Eighteen New Semiconductor Fabs to Start Construction in 2025, SEMI Reports
Jan 07, 2025 · By SEMI · Press Releases
Latest Posts - Page 46
Invensas Announces That Sandia National Laboratories Has Licensed ZiBond and DBI Technologies for Advanced 3D Semiconductor Applications
Invensas Corporation, a wholly owned subsidiary of Tessera Technologies, Inc. (Nasdaq: TSRA), announced today that Sandia National Laboratories signed a...
Extended Supply Chain Presents Exhibitors with New Opportunities at SEMICON West
SAN JOSE, Calif. — April 18, 2016 — Leading innovators in today’s integrated electronics supply chain are preparing to showcase...
Semiconductor Experts Chart Chip Industry’s Future Direction Beyond the “Moore’s Law” Horizon
HONOLULU, HI (APRIL 20, 2016) – Reflecting the semiconductor industry’s ongoing transition from a focus on geometric scaling to the... FOGALE Nanotech Acquires Altatech: Expanded Portfolio Includes Wafer Inspection and Deposition Tools
Nimes, France, April 15, 2016 – FOGALE Nanotech today announced that it has acquired Altatech, a specialized technology leader in... Rudolph Adds High-speed 3D Metrology to the NSX Series for Advanced Packaging Process Control
Wilmington, Mass.—Rudolph Technologies, Inc. (NYSE: RTEC) is pleased to announce the availability of new, high-speed 3D metrology on its flagship...
The Advanced Packaging Industry Reaches its Zenith
To overcome the current market and technology constraints taking place today within the semiconductor industry, new advanced packaging technologies have... Amkor Technology Takes Leadership Position in Advanced System-in-Package Market
TEMPE, Ariz. – March 23, 2016 – Amkor Technology Inc. (Nasdaq: AMKR), a leading semiconductor packaging and test service provider,... KLA-Tencor Corp. Receives Intel’s Preferred Quality Supplier Award
KLA-Tencor Corp. has been recognized as one of 26 companies receiving Intel Corporation’s Preferred Quality Supplier (PQS) award for their...
EV Group Joins IRT Nanoelec 3D Integration Program
ST. FLORIAN, Austria – Feb. 5, 2016 – EV Group (EVG), an industry-leading supplier of wafer-bonding, lithography/nanoimprint lithography (NIL), metrology,... Rudolph JetStep Lithography System Selected for First Panel Fan-out Packaging Manufacturing Line
Flanders, New Jersey —Rudolph Technologies, Inc. (NYSE: RTEC) announced today that a leading outsourced assembly and test facility (OSAT) has placed... Presto Engineering Expands Turnkey IC Production Management Services with Three New Operations in Asia
San Jose, Calif., USA – Presto Engineering Inc., a world leader in semiconductor product engineering and supply chain management, announced... SET joins IRT Nanoelec 3D Integration Program
SAINT-JEOIRE, France – Jan. 15, 2016 – SET, Smart Equipment Technology, the leading supplier in high-accuracy die-to-die and die-to-wafer bonders,...
Advanced Packaging Industry: What’s New on the Market?
The mobile sector is driving production and market growth; however a new market driver, the Internet of Things (IoT) is on...
Panel-level Packaging: a Promising Market
For many years now, the semiconductor industry development has been governed by Moore’s law and the increasing demand for higher...
SEMI Foundation Appoints Leslie Tugman as Executive Director
SEMI Foundation, a nonprofit affiliate of SEMI established to support education and career awareness in the field of high-tech, has... Invensas Licenses BVA Vertical Interconnect Technology to Tong Hsing for MEMS Applications
Invensas Corporation, a wholly owned subsidiary of Tessera Technologies, Inc. (Nasdaq:TSRA), announced that Tong Hsing Electronic Industries Ltd., a leading Taiwanese provider...
Flip Chip Technology: Which Companies will Invest to Support Growth?
Due to the growth of the semiconductor business, the wider adoption of Cu pillar solutions and the introduction of flip...
High Performance Requirements are Driving the Graphics Market
Last June, AMD released a new generation of graphics card, Radeon™ R9 Fury X, dedicated to PC gaming applications and...
System Plus Consulting reveals the Samsung Galaxy S6 hidden technologies
The mobile phone industry has grown to produce more than 1.1 billion devices in 2014 (Source: Camera Module Industry report,... 
