IEEE JETCAS Call for Papers – 2.5D/3D Chiplet Circuits and Systems, EDA, Advanced Packaging, and Test
Jan 02, 2025 · By Erik Jan Marinissen · Press Releases
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Xcerra™ President and CEO to Join Panel Discussion at Semicon West
Xcerra™ Corporation announced that Dave Tacelli will join the panel discussion “Testing into the Future” at SEMICON West, scheduled to... EV Group Clears Key Barriers to 3D-IC/TSVs HVM with Breakthrough Fusion Wafer Bonding Solution
GEMINI®FB XT surpasses ITRS requirements for wafer bonding with up to 3X improvement in wafer-to-wafer alignment; enhanced productivity enables 50... SPTS Technologies and CEA-Leti / Nanoelec RTI collaborate on 3D TSV Technology
Leading Semiconductor Equipment Maker and Renowned European Research Institute to Collaborate in Advanced Packaging Technologies under the Framework of Nanoelec RTI... SUSS MicroTec Receives Order for Next-Gen Projection Scanner DSC300 Gen2
Garching, June 12, 2014 – SUSS MicroTec, a global supplier of equipment and process solutions for the semiconductor industry and... SPTS Technologies’ Silicon Etch Tool Chosen for 300mm CMOS Image Sensor Applicatons
Move to 300mm Strengthens Customer’s Position in the Rapidly Growing CMOS Image Sensor Market Newport, United Kingdom, 29 May, 2014... Ziptronix and EV Group Demonstrate Submicron Accuracies for Wafer-to-Wafer Hybrid Bonding
Enables fine-pitch connections for 3D applications, including image sensors, memory and 3D SoCs RESEARCH TRIANGLE PARK, N.C., May 27, 2014... SPTS Technologies Announces the Omega® Rapier XE System for 300mm Wafer Silicon Etch Processing
Newport, United Kingdom, 22 May, 2014 – SPTS Technologies, a supplier of advanced wafer processing solutions for the global semiconductor...
AMD’s Bryan Black to Deliver 2014 3D InCites Awards Breakfast Keynote
Panel of judges expanded and Reader’s Choice Award added PHOENIX – May 12, 2014 – 3D InCites, the premier online... SUSS MicroTec launches the new Mask Aligner MA12
Garching, April 29, 2014 – SUSS MicroTec, a global supplier of equipment and process solutions for the semiconductor industry and... SEMICON Southeast Asia to be Launched in 2015
Regional Exposition to Rotate between Singapore and other areas in the region Recognizing the changing dynamics of the microelectronics industry... STS Semiconductor and Invensas to Partner on High Volume Bond Via Array (BVA) Mobile Solutions
Tessera Technologies, Inc., announced today that Invensas Corporation, its wholly owned subsidiary, and Seoul, South Korea-based STS Semiconductor & Telecommunications... Deca Technologies Ships 100-Millionth WLP Component
Fully Automated Manufacturing Technology Drives Growth for WLP Startup Deca Technologies, an electronic interconnect solutions provider to the semiconductor industry,... SUSS MicroTec Launches Mask Aligner MA200 Gen3
Garching, April 2, 2014 – SUSS MicroTec, a global supplier of equipment and process solutions for the semiconductor industry and... 3D InCites Partners with SEMI and TechSearch International for the 2014 3D InCites Awards Program
Proceeds to Benefit STEM-based Scholarship Programs PHOENIX– March 18, 2014 – 3D InCites, the premier online content source for reliable... EV Group Boosts 2.5D and 3D-IC/TSV Performance with New Nanospray Application
ST. FLORIAN, Austria, March 12, 2014 — EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for... Akrion Systems Commences Joint Development Programs for 3D Integration Processes with Leading Research Organizations
Allentown, Pa., March 5, 2014 – Akrion Systems recently engaged in two new Joint Development Programs (JDPs) with leading-edge semiconductor research... SUSS MicroTec launches DSC300 Gen2: Next Generation Projection Scanner for Advanced Packaging
Garching, March 4, 2014 – SUSS MicroTec, a global supplier of equipment and process solutions for the semiconductor industry and... Dynaloy™ Researchers to Detail One-Step Cleaning Process for TSVs
INDIANAPOLIS, Ind., February 24, 2014 – A team of researchers from Dynaloy and Solid State Equipment Corporation (SSEC) have developed... SUSS MicroTec launches ELP300 Gen2: The Latest Generation of Excimer Laser Steppers
Garching, February 19, 2014 – SUSS MicroTec, a leading supplier of equipment and process solutions for the semiconductor industry and... 