IMAPS Device Packaging Conference and Advanced Packaging for Medical Microelectronics Workshop to Co-locate
Jan 06, 2025 · By IMAPS · Press Releases
Latest Posts - Page 48
Alchimer Rebrands as aveni; Enters Technology Commercialization Phase
Company secures $13.5M in funding led by a semiconductor chipmaker and ALIAD; Positioned to revolutionize the copper plating processes at... Genmark Automation Launches CODEX Stocker; Industry’s First Integrated Stocker, Sorter and Metrology System
Tool frees up valuable fab floor space for production equipment; allows for internal expansion of manufacturing capacity Fremont, Calif., July... IRT Nanoelec Partners Achieve 3D Chip-stacking Technology and 3DNoC Framework for Digital Processing
GRENOBLE, France – July 09, 2015 – IRT Nanoelec, an R&D consortium focused on Information and Communication Technologies (ICT) using... TechSearch International Makes Sense of Package Alphabet Soup
With new packages continuously being introduced, TechSearch International’s latest Advanced Packaging Update focuses on making some sense out of the...
Scott Jones to Deliver Keynote at 2015 3D InCites Awards Breakfast
Phoenix AZ – May 8, 2015 – 3D InCites, the premiere online content source for reliable 3D technology information, today... SEMICON West 2015 Focuses on the Most Critical Issues in Semiconductor Manufacturing
San Jose, CA (May 7, 2015) — SEMI today announced the SEMICON West 2015 technical and business program agenda tackling the... SPTS Technologies Receives Supplier Excellence Award from Analog Devices
YAVNE, ISRAEL, April 20 2015 | ORBOTECH LTD. (NASDAQ: ORBK) today announced that SPTS Technologies, an Orbotech company and supplier... Dow’s SOLDERON™ Tin-Silver Plating Chemistry Wins Prestigious Bronze Edison Award
MARLBOROUGH, MA – April 27, 2015 – Dow Electronic Materials, a business unit of The Dow Chemical Company (NYSE:DOW), today... Rudolph Wins Lithography and Inspection Orders for Fan-out Wafer Level Packaging Applications
Flanders, New Jersey (April 27, 2015)—Rudolph Technologies, Inc. (NYSE: RTEC) announced today that a major outsourced assembly and test (OSAT)... KLA-Tencor Introduces New Portfolio for Advanced Semiconductor Packaging
KLA-Tencor Corporation (NASDAQ: KLAC) announced two new systems that support advanced semiconductor packaging technologies: CIRCL-AP™ and ICOS® T830. Designed for... Fifty Years of Moore’s Law Made Possible by Semiconductor Equipment and Materials Suppliers Worldwide
SAN JOSE, CA — April 14, 2015 — April 2015 marks the 50th anniversary of one of the business world’s... Rudolph Secures $17M in Orders for Inspection of Critical Advanced Packaging Applications
Flanders, New Jersey (April 1, 2015)—Rudolph Technologies, Inc. (NYSE: RTEC) announced that a major semiconductor foundry and a top outsourced...
3D InCites Opens Nominations for the 2015 3D InCites Awards
Phoenix AZ – March 26, 2015 – 3D InCites, the premiere online content source for reliable 3D technology information, today... Ziptronix Licenses DBI® Hybrid Bonding Patents to Sony for Advanced Image Sensor Applications
RESEARCH TRIANGLE PARK, N.C., March 18, 2015 – Ziptronix Inc., a developer and provider of patented, low-temperature direct bonding technology... TechSearch International Analyzes Flip Chip and Wafer Level Package Growth
TechSearch International Analyzes Flip Chip and Wafer Level Package Growth Flip chip and wafer level package (WLPs) shipments continue to... MIG Takes a Roll-Up-Your-Sleeves Approach with Revamped MEMS/Sensors Technical Event
MEMS Industry Group (MIG) announced a technical event with a hands-on focus: MEMS Technical Congress™, May 6-7, 2015 in Boston, Mass.... Rudolph JetStep Lithography System Gains Traction for Advanced Packaging Applications
Flanders, New Jersey (March 10, 2015)—Rudolph Technologies, Inc. (NYSE: RTEC) announced today that a major outsourced assembly and test (OSAT)... French Institutes IRT Nanoelec and CMP Team up to Offer World’s First Service for Post-process 3D Technologies on Multi-Project-Wafer
GRENOBLE, France – March 5, 2015 – IRT Nanoelec, an R&D consortium focused on ICT using micro- and nanoelectronics, and... Rudolph Ships JetStep Lithography System for High-Volume Fan-Out Packaging Applications
Flanders, New Jersey (February 2, 2015)—Rudolph Technologies, Inc. has shipped the JetStep® Advanced Packaging Lithography System to a leading outsourced... 
