Materials and Sustainability: Building a Circular Future
Sep 02, 2024 · By Francoise von Trapp · Book Reviews, Resource Library
Latest Posts - Page 5
Survey and Review of 2.5D and 3D IC Packaging Technologies
On April 9, 2014 Herb Reiter presented a 2.5D and 3D IC packaging-centric update in context with an IEEE/CPMT dinner... SEMI 3D IC Standards Workshop at SEMICON Singapore 2014
SEMICON Singapore 2014 featured a Friday round-table workshop about SEMI 3D IC Standards, which was held to determine local needs... Book Review: Design and Modeling for 3D ICs and Interposers
For almost 50 years the semiconductor industry has practiced continued shrinking of transistor feature sizes and has been able to... TSV Inspection using Virtual Interface Technology
Frontier Semiconductor has recently introduced Virtual Interface Technology (VITTM) for TSV Inspection. In the realm of 2.5D/3D packaging, a high... Silicon Interposer for a 12X10 Gb/s Electro-optical Engine
By Terry Bowen and Richard Miller, TE Connectivity The increasing transmission speeds in network switching, data storage, and super computing... 3D IC System Verification Methodology: Solutions and Challenges
By Dusan Petranovic, Member, IEEE, and, Karen Chow, Member, IEEE, (Mentor Graphics) The three largest EDA companies are taking an... A Comparative Simulation Study of 3D TSS Assembly Processes
A memory stack on logic 3D TSS stack was considered for comparative study of warpage response to two different process... Scaling 100G Wired Applications with Heterogeneous 3D FPGAs
By: Ehab Mohsen, Xilinx To address the insatiable demand for bandwidth, the communications industry is accelerating development of Nx100G line... 