The 18th Annual Device Packaging Conference (DPC 2022) will be held at the WeKoPa Resort and Conference Center, from March 7-10, 2022. It is an international event organized by the International Microelectronics Assembly and Packaging Society (IMAPS).
The conference is a major forum for the exchange of knowledge and provides numerous technical, social and networking opportunities for meeting leading experts in these fields. The conference will attract a diverse group of people within industry and academia. It provides a chance for educational interactions across many different functional groups and experience levels. People who will benefit from this conference include: scientists, process engineers, product engineers, manufacturing engineers, professors, students, business managers, and sales & marketing professionals.
The largest 2022 conference dedicated to:
Heterogeneous 2D & 3D Integration
Fan-Out, Wafer Level Packaging & Flip Chip
Automotive, 5G, and Next Gen Applications
♦ Visit www.imaps.org/devicepackaging for full event details. ♦
Location: WE-KO-PA RESORT & CONFERENCE CENTER, 10438 WEKOPA WAY, FORT MCDOWELL, AZ , AZ 85264
