Materials and Sustainability: Building a Circular Future Sep 02, 2024 · By Francoise von Trapp · Book Reviews, Resource Library
Hybrid Bonding: The Time has Come May 02, 2024 · By Dr. Dongkai Shangguan · Book Reviews, Resource Library
Book Review: Handbook of 3D Integration – Volume 4 Jun 11, 2019 · By Herb Reiter · Book Reviews, Resource Library
Material Value: A Narrative About More Sustainable, Less Wasteful ManufacturingMay 21, 2019 · By Francoise von Trapp While I’m only four chapters into Material Value written by my colleague and SemiSister, Julia Goldstein, I decided to write...
More-than-Moore 2.5D and 3D SiP IntegrationFeb 23, 2017 · By Riko Radojcic A new book on 2.5D and 3D integration, written by Riko Radojcic and published by Springer, will soon be available....
Book Review: Vertical 3D Memory TechnologiesSep 30, 2014 · By Francoise von Trapp “From so simple a beginning endless forms most beautiful and most wonderful have been, and are being, evolved.” ~ Charles...
Book Review: Design and Modeling for 3D ICs and InterposersJan 27, 2014 · By Herb Reiter For almost 50 years the semiconductor industry has practiced continued shrinking of transistor feature sizes and has been able to...