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The 57th International Symposium on Microelectronics (IMAPS Symposium 2024) is organized by the International Microelectronics Assembly and Packaging Society and held in Boston, Massachusetts, at the Encore Boston Harbor, from September 30th to October 3.
This year’s event features Professional Development Courses, followed by three days of technical sessions with emphasis on Design, Modeling and Manufacturing; Fanout, RDL, WLP / PLP; High Performance / High Reliability; Advanced Package (Flip Chip, 2.5D, 3D, Optical); Advanced Process & Materials (Enabling Technology).
IMAPS Symposium 2024 highlights include 6 keynote talks:
- George Orji, Deputy Director – National Advanced Packaging Manufacturing Program (NAPMP)
- Ted Jones, Sr. Director Defense & Aerospace Services – Qorvo
- Nick Harris, CEO and Co-Founder – Lightmatter
- Li-San Chan, Global Head, Business Line Semiconductor Materials – Heraeus Electronics
- Dr. Bum Ki Moon, Technology Advisor and Dr. Min Woo Rhee, VP of Technology – Mechatronic Research – Samsung Electronics
- Andreas Olofsson, CEO, Zero ASICS
Student Activities Include:
- IMAPS Microelectronics Foundation ~ Student Paper Award
- IMAPS 2024 Student Design Competition
- 3D InCites Community Career Fair
Additionally, the IMAPS Symposium 2o24 features a sold-out exhibit hall and many opportunities for networking with your industry peers.
