IEEE JETCAS Call for Papers – 2.5D/3D Chiplet Circuits and Systems, EDA, Advanced Packaging, and Test
Jan 02, 2025 · By Erik Jan Marinissen · Press Releases
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MonolithIC 3D Inc. at the 2013 IEEE 3DIC Conference
Monolithic 3D is far more than just an alternative to 0.7x scaling. Zvi Or-Bach, President and CEO will present a... Micron Technology Ships First HMC Samples; Plans Volume Production for 2014
BOISE, Idaho, Sept. 25, 2013 — Micron Technology, Inc. announced that it is shipping 2GB Hybrid Memory Cube (HMC) engineering... ASIC Marketplace Connects Service Providers and Customers
Tel Aviv, Israel, 17-Sep 2013. AnySilicon, an independent semiconductor blog, launched today an online marketplace linking ASIC service providers and... Beyond Plug & Yield® – Multitest is acquired by LTX-Credence Bringing Tester, Handlers and Interfaces together
Rosenheim, Germany, September 2013: LTX-Credence Corporation (Nasdaq:LTXC), announced an important step in the evolution of the semiconductor test cell with... Dow Corning Joins EV Group’s Open Platform for Temporary Bonding Materials for 3D-IC Manufacturing
Both Innovators Join Forces to Offer Simple, Cost-Effective Temporary Bonding/Debonding Solution for High-Performance 3D-IC Packaging ST. FLORIAN, Austria, Sept. 3,... EV Group Unveils New Via-Filling Process to Improve Reliability of 3D-IC / TSV Packaging
Semicon Taiwan, Taipei, September 4, 2013 — EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for... Rudolph Announces New Metrology Suite for Advanced Packaging
New NSX Metrology Series includes application-specific configurations to address unique metrology requirements for wafer level packaging, 2.5D and 3DIC Rudolph... EV Group Celebrates Strong Growth and New Manufacturing Process Solutions at SEMICON West 2013
Demand For Flexible, High-Volume Manufacturing Solutions in 3D-IC/Advanced Packaging, MEMS, Power Device and Compound Semiconductor Markets Drive Growth SEMICON WEST,... Alchimer Signs Collaboration with CEA-Leti to Evaluate Metallization Processes for High Aspect Ratio TSV Applications
Wet Nanometric Film Deposition Processes Capable of Delivering 20:1 Aspect Ratio TSVs at Low Cost of Ownership MASSY, France – July... SSEC Introduces WaferEtch and WaferStorm Platforms to its Portfolio of Single Wafer Wet Processing Solutions at SEMICON West 2013
Unique Configurations Bring Improved Process Control, Lower CoO, and Higher Throughput to Pave the Way for Leading-Edge Technology Adoption Horsham,... EV Group Pushes the Limits on 3D-IC Manufacturing for Next-Generation CMOS Image Sensory
Enhanced wafer alignment metrology capability coupled with market-leading GEMINI® FB system creates closed-loop fusion wafer bonding solution to enable high-density... New Consortium for 2.5D Through-silicon Interposer Technology to Benefit Computer and Consumer Electronics Industries
A*STAR Institute of Microelectronics and Leading Semiconductor Partners combine research and market expertise to address industry challenges Singapore, 24 June... EV Group and Dynaloy Jointly Develop Complete Single-Wafer Cleaning Solution for 3D-IC/TSV, Advanced Packaging, MEMS and Compound Semiconductor Applications
CoatsClean™ combines process, equipment and formulation technology to deliver innovative, low cost-of-ownership approach to single-wafer photoresist and residue removal ST....
Advanced Packaging at SEMICON West
Generation Mobile, “Thin is In” and More Advanced packaging technology is undergoing dramatic changes as the smart phones and new... 2013 3D Test Workshop Call for Papers
The 2013 3D-TEST Workshop focuses exclusively on test of and design-for-test for three-dimensional stacked ICs (3D-SICs), including Systems-in-Package (SiP), Package-on-Package... Dow Corning and SÜSS MicroTec Report New Temporary Bonding Solution for 2.5D and 3D IC Packaging at ECTC 2013
The semiconductor industry’s march toward broader 3D IC integration marked an important milestone this week at the 2013 Electronic Components... A*STAR IME, STATS ChipPAC and Qualcomm collaborate to develop low cost interposer technology
Singapore 29 May, 2013– Singapore’s A*STAR Institute of Microelectronics (IME), Qualcomm Technologies Inc., a wholly owned subsidiary of Qualcomm Incorporated,... 3D InCites and TechSearch International Launch Awards Program To Recognize Achievements in 2.5D and 3D IC Technologies
Proceeds to Benefit The Frances B. Hugle Engineering Scholarship Phoenix AZ and Austin TX – May 21, 2012 – 3D... Mentor and Tezzaron Optimize Calibre 3DSTACK for 2.5D/3D-ICs
WILSONVILLE, Ore., May 20, 2013—Mentor Graphics Corp. (NASDAQ: MENT) and Tezzaron Semiconductor Corp. today announced they are collaborating to integrate... 