IEEE JETCAS Call for Papers – 2.5D/3D Chiplet Circuits and Systems, EDA, Advanced Packaging, and Test
Jan 02, 2025 · By Erik Jan Marinissen · Press Releases
Latest Posts - Page 9
Henkel Semiconductor Capillary Underfill Enables Complex AI and HPC Large Body Advanced Packaging Designs
Irvine, CA – Henkel today announced that it has commercialized a semiconductor capillary underfill encapsulant to address the unique requirements...
Brewer Science Earns GreenCircle Certification for Zero Waste to Landfill for Ninth Consecutive Year
Brewer Science is the first and only company in the semiconductor industry with GreenCircle Certification Rolla, Mo.– April 3, 2024–Brewer...
Brewer Science Earns Intel’s 2024 EPIC Distinguished Supplier Award
Brewer Science is one of only 27 Distinguished Award recipients across Intel’s global supply chain. Rolla, MO, March 28, 2024...
Lam Research Introduces Breakthrough Deposition Technique to Enable Next-Generation MEMS for 5G and Beyond
Pulsus™ is the semiconductor industry’s first pulsed laser deposition tool designed for mass production FREMONT, Calif., March 26, 2024 – Lam Research...
ASE’s VIPack™ Enables Innovational AI Devices Through Advanced Interconnect Technology for Chiplets
SUNNYVALE, Calif., Mar 20, 2024 – Advanced Semiconductor Engineering, Inc. (ASE), a member of ASE Technology Holding Co., Ltd. (NYSE:...
SEMI Applauds U.S. CHIPS Act Incentives for Intel Manufacturing Facilities to Bolster Semiconductor Supply
MILPITAS, Calif. ─ March 20, 2024 ─ SEMI, the industry association serving the global electronics design and manufacturing supply chain, today...
Arizona State University and Deca Technologies to Pioneer North America’s First R&D Center for Advanced Fan-Out Wafer-Level Packaging
Advanced wafer-level packaging advances the next wave of innovation in global chip manufacturing TEMPE, Ariz. – March 19, 2024 –...
Expanded Semiconductor Assembly and Test Facility Database Tracks OSATs and IDMS in 670 Facilities
SEMI and TechSearch International collaborate on a new edition of database tracking 33% more facilities and highlights advanced packaging and...
What’s New in the SDRAM Space Memory?
3D PLUS is introducing 3DSD1G48VB2820, a new memory, to broaden its portfolio of space SDRAM. Since its first release on the market...
Indium Corporation Celebrates 90 Years of Materials Science Innovation
Indium Corporation, a global leader in materials science and electronics assembly solutions, commemorated its 90th anniversary on March 13. Indium...
ERS electronic Introduces The First Semi-automatic Machine from its Luminex Product Line
MUNICH, March 13th, 2024 – ERS electronic, the industry leader in thermal management solutions for semiconductor manufacturing is presenting the...
SurplusGLOBAL CEO Bruce Kim Presented with Korea’s 58th Taxpayer Day Award
Kim Jeong-woong (Bruce Kim), CEO of Surplus Global, a global platform for legacy semiconductor equipment and components, was selected as...
Veeco Waferstorm® Selected by Adeia to Support Next-Gen Advanced Packaging Applications
Veeco WaferStorm® Wet Processing System Installed at Adeia Inc. for Critical Cleaning Processes in Hybrid Bonding lainview, N.Y., March 13,...
MRSI introduces innovative MRSI-A-L Active Aligner for Optical Packaging Solutions
MRSI Systems (a part of Mycronic Group), a leading manufacturer of fully automated, high-precision, high-speed, flexible die bonding and epoxy...
3D Plus and Responsible Purchasing and Entrepreneurial Innovation
This week 3D PLUS, represented by its general director Pierre-Eric Berthet, took part in a meeting on the theme “Responsible...
StratEdge Brings Packaging Innovation to IMAPS Device Packaging
Santee, Calif. – 7 March 2024 – StratEdge Corporation, leader in the design, production, and assembly of high-performance semiconductor packages...
nepes Corporation Expands IC Packaging Capabilities for the 3D-IC Era with Advanced Design Flows from Siemens
Siemens Digital Industries Software today announced that South Korea-based nepes corporation, a global leader in Outsourced Semiconductor Assembly and Test...
HEIDENHAIN Announces “CONNECT” Manufacturing Innovation Hub in Silicon Valley
Schaumburg, IL (March 2024) HEIDENHAIN Corporation, a market leader in motion control technology, announces the acquisition of a new Silicon...
Nordson Electronics Solutions to Demonstrate Plasma Treatment and Automated Fluid Dispensing Systems for Electronics Manufacturing at SEMICON China 2024
Carlsbad, CA, USA – 5 March 2024 – Nordson Electronics Solutions, a global leader in reliable electronics manufacturing technologies, will...
