Circuits Integrated Hellas Selected as Laureate for Paris Space Week 2025 Innovation Challenge
Feb 04, 2025 · By Circuits Integrated Helles · Press Releases
Latest Posts - Page 9
StratEdge Takes High-Frequency Packaging Technology to New Heights at Upcoming Events
StratEdge is set to showcase its latest high-frequency packaging technology at several industry conferences in May. The events will take...
Nordson Electronics Solutions receives EM China Innovation Award for ASYMTEK Select Coat® SL-1040 Conformal Coating System
Nordson Electronics Solutions, a global leader in electronics manufacturing technologies, received the conformal coating equipment award from EM Asia China...
Siemens Collaborates with TSMC on Design Tool Certifications
Design Tool Certifications Support Newest Processes and Other Enablement Milestones Today at the TSMC 2024 North America Technology Symposium, Siemens...
Trymax Receives Multi-System Orders for NEO 2400 Series
NIJMEGEN, THE NETHERLANDS – Trymax Semiconductor Equipment B.V.(Trymax), a global leader in plasma solutions, today announced it has received multi-system...
Brewer Science Unveils Innovative Smart Warehouse Monitor System
On-demand, actionable insight increases warehouse productivity and maximizes employee safety Brewer Science, Inc., a pioneering leader in smart device technology, proudly...
SEMI Applauds U.S. CHIPS Act Award for Samsung Electronics Facilities
Funds to Strengthen Domestic Semiconductor Supply Chain MILPITAS, Calif. ─ April 16, 2024 ─ SEMI, the industry association serving the...
QP Technologies™ Achieves ANSI/ESD S20.20 Certification
Certification and Ongoing Monitoring Assures Customers of Manufacturing Operations’ ESD Control and Safety ESCONDIDO, Calif. – April 11, 2024 –...
SemiWiki Explains How GENIO™ Enables Multi-Die Design
Mike Gianfagna, in his blog for SemiWiki, declared that “MZ Technologies is a unique company that enables multi-die design by...
SEMI Applauds U.S. CHIPS Act Award for TSMC Manufacturing Facilities to Strengthen Domestic Semiconductor Supply Chain
MILPITAS, Calif. ─ April 8, 2024 ─ SEMI, the industry association serving the global electronics design and manufacturing supply chain,...
SEMI University Launches In-Person Courses
SEMI University In-Person Courses Aim to Help the Semiconductor Industry Workforce Build Skills, Advance in Careers Aiming to help the...
Averatek Relaunches as LQDX; Raises $10M in Equity And Government Funding
Names New Directors and Executives to focus on Liquid Metal Inks for Artificial Intelligence Averatek Corp., developer of high-performance materials... Averatek Relaunches as LQDX; Raises $10M in Equity And Government Funding
Names New Directors And Executives to focus on Liquid Metal Inks for Artificial Intelligence Averatek Corp., developer of high-performance materials...
Infineon and Amkor Deepen Partnership and Strengthen European Supply Chain for Semiconductor Solutions
Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY), a leader in power systems and IoT, is strengthening its outsourced backend manufacturing...
ERS electronic Announces Agreement with Geringer Halbleitertechnik GmbH & Co. KG to Strengthen R&D and Production Capabilities
MUNICH, April 9th, 2024 – ERS electronic, the industry leader of thermal management solutions for semiconductor manufacturing has finalized an...
Henkel Semiconductor Capillary Underfill Enables Complex AI and HPC Large Body Advanced Packaging Designs
Irvine, CA – Henkel today announced that it has commercialized a semiconductor capillary underfill encapsulant to address the unique requirements...
Brewer Science Earns GreenCircle Certification for Zero Waste to Landfill for Ninth Consecutive Year
Brewer Science is the first and only company in the semiconductor industry with GreenCircle Certification Rolla, Mo.– April 3, 2024–Brewer...
Brewer Science Earns Intel’s 2024 EPIC Distinguished Supplier Award
Brewer Science is one of only 27 Distinguished Award recipients across Intel’s global supply chain. Rolla, MO, March 28, 2024...
Lam Research Introduces Breakthrough Deposition Technique to Enable Next-Generation MEMS for 5G and Beyond
Pulsus™ is the semiconductor industry’s first pulsed laser deposition tool designed for mass production FREMONT, Calif., March 26, 2024 – Lam Research...
ASE’s VIPack™ Enables Innovational AI Devices Through Advanced Interconnect Technology for Chiplets
SUNNYVALE, Calif., Mar 20, 2024 – Advanced Semiconductor Engineering, Inc. (ASE), a member of ASE Technology Holding Co., Ltd. (NYSE:...
