The recently organized Fab Owners Association Packaging and Test Group (FOPT) has been asked to add a collaborative project addressing stacked die (2.5D and 3D assemblies) as one of it’s projects. This will be discussed in our Feb 4 meeting in Santa Clara.
NOTE: The FOA PT is members-only, so anyone interested in attending will need to submit an application before the meeting.
FOA PT is part of the larger FOA that consists of 26 Fab Owners who collectively own and manage over 60 wafer fabs internationally, and over 70 Associate Members, who are suppliers to the wafer fabs. The organization is actively recruiting new members to join the FOA PT. For information on joining the group and attending the Q1 Collaborative Forum, please email Phil Marcoux
