Siemens’ Solido SPICE Certified for Multiple Leading-edge Samsung Foundry Processes
Nov 27, 2024 · By Siemens Digital Industries Software · Press Releases
Latest Posts - Page 47
Tessera to Acquire Ziptronix, Inc. for $39 Million
SAN JOSE, CA (August 28) — Tessera Technologies, Inc. announced the acquisition of Ziptronix, Inc. for $39 million in cash.... TechSearch International Analyzes CSP Market Growth: QFNs Remain “Work Horse” of the Industry
Driven by use in mobile products such as smartphones, CSPs continue to show growth. TechSearch International’s latest CSP market forecast... New Competence Center for Nanoimprint in North America
Garching/Germany, August 18, 2015 – SUSS MicroTec, a global supplier of equipment and process solutions for the semiconductor industry and... Samsung 3D Stacked DDR4 DRAM Brings Via-Mid Technology to the Mainstream
LYON, France – July 31, 2015 – System Plus Consulting, sister company of Yole Développement (Yole), released its new reverse... EV Group Receives 3D InCites Award for Gemini FB XT Automated Fusion Wafer Bonder
ST. FLORIAN, Austria, July 30, 2015—EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS,... Rudolph Technologies and DISCO Corporation Partner to Improve Wafer Saw Process
Flanders, New Jersey (July 14, 2015)—Rudolph Technologies, Inc. (NYSE: RTEC) and DISCO Corporation of Tokyo, Japan, announce a collaborative partnership... Equipment Sentinel Fault Detection and Classification Software from Rudolph Technologies Maximizes Value from all Fab Data
Flanders, New Jersey (July 14, 2015)—Rudolph Technologies, Inc. (NYSE: RTEC) today introduced Equipment Sentinel™, a state-of-the-art, automated fault detection and... Alchimer Rebrands as aveni; Enters Technology Commercialization Phase
Company secures $13.5M in funding led by a semiconductor chipmaker and ALIAD; Positioned to revolutionize the copper plating processes at... Genmark Automation Launches CODEX Stocker; Industry’s First Integrated Stocker, Sorter and Metrology System
Tool frees up valuable fab floor space for production equipment; allows for internal expansion of manufacturing capacity Fremont, Calif., July... IRT Nanoelec Partners Achieve 3D Chip-stacking Technology and 3DNoC Framework for Digital Processing
GRENOBLE, France – July 09, 2015 – IRT Nanoelec, an R&D consortium focused on Information and Communication Technologies (ICT) using... TechSearch International Makes Sense of Package Alphabet Soup
With new packages continuously being introduced, TechSearch International’s latest Advanced Packaging Update focuses on making some sense out of the...
Scott Jones to Deliver Keynote at 2015 3D InCites Awards Breakfast
Phoenix AZ – May 8, 2015 – 3D InCites, the premiere online content source for reliable 3D technology information, today... SEMICON West 2015 Focuses on the Most Critical Issues in Semiconductor Manufacturing
San Jose, CA (May 7, 2015) — SEMI today announced the SEMICON West 2015 technical and business program agenda tackling the... SPTS Technologies Receives Supplier Excellence Award from Analog Devices
YAVNE, ISRAEL, April 20 2015 | ORBOTECH LTD. (NASDAQ: ORBK) today announced that SPTS Technologies, an Orbotech company and supplier... Dow’s SOLDERON™ Tin-Silver Plating Chemistry Wins Prestigious Bronze Edison Award
MARLBOROUGH, MA – April 27, 2015 – Dow Electronic Materials, a business unit of The Dow Chemical Company (NYSE:DOW), today... Rudolph Wins Lithography and Inspection Orders for Fan-out Wafer Level Packaging Applications
Flanders, New Jersey (April 27, 2015)—Rudolph Technologies, Inc. (NYSE: RTEC) announced today that a major outsourced assembly and test (OSAT)... KLA-Tencor Introduces New Portfolio for Advanced Semiconductor Packaging
KLA-Tencor Corporation (NASDAQ: KLAC) announced two new systems that support advanced semiconductor packaging technologies: CIRCL-AP™ and ICOS® T830. Designed for... Fifty Years of Moore’s Law Made Possible by Semiconductor Equipment and Materials Suppliers Worldwide
SAN JOSE, CA — April 14, 2015 — April 2015 marks the 50th anniversary of one of the business world’s... Rudolph Secures $17M in Orders for Inspection of Critical Advanced Packaging Applications
Flanders, New Jersey (April 1, 2015)—Rudolph Technologies, Inc. (NYSE: RTEC) announced that a major semiconductor foundry and a top outsourced...
