Circuits Integrated Hellas Selected as Laureate for Paris Space Week 2025 Innovation Challenge
Feb 04, 2025 · By Circuits Integrated Helles · Press Releases
Latest Posts - Page 52
SSEC Scores Double Tool Win for Thick-Film Removal Processes in Leading Asian Foundry and Major US Chip Manufacturer
Solid State Equipment LLC (SSEC), provider of single-wafer wet processing systems for advanced packaging (including 2.5D and 3D-ICs), MEMS, and... Invensas and Tezzaron Partner to Deliver Commercial 3D IC Products
Invensas Corporation, a wholly owned subsidiary of Tessera Technologies, Inc. (Nasdaq: TSRA), announced today that it is partnering with Tezzaron... Ziptronix Teams with Tezzaron and Novati Technologies to Accelerate 3D IC Development
Ziptronix Inc., provider of patented, low-temperature direct bonding technology for 3D integration, announced an agreement with Tezzaron Semiconductor Corporation and... CEA-Leti Signs Agreement with Qualcomm To Assess Sequential 3D Technology
CEA-Leti announced an agreement with Qualcomm Technologies, Inc., a subsidiary of Qualcomm Incorporated, to assess the feasibility and the value... EV Group Completes Next Expansion Phase of Corporate Headquarters
ST. FLORIAN, Austria, December 05, 2013 — EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for... Successful 2.5D Test Vehicle Project Launched by GLOBALFOUNDRIES, Open-Silicon and Amkor Technology
GLOBALFOUNDRIES has unveiled details of a 2.5D test vehicle project that demonstrates the value of its open and collaborative approach... Rudolph Wins Multiple Orders for AWX FSI Unpatterned Wafer Inspection Tools in Back-End and Advanced Packaging Applications
Rudolph Technologies, Inc. announced that it has won orders for its AWX™ FSI unpatterned wafer inspection system at both a... SUSS MicroTec Brings 3D IC Laser Debonding to Fraunhofer IZM
SUSS MicroTec announced the installation of its ELP300 excimer laser stepper to support next-generation advanced packaging and 3D IC laser... 3D Memory Using Conductive Lines for Vertical Interconnects
The push for size reduction is reaching the segment of vertical interconnects. Current technology has a lower limit of approximately... NANIUM Extends eWLB to Achieve Higher Reliability
NANIUM S.A. has introduced an improved dielectric material and process solution for its fan-out wafer-level packaging (FOWLP) technology, embedded wafer-level... Triton Microtechnologies Receives Funding to Ramp Glass Interposer Manufacturing for 3D and 2.5D Semiconductor Packaging
Start-up Triton Microtechnologies, a designer and manufacturer of ultra-thin glass interposer technology that enables advanced semiconductor-packaging solutions, has met six-month... Dow Introduces SOLDERON Tin-Silver Plating Chemistry for Lead-Free Bumping
The company’s next-generation SnAg offers industry-leading plating rates and process flexibility for flip chip packages and interconnects. Dow Electronic Materials... Delft University of Technology and imec Introduce 3D-COSTAR to Optimize Test Flows of 3D Stacked Integrated Circuits
Delft University of Technology (TU Delft) and nanoelectronics research center imec, introduced 3D-COSTAR, a new test flow cost modeling tool... Invensas Wins Frost & Sullivan 2013 Mobile Computing Customer Value Enhancement Award for Bond Via Array (BVA)
Invensas Corporation, a leading provider of semiconductor technology solutions and wholly owned subsidiary of Tessera Technologies, Inc. (Nasdaq: TSRA), today... MonolithIC 3D Inc. at the 2013 IEEE 3DIC Conference
Monolithic 3D is far more than just an alternative to 0.7x scaling. Zvi Or-Bach, President and CEO will present a... Micron Technology Ships First HMC Samples; Plans Volume Production for 2014
BOISE, Idaho, Sept. 25, 2013 — Micron Technology, Inc. announced that it is shipping 2GB Hybrid Memory Cube (HMC) engineering... ASIC Marketplace Connects Service Providers and Customers
Tel Aviv, Israel, 17-Sep 2013. AnySilicon, an independent semiconductor blog, launched today an online marketplace linking ASIC service providers and... Beyond Plug & Yield® – Multitest is acquired by LTX-Credence Bringing Tester, Handlers and Interfaces together
Rosenheim, Germany, September 2013: LTX-Credence Corporation (Nasdaq:LTXC), announced an important step in the evolution of the semiconductor test cell with... Dow Corning Joins EV Group’s Open Platform for Temporary Bonding Materials for 3D-IC Manufacturing
Both Innovators Join Forces to Offer Simple, Cost-Effective Temporary Bonding/Debonding Solution for High-Performance 3D-IC Packaging ST. FLORIAN, Austria, Sept. 3,... 
