Circuits Integrated Hellas Selected as Laureate for Paris Space Week 2025 Innovation Challenge
Feb 04, 2025 · By Circuits Integrated Helles · Press Releases
Latest Posts - Page 51
SPTS Technologies Announces the Omega® Rapier XE System for 300mm Wafer Silicon Etch Processing
Newport, United Kingdom, 22 May, 2014 – SPTS Technologies, a supplier of advanced wafer processing solutions for the global semiconductor...
AMD’s Bryan Black to Deliver 2014 3D InCites Awards Breakfast Keynote
Panel of judges expanded and Reader’s Choice Award added PHOENIX – May 12, 2014 – 3D InCites, the premier online... SUSS MicroTec launches the new Mask Aligner MA12
Garching, April 29, 2014 – SUSS MicroTec, a global supplier of equipment and process solutions for the semiconductor industry and... SEMICON Southeast Asia to be Launched in 2015
Regional Exposition to Rotate between Singapore and other areas in the region Recognizing the changing dynamics of the microelectronics industry... STS Semiconductor and Invensas to Partner on High Volume Bond Via Array (BVA) Mobile Solutions
Tessera Technologies, Inc., announced today that Invensas Corporation, its wholly owned subsidiary, and Seoul, South Korea-based STS Semiconductor & Telecommunications... Deca Technologies Ships 100-Millionth WLP Component
Fully Automated Manufacturing Technology Drives Growth for WLP Startup Deca Technologies, an electronic interconnect solutions provider to the semiconductor industry,... SUSS MicroTec Launches Mask Aligner MA200 Gen3
Garching, April 2, 2014 – SUSS MicroTec, a global supplier of equipment and process solutions for the semiconductor industry and... 3D InCites Partners with SEMI and TechSearch International for the 2014 3D InCites Awards Program
Proceeds to Benefit STEM-based Scholarship Programs PHOENIX– March 18, 2014 – 3D InCites, the premier online content source for reliable... EV Group Boosts 2.5D and 3D-IC/TSV Performance with New Nanospray Application
ST. FLORIAN, Austria, March 12, 2014 — EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for... Akrion Systems Commences Joint Development Programs for 3D Integration Processes with Leading Research Organizations
Allentown, Pa., March 5, 2014 – Akrion Systems recently engaged in two new Joint Development Programs (JDPs) with leading-edge semiconductor research... SUSS MicroTec launches DSC300 Gen2: Next Generation Projection Scanner for Advanced Packaging
Garching, March 4, 2014 – SUSS MicroTec, a global supplier of equipment and process solutions for the semiconductor industry and... Dynaloy™ Researchers to Detail One-Step Cleaning Process for TSVs
INDIANAPOLIS, Ind., February 24, 2014 – A team of researchers from Dynaloy and Solid State Equipment Corporation (SSEC) have developed... SUSS MicroTec launches ELP300 Gen2: The Latest Generation of Excimer Laser Steppers
Garching, February 19, 2014 – SUSS MicroTec, a leading supplier of equipment and process solutions for the semiconductor industry and... Rudolph Ships NSX 320 TSV Metrology System to CEA-Leti for TSV Process Development
Flanders, New Jersey (February 11, 2014)—Rudolph Technologies, Inc. (NYSE: RTEC) announced today the sale of its first NSX® 320 TSV... EV Group Unveils HVM Photoresist Processing System for Logic and Memory Advanced Packaging Applications
ST. FLORIAN, Austria, February 11, 2014 — EV Group (EVG), supplier of wafer bonding and lithography equipment for the MEMS,... Spirox to Represent Multitest Business for Taiwan and China
In a move to create a strong local presence to enhance sales and support services for its test handler and... Mobility and Internet of Things Drive Requirements for Innovative Sensors
Multitest, a division of LTX-Credence, and designer and manufacturer of final test handlers, contactors and load boards for the semiconductor... Tessera and Samsung Enter into New Patent License Agreements
Tessera Technologies, Inc. and Samsung Electronics Co., Ltd. announced today that Tessera’s subsidiaries Tessera, Inc. and Invensas Corporation each entered... Leaders To Examine EC’s Ambitious Goal At ISS Europe
BERLIN, Germany — January 28, 2014 — At the SEMI Industry Strategy Symposium Europe (ISS Europe 2014) on February 23-25... 
