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This event has been postponed until March 2025 – and be held in conjunction with the IMAPS Device Packaging Conference
The goal of the 3D InCites Community Career Fair is to match jobseekers in the microelectronics and advanced packaging fields with leading-edge companies that are building their workforce. More Details to follow.
For more information about sponsorship contact Brian Schieman. To reserve your table, contact Kristie Bowman.
