The 51st International Symposium on Microelectronics, organized by the International Microelectronics Assembly and Packaging Society (IMAPS) will be held at the Pasadena Convention Center in Pasadena CA, October 8-ll, 2018.
As in past years, the first day will feature full-day professional development courses. A microelectronics/packaging industry tour at Jet Propulsion Laboratories will also be an option on Monday, October 8, from 1-3:30 ppm. Details will be available soon.
The conference and exhibition kicks off bright and early Tuesday, October 9 and concludes Thursday afternoon, October 11.
IMAPS has rolled out a new technical program organized to help attendees find their key interests faster. It features 5 leading tracks with topics focused on the major package platforms including wafer level, flip chip, 2D/3D, SiP, as well as the traditional focus areas of reliability, advanced materials, and processes.
This year’s event will feature keynotes on heterogeneous integration from the foundry perspective (Dave McCann, GLOBALFOUNDRIES); how to accelerate the digital transformation (Nan Wang, Cisco Systems); hardware for artificial intelligence (AI Rama Divakaruni, IBM) and a talk by ASE’s Tien Wu ((title TBD).
The highlight of the event promises to be a panel discussion and reception moderated by Jan Vardaman, TechSearch International Inc. Panelists will unravel the confusion surrounding artificial intelligence (AI) and its impact on computing, communications, and automotive applications. Appetizers and drinks will be served.
The full program and registration are available. Book your hotel by September 12!
