondering what they can do to help create an atmosphere of equity and inclusion at their workplace. We asked the hard questions that […]
Thermal Integrity Challenges Grow In 2.5D – SemiEngineering
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Work is underway to map heat flows in interposer-based designs, but there’s much more to be done. The post Thermal Integrity Challenges Grow In 2.5D appeared first on Semiconductor Engineering.
Member Spotlight: What We Presented and What We Learned at IMAPS DPC 2023
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In this episode, Françoise von Trapp holds impromptu interviews with 3D InCites members who attended, exhibited, and/or presented at the 2023 IMAPS DPC in March. Topics of discussion include: Using AI in microelectronics manufacturing, how front-end processes are finding their way into the back-end, updates on glass substrates, capillary underfill advancements, dealing with wafer warpage, […]
