Materials and Sustainability: Building a Circular Future
Sep 02, 2024 · By Francoise von Trapp · Book Reviews, Resource Library
Latest Posts - Page 2
Eutectic Die Attach Optimizes High Power GaN Devices
Details how to reduce chip-to-package junction temperature to improve GaN chip efficiency and reliability StratEdge Corporation, a leader in the...
The Implications of doing Business with Huawei
Summary: The United States Commerce Department is in the process of updating regulations on semiconductor trade with China. While over...
Additive Manufacturing for 3D Electronic Packaging
Additive manufacturing defines new boundaries for 3D electronic packaging, determined by new exceptional materials, new 3D cavity structures and the...
Material Value: A Narrative About More Sustainable, Less Wasteful Manufacturing
While I’m only four chapters into Material Value written by my colleague and SemiSister, Julia Goldstein, I decided to write...
The 5G Revolution is Pushing Innovations for RF front-end SiP
Without a doubt, 5G has arrived and various key smartphone OEMs have already announced products that will support 5G cellular...
Optimizing Your SoC or ASIC to Design PCBs More Cost Effectively
Shrinking silicon process nodes and increasing memory demands are a nightmare for PCB design teams working with custom ASICs or...
Implementing High-Density Advanced Packaging for OSATs and Foundries
Moore’s law is increasingly difficult to maintain and is driving the growth of innovative, high-density advanced packaging technologies in response... Designing and Integrating MCM/SIP Packages into Systems PCBs
The challenge of designing smaller, cost-effective systems that require additional processing and performance power led to 3D chip stacking of... Using Co-Design to Ensure Multi-Fabric System-Design Success
As next-generation High-Density-Advanced-Packaging (HDAP) designs become more common, PCB designers and engineers are looking to system-level co-design to tie multi-substrate... Package Designers Need Assembly-level LVS Signoff for HDAP Verification
While advanced IC packaging is a fast-growing market, comprehensive package verification still has a ways to go. Unique package connectivity...
Optimizing Your SoCs and ASICs to Design PCBs More Cost Effectively
Many high-performance systems today use custom ASICs or SoCs to provide the necessary computational power and data bandwidth demanded by... Implementing High-Density Advanced Packaging for OSATs and Foundries
Moore’s law is increasingly difficult to maintain and is driving the growth of innovative high-density advanced packaging (HDAP) technologies in... Designing and Integrating MCM/SIP Packages into Systems PCBs
Traditionally, MCMs (Multi-Chip-Modules) were a way of integrating several ASICs, or ASICs and memory, into a lower-cost, smaller form-factor, robust... Using Co-Design to Ensure Multi-Fabric System-Design Success
Today’s SoCs, multi-core CPUs and GPUs with their high performance, high bandwidth interconnect interfaces put demanding challenges across the entire...
Is MEMS Packaging and Test the Next Opportunity for OSATs?
More than half of microelectromechanical systems MEMS packaging today is done by outsourced semiconductor and test services providers (OSATs) and... Electromagnetic Simulation for Electronic Systems
Packages and boards are playing an increasing role as a way to increase speed and density while reducing power and... Electromagnetic Modeling of Three-dimensional Integrated Circuits
Three-dimensional Integrated circuits (3DIC) are generating increased interest as a way to increase speed and density while reducing power and... Implementing Fan-Out Wafer-Level Packaging (FOWLP) with an HDAP Flow
Fan-out wafer-level packaging (FOWLP) is an emerging type of high-density advanced packaging (HDAP) technology in the semiconductor industry that is... Solving the Design and Verification Challenges of High Density Advanced Packaging
Today’s electronic products present new challenges to product development teams. As a result, there is a constant push to improve...
