The 46th International Symposium of Microelectronics will take place this fall in Orlando, FL. This year’s program features and abundance of 2.5D/and 3D IC related discussions.
Wednesday’s lunchtime keynote will be delivered by David McCann VP of Packaging at GLOBALFOUNDRIES, who will report on the progress of development of an open supply chain to enable the 2.5D and 3D IC market. (GF has been promoting this concept for several years now, and most recently we heard about it from Ajit Minocha, during his SEMICON West Keynote.)
Thursday morning, the last day of the event, will be devoted specifically to addressing 2.5D and 3D ICs in keynotes given by Micron, CNSE, and TEL NEXX.
Micron’s Scott Graham will kick things off with a keynote on the Hybrid Memory Cube (HMC) and how its setting a new standard for memory performance. He will provide and analysis of the HMC concept, exploring how the DRAM functions are re-architected to deliver a scalable, energy efficient system architecture, delivering extremely high performance and resiliency. The presentation will also address how innovative and disruptive solutions such as HMC require equally innovative tools, ecosystems and go-to-market strategies.
CNSE’s Douglas Coolbaugh will provide an overview of critical 3D integration challenges, focusing on three areas that need improvement and cost reduction in order to bring 3D integration into the mainstream including thin wafer handling, permanent bonding, and the role of the outsourced assembly and test service (OSATS) providers.
Lastly, TEL NEXX’s Tom Walsh will present an example of how one tool manufacturer has addressed the challenges of 3D IC implementation. he will share two approaches used at TEL NEXX to identify and test proposed 3DIC solutions. The first method involves transparent collaboration with supplers to speed up development lifecycles and minimize scale-up costs. the second is to explore alternative solutions outside of the traditional unit process flows in search of disruptive technologies.
The morning will conclude with a panel discussion moderated ITRI’s John Lau, on the topic: What are preventing 3D IC integrations from High Volume Manufacturing?. Panelists include: Klaus-Dieter Lang, Director of Fraunhofer IZM, Berlin; Matt Nowak, Senior Director of Engineering in the VLSI Technology Group. Qualcomm; Scott Graham, General Manager, HMC Technology, Micron; Rajen Chanchani, Consultant; and Rich Rice, Sr. VP of Sales, ASE. Each panelist will present in their area of specialty, and conclude with Q&A.
Additionally, this year’s conference will feature five 3D sessions, in addition to a panel moderated by John Lau will discuss the roadblocks preventing 3D IC integration from high volume manufacturing.
To learn more, visit the IMAPS 2013 website.
