The Electronic Components and Technology Conference (ECTC) is the premier international event that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange. ECTC is sponsored by the Components, Packaging and Manufacturing Technology (CPMT) Society of the IEEE. The 2015 ECTC will be held at the Sheraton San Diego Hotel & Marina, San Diego, California, USA, May 26-29, 2015.
The preliminary technical program for ECTC 2015 is online and ready for browsing. There are 11 sessions devoted to 3D technologies and processes scattered throughout the main topic areas. They are:
- Session 2: 3D Technology: TSV Fabrication and Reliability
- Session 6: 3D Technology: High-Speed Components and Modeling
- Session 7: Interposer Technology
- Session 8: 3D Technology: TSV Bonding Process Development and Characterization
- Session 13: 3D Integration, TSV, and Reliability
- Session 15: 3D Technology: Materials and Reliability
- Session 19: 3D Technology: Thermal and Performance Reliability
- Session 21: 3D Materials and Processing
- Session 24: Advanced Modeling in Solder Joints, TSVs, and Copper Wire Bonding
- Session 27: 3D Technology: Thermal Materials and Modeling
- Session 33: 3D Technology: Latest Innovations
Final Author Deadlines and Information:
If your paper has been accepted and you are in the process of writing the final draft, please remember:
- Final manuscripts of the technical papers are due on February 25, 2015.
- The first 100 abstracts submitted are eligible for a drawing to win a free registration to attend ECTC 2015 in San Diego, CA.
- Questions? Please contact Henning Braunisch.
Registration is now open!
Online registration for ECTC 2015 is now open on the ECTC website. Advance registration will end on May 8, 2015, so be sure to register soon!
