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CINDE Promotes Development in Costa Rica at SEMICON West 2024 – Semiconductor Digest

Jul 10, 2024 | Semiconductor Digest

This is Costa Rica’s first time at SEMICON West, for which CINDE has joined SEMI, the leading global microelectronics association for driving business and addressing the industry’s global challenges. CINDE Promotes Development in Costa Rica at SEMICON West 2024 was posted by Shannon Davis on Semiconductor Digest.

How Do You Break Through the Silicon Ceiling? A Conversation with Christine King

Jul 05, 2024 | 3D InCites Podcast

Send us a Text Message. In this episode, Françoise von Trapp speaks with Christine King, the world’s first woman CEO of a semiconductor company, about her journey from near destitution to success in a male-dominated industry. Christine recently published a memoir about her journey, called Breaking Through the Silicon Ceiling, which details her journey and […]

The Saxony Story: How to Develop a Global Semiconductor Cluster

Jul 01, 2024 | 3D InCites Podcast

Send us a Text Message. Saxony, Germany, has a strong potential to become a global semiconductor location due to its long history in traditional industries, technological base, vast talent pool, strategic location, and investment in education and new talent. In this episode, Françoise von Trapp speaks with Andreas Lippert, of Saxony Trade and Invest, and  […]

Highlights and Aha! Moments of ECTC 2024: A Recap with Karlheinz Bock and Michael Mayer

Jun 21, 2024 | 3D InCites Podcast

Send us a Text Message. Françoise von Trapp talks with ECTC 2024 General Chair, Karlheinz Bock and Program Chair, Michael Mayer about highlights and key takeaways from the 2024 IEEE Electronic Component Technology Conference. (ECTC 2024). Bock and Mayer discussed the growth of ECTC 2024, and how focusing on strategic decisions such as changing the […]

Community Members Share Insights from ECTC 2024

Jun 14, 2024 | 3D InCites Podcast

Send us a Text Message. This episode features conversations at ECTC 2024 with 11 of 3D InCites community members. You’ll learn about their perspectives on the hottest topics of the times such as thermal management and power issues for AI devices, and glass core substrates versus organic substrates. You’ll also learn about their latest technology […]

ECTC 2024: Can Photonics Solve the AI Energy Problem? Why is Process Control so Critical to Advanced Packaging?

Jun 07, 2024 | 3D InCites Podcast

Send us a Text Message. Recorded live at the 2024 Electronic Component Technology Conference, this episode features conversations Francoise von Trapp has with Keynote Speaker Keren Bergman, Columbia University and co-founder of Xscape Photonics,  and Chet Lennox, of KLA. Bergman explains the potential of photonics in AI applications to improve energy efficiency and bandwidth.  You’ll […]

SEMI America’s Joe Stockunas Talks About SEMICON West Past, Present and Future

May 31, 2024 | 3D InCites Podcast

In this preview episode for SEMICON West 2024, Françoise von Trapp and SEMI America’s President Joe Stockunas talk about SEMICON West’s Past, Present, and Future. The discussion emphasizes the need for collaboration in the semiconductor industry and the important role SEMI plays in supporting the interests of its global members. Joe updates listeners on semiconductor […]

The Race To Glass Substrates – SemiEngineering

May 29, 2024 | SemiEngineering

Replacing silicon and organic substrates requires huge shifts in manufacturing, creating challenges that will take years to iron out. The post The Race To Glass Substrates appeared first on Semiconductor Engineering.

Mastering Copper TSV Fill Part 2 of 3 – SemiWiki

May 29, 2024 | SemiWiki.com

Establishing void-free fill of high aspect ratio TSVs, capped by a thin and uniform bulk layer optimized for removal by CMP, means fully optimizing each of a series of critical phases. As we will see in this 3-part series, the conditions governing outcomes for each phase vary greatly, and the complexity of interacting factors means… […]

LPKF Laser & Electronic’s Richard Noack Explains the Growing Importance of Glass Substrates for HPC and Chiplet Advanced Packaging

May 23, 2024 | 3D InCites Podcast

Glass has long been explored as an alternative substrate material to organic laminates and silicon. As high-performance computing and chiplets HPC push the boundaries of existing technology, they are demanding innovative packaging solutions, beginning with innovative substrate materials.  This is paving the way for glass. In this episode, Françoise von Trapp and Richard Noack discuss […]