The 14th Annual Device Packaging Conference (DPC 2018) will be held in Fountain Hills, Arizona, on March 5-8, 2018. It is an international event organized by the International Microelectronics Assembly and Packaging Society (IMAPS).
The conference is a major forum for the exchange of knowledge and provides numerous technical, social and networking opportunities for meeting leading experts in these fields. The conference will attract a diverse group of people within industry and academia. It provides a chance for educational interactions across many different functional groups and experience levels. People who will benefit from this conference include scientists, process engineers, product engineers, manufacturing engineers, professors, students, business managers, and sales & marketing professional
Featuring 3 Topical Workshop Tracks:
- Interposers & 3D IC & Packaging
- Flip Chip, Wafer Level Packaging & Fan-Out; and
- Engineered Micro Systems/Devices (including MEMS, Sensors & 3D Printing)
For the first time this year, IMAPS International will co-host the 2018 3D InCites Awards, the semiconductor industry’s most prestigious award program recognizing contributions for the development of heterogeneous integration technologies. Nominations for the 2018 3D InCites Awards open Monday, January 8, 2018, and will be accepted until Monday, February 12, 2018. Online voting begins Wednesday, February 14, 2018, and closes Wednesday, 28 February 2018. Winners will be announced Wednesday, March 7, 2018, during an awards ceremony and cocktail reception at the 2018 IMAPS Device Packaging Conference, immediately following the Interactive Poster Session.
More details about IMAPS DPC 2018 and registration are here.
