Siemens’ Solido SPICE Certified for Multiple Leading-edge Samsung Foundry Processes
Nov 27, 2024 · By Siemens Digital Industries Software · Press Releases
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Rudolph Wins Multiple Orders for AWX FSI Unpatterned Wafer Inspection Tools in Back-End and Advanced Packaging Applications
Rudolph Technologies, Inc. announced that it has won orders for its AWX™ FSI unpatterned wafer inspection system at both a... SUSS MicroTec Brings 3D IC Laser Debonding to Fraunhofer IZM
SUSS MicroTec announced the installation of its ELP300 excimer laser stepper to support next-generation advanced packaging and 3D IC laser... 3D Memory Using Conductive Lines for Vertical Interconnects
The push for size reduction is reaching the segment of vertical interconnects. Current technology has a lower limit of approximately... NANIUM Extends eWLB to Achieve Higher Reliability
NANIUM S.A. has introduced an improved dielectric material and process solution for its fan-out wafer-level packaging (FOWLP) technology, embedded wafer-level... Triton Microtechnologies Receives Funding to Ramp Glass Interposer Manufacturing for 3D and 2.5D Semiconductor Packaging
Start-up Triton Microtechnologies, a designer and manufacturer of ultra-thin glass interposer technology that enables advanced semiconductor-packaging solutions, has met six-month... Dow Introduces SOLDERON Tin-Silver Plating Chemistry for Lead-Free Bumping
The company’s next-generation SnAg offers industry-leading plating rates and process flexibility for flip chip packages and interconnects. Dow Electronic Materials... Delft University of Technology and imec Introduce 3D-COSTAR to Optimize Test Flows of 3D Stacked Integrated Circuits
Delft University of Technology (TU Delft) and nanoelectronics research center imec, introduced 3D-COSTAR, a new test flow cost modeling tool... Invensas Wins Frost & Sullivan 2013 Mobile Computing Customer Value Enhancement Award for Bond Via Array (BVA)
Invensas Corporation, a leading provider of semiconductor technology solutions and wholly owned subsidiary of Tessera Technologies, Inc. (Nasdaq: TSRA), today... MonolithIC 3D Inc. at the 2013 IEEE 3DIC Conference
Monolithic 3D is far more than just an alternative to 0.7x scaling. Zvi Or-Bach, President and CEO will present a... Micron Technology Ships First HMC Samples; Plans Volume Production for 2014
BOISE, Idaho, Sept. 25, 2013 — Micron Technology, Inc. announced that it is shipping 2GB Hybrid Memory Cube (HMC) engineering... ASIC Marketplace Connects Service Providers and Customers
Tel Aviv, Israel, 17-Sep 2013. AnySilicon, an independent semiconductor blog, launched today an online marketplace linking ASIC service providers and... Beyond Plug & Yield® – Multitest is acquired by LTX-Credence Bringing Tester, Handlers and Interfaces together
Rosenheim, Germany, September 2013: LTX-Credence Corporation (Nasdaq:LTXC), announced an important step in the evolution of the semiconductor test cell with... Dow Corning Joins EV Group’s Open Platform for Temporary Bonding Materials for 3D-IC Manufacturing
Both Innovators Join Forces to Offer Simple, Cost-Effective Temporary Bonding/Debonding Solution for High-Performance 3D-IC Packaging ST. FLORIAN, Austria, Sept. 3,... EV Group Unveils New Via-Filling Process to Improve Reliability of 3D-IC / TSV Packaging
Semicon Taiwan, Taipei, September 4, 2013 — EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for... Rudolph Announces New Metrology Suite for Advanced Packaging
New NSX Metrology Series includes application-specific configurations to address unique metrology requirements for wafer level packaging, 2.5D and 3DIC Rudolph... EV Group Celebrates Strong Growth and New Manufacturing Process Solutions at SEMICON West 2013
Demand For Flexible, High-Volume Manufacturing Solutions in 3D-IC/Advanced Packaging, MEMS, Power Device and Compound Semiconductor Markets Drive Growth SEMICON WEST,... Alchimer Signs Collaboration with CEA-Leti to Evaluate Metallization Processes for High Aspect Ratio TSV Applications
Wet Nanometric Film Deposition Processes Capable of Delivering 20:1 Aspect Ratio TSVs at Low Cost of Ownership MASSY, France – July... SSEC Introduces WaferEtch and WaferStorm Platforms to its Portfolio of Single Wafer Wet Processing Solutions at SEMICON West 2013
Unique Configurations Bring Improved Process Control, Lower CoO, and Higher Throughput to Pave the Way for Leading-Edge Technology Adoption Horsham,... EV Group Pushes the Limits on 3D-IC Manufacturing for Next-Generation CMOS Image Sensory
Enhanced wafer alignment metrology capability coupled with market-leading GEMINI® FB system creates closed-loop fusion wafer bonding solution to enable high-density... 