Biden-Harris Administration Announces CHIPS Incentives Award with Amkor Technology to Bring End-to-End Chip Production to the U.S.
Dec 26, 2024 · By Amkor Technology · Press Releases
Latest Posts - Page 54
Alchimer opens 300mm facility in Asia
Alchimer announced the opening of a new applications-and-development facility in Seoul, South Korea, for...SPTS Triples Revenue in 1st Half 2010 over 1st Half 2009
Exhibiting for the first time at SEMICON West 2010 as the newly-formed SPP Process Technology...Alchimer Receives Equity Investment From Panasonic Corporation
Alchimer S.A., a provider of nanometric deposition technology for through-silicon vias (TSV), semiconductor interconnects, and...SEMI International Standards Program Forms 3D Stacked IC Standards Committee
SEMI announced today the formation of a Three-Dimensional Stacked Integrated Circuits (3DS-IC) Standards Committee. 3DS-ICs are composed of a stack...austriamicrosystems Introduces “More Than Silicon” Initiative
austriamicrosystems Full Service Foundry business unit today introduced its “More Than Silicon” initiative, a comprehensive service and technology package that...Dr. Bill Bottoms joins Alchimer Board
Alchimer S.A., provider of nanometric deposition technology for semiconductor interconnects and through-silicon vias, announced...IITC Technical Conference Expands Program to include 3D Memory
A new industry emphasis on 3D memory technology has prompted the 2010 IEEE International Interconnect Technology Conference (IITC) to expand...eWLB Manufacturer selects SPTS as a partner for their 300mm Roadmap
Semiconductor equipment manfacturer, SPP Process Technology Systems (SPTS) announced that it has shipped aElpida, PTI, and UMC Partner on 3D IC Integration Development
Elpida Memory Inc., Powertech Technology Inc. (PTI), and United Microelectronics Corporation (UMC), have entered into a 3-way cooperation to advance...Strategic Restructuring of the SUSS MicroTec Group
SUSS MicroTec has announced its decision to relocate its Substrate Bonder division...Fraunhofer IZM-ASSID selects EV Group Temporary Bonding and Debonding Equipment for Devoloping Processes for High-Volume Manufacturing
EVG Systems Selected for Platform Flexibility, Functionality and Industry-Proven Reliability
OSEO assigns 9M Euro to support CUIVRE Project
Smart Equipment Technolgy (SET), Replisaurus Mastering, and research partner, CEA-Leti, coordinator of PRO3D, a European consortium created to program future 3D manycore architectures, announced they've assembled six partners ...Alchimer signs far-reaching agreement with KPM Tech
In a deal that is expected to generate economical new process options for the 3D integration market,European PRO3D Consortium to Focus on Programming 3D Manycore Architectures
SPTS starts on high: Q4 2009 Orders up
SPP Process Technology Systems Ltd. (SPTS), a subsidiary of Sumitomo Precision Products...Alchimer’s Electrografting Validated by RTI
Alchimer S.A., a provider of nanometric deposition technology for through-silicon vias (TSVs), semiconductor interconnects and other electronic applications, announced that...Wafer-Level Microlens Molding Process From EV Group Extends Manufacturing Roadmap for CMOS Image Sensors
EV Group (EVG), supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, announced that it...SUSS MicroTec sells test division to Cascade Microtech; forges alliance to address 3D TSV test
In a double-barreled press release, SUSS MicroTec announced the sale of its Test Systems Division to Cascade Microtech, Inc., a...
