Nvidia, AMD Ramp at TSMC Arizona as U.S. Tariffs Loom – EE Times
|
Nvidia, AMD begin chip production at TSMC Arizona amid looming U.S. tariffs. The post Nvidia, AMD Ramp at TSMC Arizona as U.S. Tariffs Loom appeared first on EE Times.
|
Nvidia, AMD begin chip production at TSMC Arizona amid looming U.S. tariffs. The post Nvidia, AMD Ramp at TSMC Arizona as U.S. Tariffs Loom appeared first on EE Times.
|
The economics are not yet clear for industrial or consumer electronics. The post Can Chiplets Serve Cost-Conscious Apps? appeared first on Semiconductor Engineering.
|
Send us a text The 3D InCites Podcast celebrates microelectronics industry innovation with a special episode featuring this year’s award winners in heterogeneous integration and chiplet technology. • SallyAnn Henry, Jim Straus and David Wang, ACM Research, describe a horizontal rotation plating system for panel-level packaging with superior uniformity across square substrates • Eric Gongora, […]
|
Co-packaged optics and silicon photonics reach an inflection point at this year’s OFC 2025. The post Silicon Photonics and Co-Packaged Optics Shine a Light at OFC 2025 appeared first on EE Times.
|
Trump tariffs, now 54% on Chinese goods, threaten to raise electronics prices. Complex supply chains face disruption, despite some exemptions. The post Trump Tariffs Unleash Shift in Global Economy appeared first on EE Times.
|
In response to Trump’s tariffs, China retaliates, including levies and barring American companies and restricting export of minerals. The post China Retaliates Against Trump Tariffs appeared first on EE Times.
|
Tariffs on imported automobiles and auto parts are triggering significant volatility into the automotive industry The post Auto Tariffs Send Ripples Across Supply Chains appeared first on EE Times.
|
What makes advanced packaging so attractive to some companies, but not others. The post Benefits And Challenges In Multi-Die Assemblies appeared first on Semiconductor Engineering.
|
Send us a text The 3D InCites Member Spotlight episode features exclusive conversations with industry leaders at IMAPS Device Packaging Conference 2025, exploring the cutting-edge of semiconductor packaging innovation and domestic manufacturing expansion. • Rex Anderson of Micross details their RESHAPE program funding and Integra acquisition, establishing them as North America’s largest domestic OSAT • […]
|
After a slow, five-year build of its first U.S. fab due to labor and logistical hurdles, TSMC now plans to construct future U.S. facilities in two years, but can its timely access to chipmaking equipment remains an uncertainty.
|
Semiconductor verification is changing to integrate AI with human expertise. The post The Evolving Role Of AI In Verification appeared first on Semiconductor Engineering.
|
Discover Jensen Huang’s take on AI, geopolitics and Nvidia’s evolution beyond a chip company. The post Nine Interesting Thoughts From Jensen Huang appeared first on EE Times.
|
Send us a text Arizona is transforming into the “Silicon Oasis” of America through an unprecedented collaboration that’s reshaping semiconductor education from high school through graduate studies. At the heart of this revolution is a groundbreaking partnership between the University of Arizona and Chandler Unified School District, launching the nation’s first high school career and […]
|
Explore key edge AI trends from embedded world 2025, including Qualcomm’s acquisition of Edge Impulse. The post Embedded World 2025: Trains, Planes, Automobiles…and Edge AI appeared first on EE Times.
|
Send us a text What happens when AI diagnoses patients better than doctors? Where does artificial intelligence truly stand on the hype cycle? Is all this computational power actually benefiting society? These critical questions frame our fascinating discussion recorded live at IMAPS Device Packaging Conference in Phoenix, Arizona. Join our expert panel featuring Hemanth Jagannathan […]
|
Industry veteran Lip-Bu Tan becomes Intel’s permanent CEO, rejoins the company’s board-of-directors.
|
Using formal for connectivity verification early in the design flow can reduce time to market. The post New Innovative Way To Functionally Verify Heterogeneous 2D/3D Package Connectivity appeared first on Semiconductor Engineering.
|
AI could have a major impact on the silicon supercycle and the future of efficient computing. The post How AI Will Define the Next Silicon Supercycle appeared first on EE Times.
|
Trump tells the Senate President to get rid of the CHIPS Act and use the money allocated for it to reduce debt instead.
|
TSMC invests $100 billion in U.S. for AI chip production, hoping to bolster U.S. semiconductor ecosystem. The post TSMC’s $100 Billion Investment in U.S. Shores Up Top Foundry appeared first on EE Times.