The Advanced Packaging Conference (APC) “Interconnects in Miniaturized Systems” will be held in conjunction with SEMICON Europa on 6-8 October 2015 in Dresden, Germany.
In a wide range of applications from consumer to automotive and power products, lighting, sensors and photonics, system integration in the “More-than-Moore” domain is driving advanced packaging towards further miniaturization and performance enhancement. The package with its electrical, thermal and mechanical properties becomes important part of the system functionality. What did not change by this development is the utmost importance of interconnects as the main feature of semiconductor packages.
Systems have different levels of interconnects, often impacting each other. Functionality and reliability requirements of different markets and applications, but also the heterogeneous integration of different interconnect technologies in the same package and system, determine the selection of the right interconnects and the need for further developments. The advanced packaging community is continually presented with a number of challenges that need to be addressed, in order to cost effectively realize interconnects required by miniaturized systems.
This conference will focus on the innovations and developments of the European and Global Semiconductor manufacturing industry that are aimed at developing and improving electrical, thermal and mechanical interconnects of all kinds in a packages and/ or systems for a wide range of applications. The aspects under review also cover interfaces, thermal management and heat dissipation. The presentations will shed light on latest interconnect technologies, design, materials, equipments and processes which can be leveraged as key enablers for cost efficient volume manufacturing.
For more details visit the SEMICON Europa Website
