As the world’s leading semiconductor companies continue to push the limits of process technology, the industry is experiencing a marked shift in device design and architectures to overcome the performance, economic, and time-to-market expectations faced by advanced semiconductor solution providers. CHIPcon is a conference focused on the opportunities for the expanded adoption of chiplet-based devices in data center applications, automotive, industrial, enterprise, and consumer/client markets.
The conference will examine the technical and commercial challenges faced, and what’s being done to overcome these to support the development of a vibrant and viable design and manufacturing ecosystem. The conference will present and examine a range of applications, user experiences, and the advanced design (DFx), simulation, packaging, test, and metrology technologies supporting this effort.
The IMAPS CHIPcon conference will be held July 7-10, 2025, at the San Jose Marriott in San Jose, California, and will focus exclusively on the innovative device integration approaches, technology developments, solutions, and business trends enabling the continued advancement in semiconductor device performance. CHIPcon 2025 will offer cutting-edge presentations from scientists, technologists and business leaders across the globe with expertise in high performance computing, networking, automotive, cellular, and mobile market segments.
The conference will explore the current state of the art in design, simulation, packaging, test, process, and material technologies supporting the integration and delivery of a complete semiconductor system or subsystem solution. Attendees will be exposed to thought-provoking advanced device and package structures with high functioning system performance, mechanical reliability, thermal management and high yield manufacturability.
CHIPcon 2025 speaker opportunities are by invitation-only from the technical committee. Learn more about the event: https://imaps.org/page/CHIPcon-2025
