Press Releases

ACM Research Expands Fan-Out Panel-Level Packaging Portfolio with Launch of Ultra C bev-p Bevel Etching Tool

New double-sided bevel etching system enhances process efficiency and reliability in copper-related applications, supporting high-precision features on large panels ACM...

YES Signs Memorandum of Understanding with Government of Tamil Nadu

Yield Engineering Systems (YES) is a leading manufacturer of process equipment for AI and HPC semiconductor solutions. YES announced today that...

SEMI Energy Collaborative Releases Recommendations for Growing the Supply of Low Carbon Energy in Japan

Seeking to bolster global semiconductor value chain efforts to lower greenhouse gas (GHG) emissions, the industry association SEMI released today...

Cadence Launches Fem.AI, Pledges $20M to Kickstart Gender Equity in the AI Workforce

Cadence Design Systems, Inc. this week announced the launch of Fem.AI—an initiative to propel women and the industry towards a...

Brewer Science Presents Materials’ Impact in Sustainable Processes, AI, High-Performance Computing

Presentation at SEMICON Taiwan 2024 demonstrates how materials impact sustainability, artificial intelligence, and high-performance computing. Brewer Science, Inc., a global...

Nordson Electronics Solutions to Feature High-throughput Fluid Dispensing Technologies for Wafer-level and Panel-level Packaging at SEMICON Taiwan 2024

Visit booth #L0516 to discuss the latest developments in fluid dispensing for advanced semiconductor packaging. Nordson Electronics Solutions, a global...

EV Group Highlights 3D Integration Process Solutions at SEMICON Taiwan 2024

Presentations to highlight breakthrough capabilities of EVG’s maskless lithography, hybrid bonding and IR laser release solutions for heterogeneous integration; EVG...

Indium Corporation to Showcase Innovative Materials Powering AI Technology

As a proven leader in innovative materials solutions for future-forward technologies, Indium Corporation will proudly showcase its heterogeneous integration and...

IMAPS Device Packaging Conference 2025 Call for Abstracts

The 21st Annual IMAPS Device Packaging Conference (DPC 2025) will be held in Phoenix, Arizona, on March 3-6, 2025. As...

Global Semiconductor Manufacturing Industry Strengthens in Q2 2024, SEMI Reports

The global semiconductor manufacturing industry in the second quarter of 2024 continued to show signs of improvement with significant growth of...

MULTI-DOF Technology From HEIDENHAIN Gives Hybrid Bonding a Boost

To handle the development of artificial intelligence systems, semiconductor technology required a transition from monolithic chip structures to a chiplet...

2025 IEEE Electronic Components and Technology Conference Announces Call for Papers

The IEEE Electronic Components and Technology Conference (ECTC), the premier technical conference and product exhibition for the world’s semiconductor packaging industry,...

StratEdge Brings Gold Medal Performance with its Post-fired and Molded Ceramic Packages and High-reliability Assembly Services

StratEdge Corporation is redefining the landscape of semiconductor packaging with its cutting-edge molded and post-fired ceramic packages, supported by industry-leading high-reliability...