Enabling Hybrid Bonding Commercialization
Hybrid Bonding has emerged as the technology of choice in the semiconductor industry for ultra-fine-pitch interconnection. With significant benefits for interconnect density and device performance, it will become widely adopted for a broad range of high-performance semiconductor devices in the years to come. The success of Hybrid Bonding technology for high-volume manufacturing depends critically on the process technology as well as materials and equipment. Design, performance characterization, thermal management and reliability are also important considerations to enable applications in various areas.
When: January 16-17, 2025
Where: SEMI International, Silicon Valley, CA USA
The Hybrid Bonding Symposium 2025 will be a hybrid event, with both in-person and virtual participation via WebEx.
The Call for Presentations is now open. Learn more
