Francoise von Trapp (aka the Queen of 3D) has been following and reporting on the progress of 3D integration technologies since 2009. Francoise in 3D provides a high-level perspective of 3D industry events, offers executive viewpoints, and focuses on process and manufacturing aspects of 3D integration.
Making Connections at SEMICON Europa 2024
Let’s be honest. When we get home from a trade show like SEMICON Europa 2024, it’s not all the presentations that we remember. It’s the connections we’ve made – new and old – with industry colleagues around the globe that stand out. You can go to any SEMICON Event around...
Picking up the Pace of Panel-level Advanced Packaging at Onto Innovation
How A Collaborative Partnership Is Accelerating PLP Innovation Panel-level advanced packaging technologies have been in development for more than a decade. They began as a way to reduce costs and improve yields for fan-out wafer level applications. Smartphone applications – particularly fingerprint sensors – promised the volumes that would make...
Leaning Into Interconnectology – Musings from IMAPS Symposium 2024
Call me crazy, but after spending three days at the 2024 International Microelectronics and Packaging Society (IMAPS) Symposium in Boston learning about the latest industry trends and technology advancements, I think it’s time for the entire advanced packaging world to fully adopt the concepts of “Interconnectology” and “Interconnectologist”. The inspiration...
ASU’s SWAP Hub and National Collaborations Shape U.S. Microelectronics Leadership
In August of 2023, I attended the inaugural meeting of the Southwest Advanced Prototyping (SWAP) Hub, spearheaded by the Ira Fulton School of Engineering at Arizona State University (ASU). At the time, the organization had just submitted its proposal to the Microelectronics Commons, a national initiative funded through the CHIPS...
Witnessing Foundry 2.0 in Action
One of the ways I learn about advanced packaging technology and what it entails is by visiting our community member companies. There’s nothing like talking to the experts face-to-face and walking through a cleanroom or advanced packaging applications lab to drive home a concept. For the past year, I’ve been...
SEMICON West 2024: Riding the Generative AI Winds of Change
Deepak Chopra said, “All great changes are preceded by chaos.” Here’s my Aha! moment from SEMICON West 2024: After great chaos precipitated by the pandemic, geopolitical tensions, the climate crisis, and the talent shortage, one singular driver is driving unprecedented change: Generative AI. Generative AI was referenced in almost every...
ECTC 2024: Advanced Packaging Engineers to the Rescue!
If you were one of the almost 2000 attendees at ECTC 2024, held May 28-31 2024, in Denver, Co, then you must be feeling very important right now; especially if you’re an advanced packaging engineer. Whether you’re improving energy efficiency, increasing yield, delivering innovative process control solutions, designing next-generation advanced...
The Nexus of Innovation for U.S. Semiconductor Manufacturing
Will Arizona be the nexus of innovation for U.S. semiconductor manufacturing? It certainly looks that way. The speakers and panelists who presented at SEMI’s Arizona Breakfast Forum on May 1, confirmed what those of us who live and work here already know: The sun isn’t the only thing heating up...
IMAPS DPC 2024 Makes Advanced Packaging Fun Again!
At last week’s International Microelectronics and Packaging Society’s Device Packaging Conference, (IMAPS DPC 2024) we didn’t need TrendForce to tell us that advanced packaging is the hottest technology in the semiconductor industry. We just needed to look at the record attendance of more than 700 advanced packaging enthusiasts who turned...
ISS Europe 2024: Succeeding in an Evolving Global Semiconductor Landscape
When I interview members for the 3D InCites Podcast at industry events, I often ask them, “What did you come here to learn?” As this is my first time at ISS Europe, I asked myself that question. Here’s what I came up with. I attended ISS Europe 2024 to learn...
