Press Releases

Latest Posts - Page 53

Rudolph Acquires Assets of Tamar Technologies

Apr 29, 2013 · By Francoise von Trapp

Rudolph Technologies, Inc., known for its process characterization, photolithography equipment and software for the semiconductor, FPD, LED and solar industries,...

SUSS MicroTec Announces Follow-up Order for 300mm Bonding Tools for HVM 3D ICs

Mar 28, 2013 · By Francoise von Trapp · Manufacturing

SUSS MicroTec, a global supplier of equipment and process solutions for the semiconductor industry and related markets has received a...

3D ICs News in Brief – Jan. 19-29

Jan 29, 2013 · By Francoise von Trapp

While there is still a lot to report about the European TSV Summit, I wanted to catch everyone up on...

EV Group Completes Cleanroom Expansion, Opens New R&D Labs And Customer Training Center At Corporate Headquarters

Nov 30, 2012 · By Francoise von Trapp

EV Group (EVG) supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, announced the completion...

Invensas Targets Ultrabooks and Tablet Applications with DIMM-IN-A-PACKAGE Solution Based on xFD Technology

Nov 04, 2012 · By Francoise von Trapp

Invensas Corporation, provider of semiconductor technology solutions and wholly owned subsidiary of Tessera Technologies, Inc., introduced its DIMM-IN-A-PACKAGETM multi-die face-down...

Impress Labs Boosts Content Marketing Strategy With Strategic Hire of 3D InCites Technology Journalist Françoise von Trapp

Aug 21, 2012 · By Francoise von Trapp

Impress Labs, a global brand, creative, and communication agency for the semiconductor, solar energy and life science industries, today announced...

3D-IC LinkedIn Group Announces Milestone in Member Subscriptions

Apr 17, 2012 · By Francoise von Trapp

The 3D-IC LinkedIn Group announced today that it has reached more than 1,100 members. The discussion forum for 3D Integrated...

Shin-Etsu Microsi Joins EV Group’s Open Platform for Temporary Bonding Materials for 3D IC Manufacturing

Mar 14, 2012 · By Francoise von Trapp

New Platform Member Further Strengthens Supply Chain for EV Group’s New ZoneBOND™ Capable EZR® (Edge Zone Release) and EZD® (Edge...

Sales of Amkor Technology’s Next Generation Through Mold Via Package-on-Package Solutions Surpass 100 Million Units

Dec 20, 2011 · By Francoise von Trapp

Amkor Technology, Inc. , a leading provider of semiconductor assembly and test services, today announced that its innovative Through Mold...

BiTS Workshop Rebrands to Keep Pace with Packaging Evolution

Dec 09, 2011 · By Francoise von Trapp

The Burn‐in & Test Socket Workshop (BiTS Workshop) announced today that it is changing its name to The Burn‐in &...

Brewer Science and EV Group Announce Agreement on ZoneBOND™ Technology

Oct 20, 2011 · By Francoise von Trapp

Enabling Commercialization of Groundbreaking Temporary Bonding and Debonding Technology ROLLA, MO, USA and st. florian, AUSTRIA, October 20, 2011 –...

EV Group and Fraunhofer IZM-ASSID Establish Joint Development Agreement for High-Volume 3D Integration Applications

Oct 10, 2011 · By Francoise von Trapp

JDA to Extend Limits of Temporary Bonding/Debonding Technology to Support High-Topography Wafers and Chips SEMICON EUROPA, Dresden, Germany, October 11,...

Alchimer Appoints Chief Operating Officer

Oct 01, 2011 · By Francoise von Trapp

Alchimer S.A. provider of nanometric deposition technology for through-silicon vias (TSVs), semiconductor interconnects and other electronic applications, has named Erik...

Web Portal for 3D-ICs Joins Forces with 3D InCites

Sep 29, 2011 · By Francoise von Trapp

San Jose, CA - September 29, 2011 - With the semiconductor industry’s transition to 3D-ICs gaining momentum, online resources focused...

Si2 Announces Founding Members of the Open3D Technical Advisory Board

Sep 12, 2011 · By Francoise von Trapp

The Silicon Integration Initiative (Si2) announced today the founding members of their Open3D Technical Advisory Board (TAB), which is chartered...

SEMATECH Reports Advances in Bond Process for 3D Integration Development

Sep 03, 2011 · By Francoise von Trapp

With a focus on providing cost-effective and reliable solutions to accelerate manufacturing readiness of 3D technology options, SEMATECH experts reported...

SPP Process Technology Systems (SPTS) Acquires Primaxx Inc.

Mar 02, 2011 · By Francoise von Trapp

SPP Process Technology Systems (SPTS), manufacturer of plasma etch, deposition, and thermal processing equipment for the semiconductor industry today has...

EV Group Teams with Industrial Technology Research Institute (ITRI) on Advanced MEMS Research and Development

Jan 06, 2011 · By Francoise von Trapp · Manufacturing

ST. FLORIAN, Austria, June 1, 2011 – EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for...

EV Group Strengthens Presence in Middle East with Order Win from King Abdullah University of Science and Technology

Sep 23, 2010 · By Francoise von Trapp

Top university selects EVG systems on strength of flexible technology, local service and support ST. FLORIAN, Austria, September 23, 2010...

STATS ChipPAC Celebrates Grand Opening of 300mm eWLB Facility

Sep 15, 2010 · By Francoise von Trapp

The official inauguration of STATS ChipPAC’s 300mm eWLB facility was held September 15, at the company's Yishun facility in Singapore...

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