IEEE JETCAS Call for Papers – 2.5D/3D Chiplet Circuits and Systems, EDA, Advanced Packaging, and Test
Jan 02, 2025 · By Erik Jan Marinissen · Press Releases
Latest Posts - Page 49
IWLPC Best Papers Announced
SMTA and Chip Scale Review magazine announced the best papers from the 2014 International Wafer-Level Packaging Conference (IWLPC.) Winners were...
Georgia Tech Forms a Panel-based Global Glass Industry Consortium
At the IEEE Global Interposer Technology (GIT2014) Workshop held at Georgia Tech on November 5-7, 2014, Georgia Tech announced the formation... Ultratech Introduces Superfast 4G Low-cost In-line Inspection System for Patterned Wafers
Ultratech, Inc., a leading supplier of lithography, laser-processing and inspection systems used to manufacture semiconductor devices and high-brightness LEDs (HB-LEDs),...
3D ASIP 2014 Covers All the Bases from Design to Applications for Interposer and 3D IC Technologies
One look at the agenda for the 11th Annual 3D Architectures for Semiconductor Integration and Packaging Conference (3D ASIP), and...
European 3D TSV Summit Committee Announces Keynote Speakers; Pre-Conference Symposium to Focus on the Market
This year’s European 3D TSV Summit, January 19-21, 2015, Grenoble France, will focus on how interposers and 3D ICs can... Nordson DAGE Announces Latest Order for XM8000
Nordson DAGE, a division of Nordson Corporation, is pleased to announce its most recent order from a major customer in... OmniVision Launches Family of High Performance 20+ Megapixel Image Sensors for Flagship Smartphones
OmniVision Technologies, Inc. (NASDAQ: OVTI), a leading developer of advanced digital imaging solutions, today announced the OV23850 and OV21840, a... Tango Systems Inc. Achieves Conformal Deposition for 15:1 Aspect Ratio TSVs
Tango Systems Inc., a leading innovator in high-performance, cost-effective physical vapor deposition (PVD) systems, today announced it has published results... 3D ASIP 2014 Pre-Conference Symposia Place Emphasis on 3D Design Tools and Flow, and Manufacturing Process Technology
As 3D integration processes move into volume manufacturing, the 11th Annual 3D Architectures for Semiconductor Integration and Packaging Conference (3D... SUSS MicroTec Launches SB6/8 Gen2: A Next-Generation Semi-Automated Permanent Wafer Bonder
Garching, October 7, 2014 – SUSS MicroTec, a leading supplier of equipment and process solutions for the semiconductor and related... European 3D TSV Summit: “Smarter System Integration” Theme to Focus on Both Business and Technology
On January 19-21, 2015, SEMI will hold its 3rd edition of the European 3D TSV Summit in Grenoble, France. After... TechSearch International 3D IC Gap Analysis Details Market Growth for 3D ICs and 2.5D Interposers
Major DRAM makers Micron, SK Hynix, and Samsung have announced versions of stacked memory with through silicon vias (TSVs) for... Fermilab Implements Ziptronix’s DBI Hybrid Bonding in High-End 3D Image Sensors
Ziptronix Inc. today announced that its Direct Bond Interconnect (DBI) hybrid bonding has been implemented by Fermi National Accelerator Laboratory... Kulicke & Soffa Introduces APAMA – New Thermo-Compression Bonder
Kulicke and Soffa Industries, Inc. announced the introduction of APAMA (Advanced Packaging with Adaptive Machine Analytics), the Company’s new Chip-to-Substrate... Rudolph Receives Volume Purchase Order from Major Taiwan OSAT for 2D/3D Inspection Systems
Flanders, New Jersey (August 11, 2014)—Rudolph Technologies, Inc. announced today that it has received a large order from one of... Tessera and Micron Execute Technology and Patent License Agreements
Tessera Technologies, Inc.and Micron Technology, Inc. announced today the execution of new, multiyear technology and patent license agreements. In addition to... Rudolph Announces New SONUS Technology and Collaboration with TEL NEXX for Advanced Packaging Process Control
Non-contact, non-destructive acoustic technology fulfills growing need in advanced packaging for thick film metrology up to 100μm and void detection... Orbotech to Acquire SPTS Technologies to Extend Leadership in Advanced Micro Manufacturing
Yavne, Israel – July 7, 2014 – Orbotech Ltd. (NASDAQ: ORBK) today announced the signing of a definitive share purchase agreement... SPTS Technologies’ Sigma fxP PVD System Selected by HuaTian Technologies for 300mm Flip Chip Bumping and CMOS Image Sensor Applications
One of China’s Leading Semiconductor Packaging Providers Chooses SPTS PVD Solution for new 300mm Expansion Newport, United Kingdom, 8 July, 2014 –... 