The International Microelectronics Assembly and Packaging Society (IMAPS) and IPC will host a three-day Workshop to discuss and promote strategies to improve On-Shoring Advanced Packaging and Assembly, April 29 – May 1, 2024, at The Westin Arlington, Arlington, VA. This workshop will bring Government agencies, the DIB (Defense Industrial Base), and Advanced Packaging and Assembly providers together to discuss their efforts to onshore advanced packaging. The mission of this workshop is to engage our workforce community to identify the newly created Advanced Packaging programs that address US Government and Defense requirements critical to the onshoring of the microelectronic assembly and packaging supply chain. Government agencies including the Department of Commerce/NIST, DoD (SHIP/IBAS/Title III/Printed Circuit Board Executive Agent), DARPA, and SRC will be briefed on their advanced packaging programs.
The workshop will feature two days of focused sessions, keynote presentations, a panel discussion, and a variety of networking opportunities. The event will kick off on Monday with a pre-program day filled with 2-hour professional development courses and/or additional working groups addressing a variety of topics relevant to the onshoring of advanced packaging. The 2024 Workshop will also feature networking opportunities with sponsors and tabletop exhibitors.
Workshop registration restricted to U.S. Passport Holders Only
