The Advanced Packaging Forum is hosted by Onto Innovation
Jul 31, 2024, from 12:00 pm to 6:00 pm at the Sheraton Hsinchu Hotel in Hsinchu, Taiwan
Advanced Packaging and heterogeneous integration technologies have seen increased adoption, driven by the rapidly growing demand for advanced applications like artificial intelligence (AI) and high-performance computing (HPC). Integration at both the wafer level and panel level has been adopted to achieve optimal power, performance, area, and cost for these applications. This Advanced Packaging Forum will highlight a few of the challenges in 2.5D/3D packaging as well as those associated with the production of advanced IC substrates as manufacturers target finer feature sizes and prepare for the transition from organic to glass core material. Innovative solutions in metrology, inspection, panel lithography, and yield management software will be presented. This forum will offer fab managers, process engineers, and tool owners the opportunity to learn, discuss, and share practical knowledge about process control technology specific to packaging for high-performance applications.
This event is free of charge but registration is required to secure your spot.
