The Image Sensors conference attracts a wide range of companies from across the digital imaging supply chain. From end users in all the main applications to camera system suppliers, sensor design houses and technology developers, optics suppliers, chip foundries, as well as testing, calibration and other peripheral services. This event focuses on technical aspects of image sensors, placing the innovations and technology in a business context. The Image Sensors Americas agenda will build upon 8 years of experience bringing the leading figures in the image sensors world to our London conference in March.
Of particular interest to 3D InCites readers is the afternoon session on Wednesday, September 10.
3D Stacked Chip Sensors – Is There Any Going Back From Here?
Stacked Chip Technology – Overview of Approaches to Chip Design, Piet De Moor, Project Leader, Image Sensors, IMEC, Belgium
- Advantages of 3D stacked chip architectures
- Review of published innovations and academic research
Future Challenges in 3D chip Architectures, Paul Enquist, CTO / VP R&D, Ziptronix, US
- Anticipated trends in 3D integration for CMOS sensors
- Manufacturing challenges and solutions
The full agenda for IS Americas 2014 is here 3D InCites members are elible for a 10% discount on registration. Use the discount code “3DINCITES10”.
