|
Send us a text Arizona is transforming into the "Silicon Oasis" of America through an unprecedented collaboration that's reshaping semiconductor education from high school through graduate studies. At the heart of this revolution is a groundbreaking partnership between the University of Arizona and Chandler Unified School District, launching the nation's first high school career and […]
|
Explore key edge AI trends from embedded world 2025, including Qualcomm’s acquisition of Edge Impulse. The post Embedded World 2025: Trains, Planes, Automobiles…and Edge AI appeared first on EE Times.
|
Send us a text What happens when AI diagnoses patients better than doctors? Where does artificial intelligence truly stand on the hype cycle? Is all this computational power actually benefiting society? These critical questions frame our fascinating discussion recorded live at IMAPS Device Packaging Conference in Phoenix, Arizona. Join our expert panel featuring Hemanth Jagannathan […]
|
Industry veteran Lip-Bu Tan becomes Intel’s permanent CEO, rejoins the company’s board-of-directors.
|
Using formal for connectivity verification early in the design flow can reduce time to market. The post New Innovative Way To Functionally Verify Heterogeneous 2D/3D Package Connectivity appeared first on Semiconductor Engineering.
|
AI could have a major impact on the silicon supercycle and the future of efficient computing. The post How AI Will Define the Next Silicon Supercycle appeared first on EE Times.
|
Trump tells the Senate President to get rid of the CHIPS Act and use the money allocated for it to reduce debt instead.
|
TSMC invests $100 billion in U.S. for AI chip production, hoping to bolster U.S. semiconductor ecosystem. The post TSMC’s $100 Billion Investment in U.S. Shores Up Top Foundry appeared first on EE Times.
|
An open, plug-and-play chiplet ecosystem still faces significant hurdles in interconnect standardization and packaging. The post Chiplets: A Technology, Not A Market appeared first on Semiconductor Engineering.
|
Apple announced $500 billion in US spending over the next four years as it faces town tariff threats.
|
Semiconductor industry is undergoing a period of dramatic upheaval, marked by the potential breakup of Intel and sale to Broadcom and/or TSMC, the rise of Arm as a chip manufacturer, and increasing geopolitical tensions. It will have far-reaching implications for the global supply chain. The post Semiconductor Industry Faces a Seismic Shift appeared first on […]
|
Momentum is building for organic interposers, 3D stacking, and photonics, but questions remain about how the industry gets there and what kinds of tradeoffs will be necessary. The post What’s Next In Advanced Packaging? appeared first on Semiconductor Engineering.
|
TSMC won’t take over Intel’s chip operations despite talks. See how geopolitical tensions shape this possible outcome. The post TSMC Will Not Take Over Intel Operations, Observers Say appeared first on EE Times.
|
Send us a text Explore the transformative world of microelectronics packaging with industry visionaries Amy Lujan, Tim Olson, and Jan Vardaman as they share their journey at the IMAPS Annual Device Packaging Conference (DPC). With the conference relocating to the vast Wild Horse Pass, expect an enriched experience with expanded technical tracks and exhibitor opportunities […]
|
TSMC, AMD, Intel, and Arm navigate AI boom, economic shifts, and trade war. Insights on growth, revenue, and future outlook. The post Semiconductor Giants Navigate AI Boom & Trade War appeared first on EE Times.
|
Finding anomalies and defects faster in complex chip and package topographies. The post Using AI In Semiconductor Inspection appeared first on Semiconductor Engineering.
|
Send us a text The episode explores the key insights from the recent SEMI ISS event, focusing on the semiconductor industry’s journey toward a trillion-dollar market by 2030. It discusses the significant themes of uncertainty and the transformative impact of AI, while also addressing industry challenges and emerging trends. Additionally, SEMI’s Market Intelligence team dive […]
|
UCIe can enhance AI chiplet connectivity for efficient, scalable data center solutions. The post Why UCIe is Key to Connectivity for Next-Gen AI Chiplets appeared first on EE Times.
|
A chiplet supermarket is still years off, but progress is being made on all fronts. The post Advanced Packaging Moving At Breakneck Pace appeared first on Semiconductor Engineering.
|
The need for AI compute power will not go anywhere and Nvidia will thrive, says Pat Gelsinger.
