Artificial intelligence continues to make headlines globally, with the new challengers causing tumbling stock market values and producing wild claims regarding learning efficiency. With the technology arms race relying on ever-more advanced chips, how can we integrating AI into manufacturing produce the very chips that power these technologies?
One example poised to make a significant impact on the production line is Digital Twin technology. By utilizing real-time data, machine learning, and trained reasoning to aid decision-making, the next generation of virtual machines will help manufacturers optimize processes on the go, allocate resources more efficiently, and adapt to new product introductions even faster. AI is also being integrated at the end of the production line, enhancing defect detection by combining with technologies such as 3D X-ray to predict and prevent production issues before they arise.
Join us for a 3D InCites Webinar, sponsored by Comet Yxlon and Dragonfly, and moderated by Françoise von Trapp, to explore how integrating AI is revolutionizing semiconductor manufacturing, with an emphasis on the importance of advanced packaging processes to enhance chip performance and reliability.
We are thrilled to host guest speakers, Isabella Drolz from Comet, Chan Pin Chong from Kulicke & Soffa, and John Bhenke from Inficon for an enlightening discussion on how this transformative technology will reshape the industry. They will share insights on digital twins for capital equipment, adapting to Industry 4.0, and integrating AI into defect-detection in semiconductor advanced packaging.
Meet the Speakers
Isabella Drolz, Comet Yxlon
Isabella Drolz serves as the Vice President of Marketing & Product Strategy at Comet AG’s X-ray Systems Division. The division develops advanced X-ray/CT systems and AI software solutions under its brands Comet Yxlon and Dragonfly. In her role, Isabella oversees Market and Product Management, Global Application & Training Centers, Marketing, and the Academia Program. She holds a degree in industrial engineering, a Bachelor of Science in International Business Administration, and an MBA from Southern Nazarene University in Oklahoma City, USA. With a strong background in mechanical and plant engineering, Isabella has held several management roles focused on market-driven products and business development.
Chan Pin Chong, Kulicke & Soffa
Chan Pin Chong was appointed as Executive Vice President & General Manager, K&S’ Products and Solutions. He joined K&S in 2014 as Vice President of Wedge Bonders business unit and has successfully turnaround the business and led the team to higher growth by diversifying the business into the EV market and Display market. Chan Pin is a technology industry veteran with more than 31 years of engineering and operations experience in the semiconductor and electronics industry. He received his double bachelor’s degree in Electrical Engineering and Computer Science from the State University of New York at Buffalo and a master’s degree in Business Administration from the University of Leicester, United Kingdom.
John Behnke is the General Manager of INFICON’s FPS Product Line and Head of its IMS Marketing team. He leads a global team that develops and deploys Smart Manufacturing software and hardware solutions that improve factories’ performance. He is also a co-chair of the Semi North America Smart Manufacturing Chapter and a founding member of Semi’s Smart Global Executive Committee. Before his current role at FPS, John served as the President of Novati Technologies, SVP and GM of the Semiconductor Group at Intermolecular, CVP for Front End Manufacturing and Tech Transfers at Spansion, and Director of Operations at AMD’s Austin Fab 25.Moderated by Françoise von Trapp
Françoise von Trapp is known throughout the semiconductor and microelectronics industries as the “Queen of 3D” for founding 3D InCites and influencing the course of semiconductor device packaging technologies. As Editorial Director of 3D InCites, she represents the community as an industry podcaster and blogger, covering symposia and conferences, participating in trade shows, and moderating panels and webinars. Before founding 3D InCites, Françoise was Managing Editor of Advanced Packaging Magazine and a contributor to Chip Scale Review.
