Siemens’ Solido SPICE Certified for Multiple Leading-edge Samsung Foundry Processes
Nov 27, 2024 · By Siemens Digital Industries Software · Press Releases
Latest Posts - Page 53
EV Group and Fraunhofer IZM-ASSID Establish Joint Development Agreement for High-Volume 3D Integration Applications
JDA to Extend Limits of Temporary Bonding/Debonding Technology to Support High-Topography Wafers and Chips SEMICON EUROPA, Dresden, Germany, October 11,...Alchimer Appoints Chief Operating Officer
Alchimer S.A. provider of nanometric deposition technology for through-silicon vias (TSVs), semiconductor interconnects and other electronic applications, has named Erik...Web Portal for 3D-ICs Joins Forces with 3D InCites
San Jose, CA - September 29, 2011 - With the semiconductor industry’s transition to 3D-ICs gaining momentum, online resources focused...Si2 Announces Founding Members of the Open3D Technical Advisory Board
The Silicon Integration Initiative (Si2) announced today the founding members of their Open3D Technical Advisory Board (TAB), which is chartered...SEMATECH Reports Advances in Bond Process for 3D Integration Development
With a focus on providing cost-effective and reliable solutions to accelerate manufacturing readiness of 3D technology options, SEMATECH experts reported...SPP Process Technology Systems (SPTS) Acquires Primaxx Inc.
SPP Process Technology Systems (SPTS), manufacturer of plasma etch, deposition, and thermal processing equipment for the semiconductor industry today has...EV Group Teams with Industrial Technology Research Institute (ITRI) on Advanced MEMS Research and Development
ST. FLORIAN, Austria, June 1, 2011 – EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for...EV Group Strengthens Presence in Middle East with Order Win from King Abdullah University of Science and Technology
Top university selects EVG systems on strength of flexible technology, local service and support ST. FLORIAN, Austria, September 23, 2010...STATS ChipPAC Celebrates Grand Opening of 300mm eWLB Facility
The official inauguration of STATS ChipPAC’s 300mm eWLB facility was held September 15, at the company's Yishun facility in Singapore...Alchimer opens 300mm facility in Asia
Alchimer announced the opening of a new applications-and-development facility in Seoul, South Korea, for...SPTS Triples Revenue in 1st Half 2010 over 1st Half 2009
Exhibiting for the first time at SEMICON West 2010 as the newly-formed SPP Process Technology...Alchimer Receives Equity Investment From Panasonic Corporation
Alchimer S.A., a provider of nanometric deposition technology for through-silicon vias (TSV), semiconductor interconnects, and...SEMI International Standards Program Forms 3D Stacked IC Standards Committee
SEMI announced today the formation of a Three-Dimensional Stacked Integrated Circuits (3DS-IC) Standards Committee. 3DS-ICs are composed of a stack...austriamicrosystems Introduces “More Than Silicon” Initiative
austriamicrosystems Full Service Foundry business unit today introduced its “More Than Silicon” initiative, a comprehensive service and technology package that...Dr. Bill Bottoms joins Alchimer Board
Alchimer S.A., provider of nanometric deposition technology for semiconductor interconnects and through-silicon vias, announced...IITC Technical Conference Expands Program to include 3D Memory
A new industry emphasis on 3D memory technology has prompted the 2010 IEEE International Interconnect Technology Conference (IITC) to expand...eWLB Manufacturer selects SPTS as a partner for their 300mm Roadmap
Semiconductor equipment manfacturer, SPP Process Technology Systems (SPTS) announced that it has shipped aElpida, PTI, and UMC Partner on 3D IC Integration Development
Elpida Memory Inc., Powertech Technology Inc. (PTI), and United Microelectronics Corporation (UMC), have entered into a 3-way cooperation to advance...Strategic Restructuring of the SUSS MicroTec Group
SUSS MicroTec has announced its decision to relocate its Substrate Bonder division...Fraunhofer IZM-ASSID selects EV Group Temporary Bonding and Debonding Equipment for Devoloping Processes for High-Volume Manufacturing
EVG Systems Selected for Platform Flexibility, Functionality and Industry-Proven Reliability
