Siemens’ Solido SPICE Certified for Multiple Leading-edge Samsung Foundry Processes
Nov 27, 2024 · By Siemens Digital Industries Software · Press Releases
Latest Posts - Page 8
QP Technologies™ Achieves ANSI/ESD S20.20 Certification
Certification and Ongoing Monitoring Assures Customers of Manufacturing Operations’ ESD Control and Safety ESCONDIDO, Calif. – April 11, 2024 –...
SemiWiki Explains How GENIO™ Enables Multi-Die Design
Mike Gianfagna, in his blog for SemiWiki, declared that “MZ Technologies is a unique company that enables multi-die design by...
SEMI Applauds U.S. CHIPS Act Award for TSMC Manufacturing Facilities to Strengthen Domestic Semiconductor Supply Chain
MILPITAS, Calif. ─ April 8, 2024 ─ SEMI, the industry association serving the global electronics design and manufacturing supply chain,...
SEMI University Launches In-Person Courses
SEMI University In-Person Courses Aim to Help the Semiconductor Industry Workforce Build Skills, Advance in Careers Aiming to help the...
Averatek Relaunches as LQDX; Raises $10M in Equity And Government Funding
Names New Directors and Executives to focus on Liquid Metal Inks for Artificial Intelligence Averatek Corp., developer of high-performance materials... Averatek Relaunches as LQDX; Raises $10M in Equity And Government Funding
Names New Directors And Executives to focus on Liquid Metal Inks for Artificial Intelligence Averatek Corp., developer of high-performance materials...
Infineon and Amkor Deepen Partnership and Strengthen European Supply Chain for Semiconductor Solutions
Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY), a leader in power systems and IoT, is strengthening its outsourced backend manufacturing...
ERS electronic Announces Agreement with Geringer Halbleitertechnik GmbH & Co. KG to Strengthen R&D and Production Capabilities
MUNICH, April 9th, 2024 – ERS electronic, the industry leader of thermal management solutions for semiconductor manufacturing has finalized an...
Henkel Semiconductor Capillary Underfill Enables Complex AI and HPC Large Body Advanced Packaging Designs
Irvine, CA – Henkel today announced that it has commercialized a semiconductor capillary underfill encapsulant to address the unique requirements...
Brewer Science Earns GreenCircle Certification for Zero Waste to Landfill for Ninth Consecutive Year
Brewer Science is the first and only company in the semiconductor industry with GreenCircle Certification Rolla, Mo.– April 3, 2024–Brewer...
Brewer Science Earns Intel’s 2024 EPIC Distinguished Supplier Award
Brewer Science is one of only 27 Distinguished Award recipients across Intel’s global supply chain. Rolla, MO, March 28, 2024...
Lam Research Introduces Breakthrough Deposition Technique to Enable Next-Generation MEMS for 5G and Beyond
Pulsus™ is the semiconductor industry’s first pulsed laser deposition tool designed for mass production FREMONT, Calif., March 26, 2024 – Lam Research...
ASE’s VIPack™ Enables Innovational AI Devices Through Advanced Interconnect Technology for Chiplets
SUNNYVALE, Calif., Mar 20, 2024 – Advanced Semiconductor Engineering, Inc. (ASE), a member of ASE Technology Holding Co., Ltd. (NYSE:...
SEMI Applauds U.S. CHIPS Act Incentives for Intel Manufacturing Facilities to Bolster Semiconductor Supply
MILPITAS, Calif. ─ March 20, 2024 ─ SEMI, the industry association serving the global electronics design and manufacturing supply chain, today...
Arizona State University and Deca Technologies to Pioneer North America’s First R&D Center for Advanced Fan-Out Wafer-Level Packaging
Advanced wafer-level packaging advances the next wave of innovation in global chip manufacturing TEMPE, Ariz. – March 19, 2024 –...
Expanded Semiconductor Assembly and Test Facility Database Tracks OSATs and IDMS in 670 Facilities
SEMI and TechSearch International collaborate on a new edition of database tracking 33% more facilities and highlights advanced packaging and...
What’s New in the SDRAM Space Memory?
3D PLUS is introducing 3DSD1G48VB2820, a new memory, to broaden its portfolio of space SDRAM. Since its first release on the market...
Indium Corporation Celebrates 90 Years of Materials Science Innovation
Indium Corporation, a global leader in materials science and electronics assembly solutions, commemorated its 90th anniversary on March 13. Indium...
ERS electronic Introduces The First Semi-automatic Machine from its Luminex Product Line
MUNICH, March 13th, 2024 – ERS electronic, the industry leader in thermal management solutions for semiconductor manufacturing is presenting the...
