IEEE JETCAS Call for Papers – 2.5D/3D Chiplet Circuits and Systems, EDA, Advanced Packaging, and Test
Jan 02, 2025 · By Erik Jan Marinissen · Press Releases
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Werner H. J. Wagner Appointed as General Manager of Indium Corporation Advanced Materials GmbH
Indium Corporation, a leading innovator in industrial material solutions, is thrilled to announce the appointment of Werner H. J....
Nordson Test & Inspection to Showcase Advanced Semiconductor Technologies at SEMICON West 2024
Nordson TEST & INSPECTION today announced plans to exhibit at SEMICON West 2024, scheduled to take place July 9-11 at...
PulseForge and Indium Corporation Present Joint Study on Optimizing Photonic Soldering Processes
PulseForge, a leader in photonic curing solutions, and Indium Corporation, a premier materials supplier to the electronics assembly industry, presented...
SEMI Foundation Launches Semiconductor PRIDE Initiative to Promote LGBTQ+ Inclusion in Chip Industry Workforce
The SEMI Foundation, the non-profit arm of SEMI, today announced the formation of a new industry-led initiative to advance LGBTQ+...
Indium Corporation to Feature Precision Gold-Based Die-Attach Preforms at International Microwave Symposium
Indium Corporation® will feature its high-reliability, gold-based precision die-attach (PDA) preforms for critical laser and RF applications, as well as...
CTW Solutions and Trymax Semiconductor Equipment B.V. Forge Strategic Sales Partnership to Strengthen Market Presence in Southwestern USA
CTW Solutions, a leading provider of innovative semiconductor solutions, and Trymax Semiconductor Equipment B.V., a global leader in plasma solutions,...
ASE Introduces powerSiP™ for Transformative Power Delivery
PowerSIP™ increases power efficiencies by 50% in AI and data center applications Advanced Semiconductor Engineering, Inc. (ASE), a member of...
IMAPS Academy Online Portal Launched to Support Semiconductor Advanced Packaging Workforce Development
The International Microelectronics Assembly and Packaging Society (IMAPS), the largest organization dedicated to the advancement and growth of microelectronics and...
NHanced Semiconductors Announces Delivery of the First Next-Generation Hybrid Bonding System from BE Semiconductor Industries
The Besi Datacon 8800 CHAMEO ultra plus advanced hybrid bonding system delivers faster throughput, enhanced accuracy, and superior warpage control for room temperature...
ERS electronic Releases Fully Automatic Luminex Machines with PhotoThermal Debonding and Wafer Cleaning
ERS electronic, the industry leader in thermal management solutions for semiconductor manufacturing, is announcing two new fully automatic machines from...
EV Group Doubles Throughput of Innovative Semiconductor Layer Transfer Technology
The dedicated HVM EVG®880 LayerRelease™ system boosts productivity and lowers the cost-of-ownership of novel infrared laser release technology through silicon...
Indium Corporation Expert to Present at MiNaPAD 2024
Indium Corporation’s Senior Global Product Manager for Semiconductor and Advanced Materials, Sze Pei Lim, will deliver two technical presentations at...
Brewer Science Presents Low-temp Hybrid Bonding at ECTC 2024
Experience higher integration density and improved performance through hybrid bonding techniques. Denver, Colorado – May 23, 2024 – Brewer Science, Inc., a...
SEMICON Europa 2024 Call for Abstracts Opens
Presentation abstracts are now being accepted for the Advanced Packaging Conference, Fab Management Forum, and MEMS & Imaging Sensors Summit...
EV Group Heterogeneous Integration Solutions To Be Highlighted at ECTC 2024
Papers will highlight heterogeneous integration solutions such as hybrid bonding, maskless lithography, and layer transfer technology for advanced packaging applications....
European Chip Skills Academy Launches Summer School in Italy to Promote Microelectronics Industry Careers
The European Chip Skills Academy (ECS Academy) Connects Students with Microelectronics Studies to Help Build Talent Pipeline University students will... Brewer Science Presents Innovative Material Solutions for Compound Semiconductor Manufacturing at CS Mantech
Brewer Science, a global technology leader in specialty materials for compound semiconductor manufacturing, invites attendees of CS Mantech to visit...
Indium Corporation to Present On and Showcase HIA Materials at ECTC
Experts to Present on High-Temperature, Lead-Free Solder Paste and High-Reliability Liquid Metal Alloys Poster at ECTC As an industry leader...
New SEMI University Online Certification Programs to Fast-Track Semiconductor Skills Development
Aiming to help the global semiconductor industry address its talent gap by training and upskilling workers, SEMI today announced that...
