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Featuring guest speakers from local fabs, the Rudolph Yield Forum™ provides process engineers, fab managers and tool owners with new application data and process control techniques that address current process challenges. Experts will speak to current trends and applications for macro defect inspection, 3DIC inspection and metrology, thin film metrology, advanced packaging lithography, yield management and process control techniques.
Agenda Highlights
Wafer Processing (Front-end) Session
- Bulk Acoustic Metrology and Defect Inspection for Metal Structures
- TSV Middle Inspection and Metrology
- Fleet Management: Optimizing your Rudolph Inspection Systems
- Intro to SEM ADC
- Supply Chain Value
- Bare Wafer Inspection
- Metrology Challenges and Techniques for Gate Oxide Control at 1x and 2x Nodes
- MEOL Lithography
Final Manufacturing (Back-end) Session
- Monitoring Process Tool Particles & Edge Trip Defects using Darkfield Laser Scattering Technology
- TSV and Cu Pillar Bump Process Control Metrology
- Lithography Challenges for 2.5D Interposers and Related Processes
- 3D Measurement for TSV, MEOL, RST and Temporary Bonding
- Fleet Management: Optimizing your Rudolph Inspection Systems
- OSAT 2.5D/3D Model for Transparent and Metal Film Metrology
- Closed Loop Total Solution for Advanced Packaging Lithography
- Trends in Cu Pillar Bump Metrology and Yield Improvement Strategies
- A Comprehensive Solution for Post-saw Delamination including Reduced Review
*Agenda subject to change. Check Rudolph Technologies website for updated agenda.
For More Information:
Contact: Winn Soo, Rudolph Singapore
Email: winn.soo@rudolphtech.com
Tel: +65 (6) 749 6988
