ICPT 2015 is jointly hosted by CMP User’s Group of the Northern California Chapter of the American Vacuum Society and the Clarkson University Center for Advanced Materials Processing (CAMP). ICPT 2015 provides the largest forum for academic researchers, industrial practitioners and engineers from around the world dedicated to the exchange of information on state-of-the-art Chemical Mechanical Polishing (CMP) and other planarization technologies. Abstracts of new work are requested and can include the following topics:
- Transistor and interconnect CMP applications
- 3D ICs/TSV/packaging applications
- CMP for emerging technologies such as MEMS/LEDs/power devices
- Other planarization technologies such as lapping/grinding/etching
- Process integration, process control & reliability
- Consumables, equipment, and metrology
- Defects and Post CMP cleaning
- CMP fundamentals, modeling, and simulation
- Environmental issues related to CMP
Important Dates:
- Abstract Submission Deadline: April 16, 2015
- Notification of Abstract Acceptance: June 1, 2015
- Camera Ready Papers Due: July 31, 2015
Abstracts should be a minimum of 200 words, written in English, and may include figures. Abstracts will be scored according to the originality and significance of the work as well as the quality of the information and data included. Please indicate the preference of oral or poster presentation, and the targeted topic area when submitting the abstract. Full-length papers, including figures and references will be limited to 4-8 pages for oral presenters and 3-4 pages for poster presenters. The full text of conference oral and poster papers will be published as an IEEE proceedings volume. Access the abstract template here.
