Biden-Harris Administration Announces CHIPS Incentives Award with Amkor Technology to Bring End-to-End Chip Production to the U.S.
Dec 26, 2024 · By Amkor Technology · Press Releases
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Indium Corporation Awards Silver Quill Honor to Authors of Cutting-Edge Technical Content
Indium Corporation has honored nine of its employees for their technical industry contributions with its annual Silver Quill Award. While...
Kulicke & Soffa Announces Thermo-Compression Adoption & Milestones
Kulicke & Soffa announced the introduction of its latest APTURA™ thermo-compression platform in addition to three new milestones relating to industry...
ACM Research Strengthens its Fan-Out Panel Level Packaging Portfolio with Launch of Ultra ECP ap-p Tool
The system delivers superior uniformity, enabling performance and cost efficiencies for next-generation chip packaging ACM Research, Inc., a leading supplier...
SEMI Foundation and Policy Equity Group Collaboration Earns Funding to Address Semiconductor Industry Child Care Gaps
Program Targeting Increased Access to Affordable Care for Industry Workforce Supported by Kellogg and Packard Foundations Seeking to bolster the...
Lam Research Introduces Lam Cryo™ 3.0 Cryogenic Etch Technology to Accelerate Scaling of 3D NAND for the AI Era
Lam Research Corp. (Nasdaq: LRCX) today extended its leadership in 3D NAND flash memory etching with the introduction of Lam Cryo™...
Brewer Science Achieves Certified B Corporation™ Recertification
Certified B Corporation™ recertification and 2024 Impact Report accredit commitment to positive impact. Brewer Science, Inc., a global leader in semiconductor...
Nordson Electronics Solutions Completes Its European Relocation to State-of-the-art Facility
The new demonstration lab includes the latest equipment from three product lines, ASYMTEK, MARCH, and SELECT for electronics manufacturing Nordson... ACM Research Enters Fan-out Panel Level Packaging Market with Introduction of Ultra C vac-p Flux Cleaning Tool
Utilizes vacuum technology and IPA drying to enhance cleaning efficiency for cost-effective fan-out panel-level packaging ACM Research, Inc. (ACM) (NASDAQ:...
QP Technologies and Parent Company, Promex Industries Implement Sales and Marketing Reorganization
Rosie Medina named senior VP of sales and marketing Promex; Matt Hansen named VP of sales and marketing at QP...
Amkor Signs Preliminary Memorandum of Terms with US Department of Commerce for Arizona Advanced Packaging and Test Facility
Amkor Technology, Inc. (Nasdaq: AMKR), a leading provider of semiconductor packaging and test services, has signed a non-binding preliminary memorandum...
SEMICON Southeast Asia 2025 to be Held in Singapore to Commemorate 30th Anniversary
SEMICON Southeast Asia, the region’s premier global electronics manufacturing and supply chain event, will return to its roots in Singapore...
PDF Solutions’ Brian Rubow Awarded the SEMI International Standards Excellence Award
SANTA CLARA, Calif., July 22, 2024 — PDF Solutions, Inc. (Nasdaq: PDFS), a leading provider of comprehensive data solutions for...
Infineon and Amkor Sign Memorandum of Understanding To Stimulate Sustainable Action Across the Supply Chain
Both companies commit to actively engage with common suppliers to help them drive effective decarbonization strategies. The aim is to...
Indium Corporation Introduces Au-Based Precision Die-Attach Preforms
Indium Corporation® is proud to introduce new, high-reliability Au-based Precision Die-Attach (PDA) Preforms. Compared to standard preforms, these gold-based PDA preforms offer a higher...
Adeia Wins ECTC Award for Paper on “Fine Pitch Die-to-Wafer Hybrid Bonding”
SAN JOSE, Calif.—July 10, 2024—Adeia Inc. (Nasdaq: ADEA), a leading research and development and intellectual property licensing company known for...
NY CREATES and SEMI Sign Memorandum of Understanding to Advance Environmental Sustainability
Strategic Partnership Aims to Foster New Advancements in Sustainable Initiatives in the Semiconductor Industry SAN FRANCISCO — July 9, 2024...
SEMI Americas Announces New Annual Event, SEMIEXPO In The Heartland, Focused on Smart Manufacturing and Smart Mobility
Event partners include the Indiana Economic Development Corporation, the Applied Research Institute, Purdue University, and Visit Indy SEMI announced its...
Onto Innovation Further Strengthens Company’s Panel Portfolio with New Glass Suite
Onto’s JetStep® lithography and Firefly® G3 inspection systems offer a powerful solution as the industry pursues glass core panel transition...
3D InCites and IMAPS Microelectronics Foundation to Host the First 3D InCites Community Career Fair at IMAPS Symposium
Phoenix, AZ and Pittsburgh, PA – 3D InCites, the member-centric content platform for heterogeneous integration technologies, and IMAPS Microelectronics Foundation...
