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Virtual conferences are already in the rear-view mirror, but I am not convinced that in-person conferences should be continued. The post Are In-Person Conferences Sustainable? appeared first on Semiconductor Engineering.
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At SEMICON West, one of the key areas of discussion was the Path to Net Zero. What can we do to make sure the semiconductor industry grows in a way that is beneficial to the planet and shows cross-industry leadership? Françoise von Trapp talks to SEMI’s Dr. Mousumi Bhat, VP of Global Sustainability Programs, and […]
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A technical paper titled “Chiplet Cloud: Building AI Supercomputers for Serving Large Generative Language Models” was published by researchers at University of Washington and University of Sydney. Abstract: “Large language… » read more The post A Chiplet-Based Supercomputer For Generative LLMs That Optimizes Total Cost of Ownership appeared first on Semiconductor Engineering.
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In this episode, Françoise von Trapp talks with SEMI’s Bettina Weiss, and Bindiya Vakil, of Resilinc about how to navigate the complexities of the semiconductor supply chain. The electronics industry continues to be in a state of flux. After two years of shortages, delays, and skyrocketing costs, the causes of supply chain disruptions keep changing […]
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For this week’s episode, we’re taking you to SEMI Europe’s 3D and System Summit, which took place last month in Dresden Germany. If you didn’t get to attend, you’re in luck, because in this episode, Françoise hands over the microphone to Jan Vardaman, who moderated a panel Panel Discussion titled: Customer-Supplier Partnering to Overcome Challenges […]
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Françoise von Trapp interviews Dave Thomas, of the SPTS Division at KLA, to talk about the evolution of wafer-level packaging, what’s been driving the market to adopt more advanced processes over the past 20 years, and the role KLA and specifically the SPTS division has played in bringing these technologies to commercialization. The specific technology […]
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More than $270 million in corporate and state investment will help advance Arizona’s semiconductor industry. Arizona State University and Applied Materials to Create “Materials-to-Fab” Center was posted by Shannon Davis on Semiconductor Digest.
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The impact of AI seems to be everywhere. Products are smarter, doing more of what used to be done by the humans. Complex tasks can be completed quicker and with greater accuracy and failures can now be predicted more reliably and repaired before they even occur. The AI technologies used to make all this happen […]
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AI needs human domain expertise to solve chip design challenges. The post AI Can’t Design Chips Without People appeared first on EE Times.
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This episode of the 3D InCites podcast is brought to you by our sustaining members. Shout out to our first official sustaining members Lori McDonald of Deca, and Brian Schieman, of IMAPS. Thanks for helping us continue to create great content! At ECTC 2023, which took place earlier this month, the password was hybrid bonding. […]
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An exclusive EE Times video interview with CEA-Leti CEO Sebastien Dauvé. The post Leti Innovation Days: Do More With Less appeared first on EE Times.
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In this SEMICON West podcast preview episode, Françoise talks with SkyWater’s CEO Tom Sonderman, who will deliver a keynote talk, “Creating a Path to Talent”. addressing the workforce shortage currently facing the semiconductor industry. Semiconductor manufacturing is on a path to becoming a $1Trillion industry somewhere around 2030. New fabs are being constructed all over […]
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Chances are anyone who attended the CEO Outlook will say it was an engaging, entertaining and enlightening view of the chip design space, though CEO Outlook may be a misnomer as four of the seven panelists had C-Suite titles other than CEO. Regardless, the collective view was optimistic, though caution prevailed as the economic… Read […]
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Semiconductor contract manufacturer stands as latest industry leader to join university’s global partnerships. Purdue, TSMC Extend Partnership on Semiconductor Research and Workforce Development was posted by Shannon Davis on Semiconductor Digest.
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Last week TSMC announced the opening of an advanced backend fab for the expansion of the TSMC 3DFabric System Integration Technology. It’s a significant announcement as the chip packaging arms race with Intel and Samsung is heating up. Fab 6 is TSMC’s first all-in-one advanced packaging and testing fab which is part of the… Read […]
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Why geopolitics and technology could drive a new supply and demand imbalance. The post The Next Chip Shortages? appeared first on Semiconductor Engineering.
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The 3D InCites community had 24 of its members who were either presenting, exhibiting, or both. This episode features conversations Françoise had with many of the participating members about the key takeaways they got from the event, as it relates to their company’s technology goals. Rozalia Beica and Venkata Mokkapati, AT&S talk about the important […]
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Improving sustainability without impacting yield and throughput. The post Using Advanced Analytics To Meet ESG Goals appeared first on Semiconductor Engineering.
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CHIPS for America was established by historic legislation to bring semiconductor manufacturing back to the U.S. and to solidify the country’s leadership in technology and innovation. U.S. Department of Commerce Announces CHIPS for America R&D Leaders was posted by Shannon Davis on Semiconductor Digest.
