ESPAT is the Industry Interest Group (IIG) for European Semiconductor Packaging, Assembly and Test manufacturing service providers. Organized in 2013 by the SEMI Europe Advanced Packaging Conference committee, it was formally established at SEMICON Europa in October, 2014. The first organization of its kind, ESPAT brings together European players in the assembly, test and packaging segment of the semiconductor supply chain to foster co-operation, collaboration, networking, and lobby work at European level membership. Member companies include European OSATs, Packaging Foundries, Test Houses, IDM with packaging and test operation in Europe, and Equipment Supplier also offering packaging, assembly and test for prototypes or small series manufacturing in their application labs.
Join us for the next ESPAT Meeting, June 19, 2015, held in conjunction with the Semi Packaging Technology Seminar. The focus of the meeting will be to define objectives and establish a work plan. ESPAT’s role,and the importance and opportunities for an industry consortium will be discussed. Yann Guillou, SEMI Europe, will present on the topic, SEMI SIG ESPAT – Readiness to convert Industry Interest Group into Special Interest Group under SEMI umbrella?
Visit the ESPAT Website for the full agenda and instructions on registering for the event.
