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Momentum is building for organic interposers, 3D stacking, and photonics, but questions remain about how the industry gets there and what kinds of tradeoffs will be necessary. The post What’s Next In Advanced Packaging? appeared first on Semiconductor Engineering.
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TSMC won’t take over Intel’s chip operations despite talks. See how geopolitical tensions shape this possible outcome. The post TSMC Will Not Take Over Intel Operations, Observers Say appeared first on EE Times.
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Send us a text Explore the transformative world of microelectronics packaging with industry visionaries Amy Lujan, Tim Olson, and Jan Vardaman as they share their journey at the IMAPS Annual Device Packaging Conference (DPC). With the conference relocating to the vast Wild Horse Pass, expect an enriched experience with expanded technical tracks and exhibitor opportunities […]
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TSMC, AMD, Intel, and Arm navigate AI boom, economic shifts, and trade war. Insights on growth, revenue, and future outlook. The post Semiconductor Giants Navigate AI Boom & Trade War appeared first on EE Times.
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Finding anomalies and defects faster in complex chip and package topographies. The post Using AI In Semiconductor Inspection appeared first on Semiconductor Engineering.
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Send us a text The episode explores the key insights from the recent SEMI ISS event, focusing on the semiconductor industry’s journey toward a trillion-dollar market by 2030. It discusses the significant themes of uncertainty and the transformative impact of AI, while also addressing industry challenges and emerging trends. Additionally, SEMI’s Market Intelligence team dive […]
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UCIe can enhance AI chiplet connectivity for efficient, scalable data center solutions. The post Why UCIe is Key to Connectivity for Next-Gen AI Chiplets appeared first on EE Times.
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A chiplet supermarket is still years off, but progress is being made on all fronts. The post Advanced Packaging Moving At Breakneck Pace appeared first on Semiconductor Engineering.
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The need for AI compute power will not go anywhere and Nvidia will thrive, says Pat Gelsinger.
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Send us a text In this episode, Francoise von Trapp speaks with Isabella Drolz from Comet about how AI is revolutionizing semiconductor inspection strategies, particularly in 3D X-ray systems. They discuss how AI is being used to find structural defects in advanced chip packages, and also how 3D inspection is being used to develop advanced […]
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Nvidia releases another series of security updates for its GPU drivers. https://www.tomshardware.com/pc-components/gpu-drivers/nvidias-mid-january-gpu-driver-update-addresses-several-vulnerabilities-and-exploits
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Companies poured billions into fabs and facilities around the world as regions continue to build self-sufficiency and form hubs with friendly nations. The post Chip Industry Investments Kept Flowing In 2024 Even As Some Projects Stalled appeared first on Semiconductor Engineering.
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Send us a Text Message. Recorded live at the 2024 Electronic Component Technology Conference, this episode features conversations Francoise von Trapp has with Keynote Speaker Keren Bergman, Columbia University and co-founder of Xscape Photonics, and Chet Lennox, of KLA. Bergman explains the potential of photonics in AI applications to improve energy efficiency and bandwidth. You’ll […]
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As demand shifts for dual-die Blackwell products, Nvidia reportedly increases CoWoS-L orders while possibly reducing orders for CoWoS-S packaging technology.
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CES 2025 was held last week in Las Vegas. We at Semiconductor Intelligence attended for our tenth CES. The event had over 140,000 attendees and over 4,500 exhibitors. U.S. Consumer Electronics Market Brian Comiskey of the Consumer Technology Association (CTA) presented on technology trends in 2025. The key theme was advances… Read More The post […]
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Fab tools are being fine-tuned for through-silicon via processes as demand ramps for everything from HBM to integrated RF, power, and MEMS in 3D packaging. The post What’s Next For TSVs appeared first on Semiconductor Engineering.
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China’s chip overcapacity prompts U.S. investigation as mature-node foundries face new competition. The post Mature-Node Foundries Face Overcapacity from China appeared first on EE Times.
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Send us a text Unlock the secrets of semiconductor packaging materials with insights from industry experts Dariush Tari and Rose Guino of Henkel’s Semiconductor Packaging Materials Division. This episode promises a deep dive into the processes behind developing materials that are both reliable and high-performing, crucial for the ever-evolving demands of AI, machine learning, and […]
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A response to Daniel Nenni’s “What’s Wrong with Intel?” article, which invited alternative views. At the risk of calling down the forecast universal opprobrium, I’m going to disagree with Dan’s take on the centrality of Intel. I don’t agree that Intel is too big/important to fail or that the US can’t succeed in semiconductors without… […]
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Lam’s Dextro cobot aims to optimize wafer fab maintenance, enhancing precision and reducing errors. The post Fab Maintenance Gets a Robotic Helping Hand appeared first on EE Times.
