Siemens’ Solido SPICE Certified for Multiple Leading-edge Samsung Foundry Processes
Nov 27, 2024 · By Siemens Digital Industries Software · Press Releases
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LQDX and Kansai Denshi Industries Sign Sales and License Agreement
Deal between LQDX and Kansai Denshi Industries Enables Japan-Asian Support for Growing IC-Substrates and Advanced Circuit Solutions LQDX <lik-Wid-ix>, developer...
QP Technologies™ Expands Die Preparation Business
Adds Fully Automated Dicing Saw to Equipment Line, Enabling Even Greater Precision, Throughput for Die Singulation QP Technologies™, a leading...
The Growing Importance of Glass Substrates in Semiconductor Technology
The semiconductor industry is experiencing a significant shift towards the use of glass substrates, driven by their superior performance characteristics...
Adeia Selects PulseForge Photonic Debonding Equipment for Advanced Semiconductor Applications
Adeia Inc. (Nasdaq: ADEA), a leading innovator in research and development who has pioneered hybrid bonding in the semiconductor industry,...
EV Group and Fraunhofer IZM-ASSID Expand Partnership in Wafer Bonding for Quantum Computing Applications
EV Group and Fraunhofer IZM-ASSID partnership kicks off with the installation of EVG850 automated laser debonding system at the newly...
Siemens Collaborates with Samsung Foundry to Expand 3D-IC Enablement Tools
The collaboration includes the optimization of other EDA solutions for Samsung Foundry’s newest processes Siemens Digital Industries Software announced that,...
Indium Corporation Welcomes 13 New Interns To Its Award-Winning Program
Indium Corporation is pleased to welcome 13 new interns into its award-winning summer internship program. Indium Corporation’s internship program is...
As The Pioneer in Hybrid Bonding Technology, Adeia Continues to Capture Attention
Adeia Inc., a leading R&D and intellectual property (IP) licensing company known for bringing leading innovations in the semiconductor and...
Werner H. J. Wagner Appointed as General Manager of Indium Corporation Advanced Materials GmbH
Indium Corporation, a leading innovator in industrial material solutions, is thrilled to announce the appointment of Werner H. J....
Nordson Test & Inspection to Showcase Advanced Semiconductor Technologies at SEMICON West 2024
Nordson TEST & INSPECTION today announced plans to exhibit at SEMICON West 2024, scheduled to take place July 9-11 at...
PulseForge and Indium Corporation Present Joint Study on Optimizing Photonic Soldering Processes
PulseForge, a leader in photonic curing solutions, and Indium Corporation, a premier materials supplier to the electronics assembly industry, presented...
SEMI Foundation Launches Semiconductor PRIDE Initiative to Promote LGBTQ+ Inclusion in Chip Industry Workforce
The SEMI Foundation, the non-profit arm of SEMI, today announced the formation of a new industry-led initiative to advance LGBTQ+...
Indium Corporation to Feature Precision Gold-Based Die-Attach Preforms at International Microwave Symposium
Indium Corporation® will feature its high-reliability, gold-based precision die-attach (PDA) preforms for critical laser and RF applications, as well as...
CTW Solutions and Trymax Semiconductor Equipment B.V. Forge Strategic Sales Partnership to Strengthen Market Presence in Southwestern USA
CTW Solutions, a leading provider of innovative semiconductor solutions, and Trymax Semiconductor Equipment B.V., a global leader in plasma solutions,...
ASE Introduces powerSiP™ for Transformative Power Delivery
PowerSIP™ increases power efficiencies by 50% in AI and data center applications Advanced Semiconductor Engineering, Inc. (ASE), a member of...
IMAPS Academy Online Portal Launched to Support Semiconductor Advanced Packaging Workforce Development
The International Microelectronics Assembly and Packaging Society (IMAPS), the largest organization dedicated to the advancement and growth of microelectronics and...
NHanced Semiconductors Announces Delivery of the First Next-Generation Hybrid Bonding System from BE Semiconductor Industries
The Besi Datacon 8800 CHAMEO ultra plus advanced hybrid bonding system delivers faster throughput, enhanced accuracy, and superior warpage control for room temperature...
ERS electronic Releases Fully Automatic Luminex Machines with PhotoThermal Debonding and Wafer Cleaning
ERS electronic, the industry leader in thermal management solutions for semiconductor manufacturing, is announcing two new fully automatic machines from...
EV Group Doubles Throughput of Innovative Semiconductor Layer Transfer Technology
The dedicated HVM EVG®880 LayerRelease™ system boosts productivity and lowers the cost-of-ownership of novel infrared laser release technology through silicon...
