The 31st Annual Electronics Packaging Symposium (EPS)– Small Systems Integration, will take place September 5–6, 2019 at GE Research in Niskayuna, NY.
This year’s symposium, hosted by GE Research, IEEE EPS, and Integrated Electronics Engineering Center at Binghamton University, offers a 2-day program that includes 12 technical sessions highlighting the electronic packaging topics of:
- 2.5/3D Packaging
- mm-Wave in Packaging
- Automotive & Harsh Environments
- Bioelectronics
- Flexible & Additive Electronics
- Materials for Packaging & Energy Storage
- MEMS
- Photonics
- Power Electronics
- Sensors, Embedded Electronics & IoT
- Thermal Challenges
- Wearable and Flexible Electronics for Medical Applications
The program will include student poster sessions from local Universities, exhibits from leading companies, and opportunities for networking, learning, sharing technical knowledge, and promoting collaborative partnerships.
Concurrent sessions will run throughout the two days, with a half-day CPMT/IEEE workshop offered on the second day, September 6, all of which are options for the attendee to choose on the basis on interest.
Last year’s symposium was successfully held at Binghamton University with 380+ attendees, 52 invited speakers, 12 technical sessions, 54 student posters, and 53 exhibitors.
Registration is open with last day to register on August 26, 2019, at 5 PM.
