Cost Comparison of Fan-out Wafer Level Packaging and Flip Chip Packaging Mar 27, 2017 · By Amy P. Lujan · Resource Library, Technologies Features
Reinventing Paper for Electronics and 3D Technology Jun 22, 2016 · By Meriem Akin · Resource Library, Technologies Features
Challenges and Solutions for EDA of 3D Chip Stacks May 05, 2016 · By Johann Knechtel · Resource Library, Technologies Features
3D IC System Verification Methodology: Solutions and ChallengesJun 01, 2013 · By Francoise von Trapp · Resource Library By Dusan Petranovic, Member, IEEE, and, Karen Chow, Member, IEEE, (Mentor Graphics) The three largest EDA companies are taking an...
