IEEE is set to host the 74th annual Electronic Components and Technology Conference (ECTC 2024) from May 28 to 31 at the Gaylord Resort and Conference Center in Denver, Colorado. ECTC provides a unique opportunity to bring together leaders in packaging and microelectronics, fostering innovation in the fields of science, technology, and education.
The technical program features papers that explore cutting-edge advancements and innovative developments across the entire packaging industry. Covering areas such as advanced packaging, modeling and simulation, photonics, interconnections, materials and processing, applied reliability, assembly and manufacturing technology, components, RF, and emerging technologies, the program employs both poster and presentation formats. Special papers presented at ECTC have the chance to receive prestigious recognitions, including the Intel Best Student Paper Award, as well as awards for the best and outstanding papers.
The Panel, Plenary, Special Sessions, and EPS Seminar offer conference participants the opportunity to gain insights and perspectives from technical and business leaders. Morning courses, addressing topics like “Eliminating Failure Mechanisms in Advanced Packages” and “Polymers for Advanced Packaging,” commence at 8 a.m., while afternoon classes, including “Additive Flexible Hybrid Electronics – Manufacturing and Reliability” and “Nano Materials and Polymer Composites for Electronic Packaging,” begin at 1:30 p.m. and conclude at 5:30 p.m.
For registration and more information go to:
https://www.ectc.net/registration/index.cfm
