Siemens’ Solido SPICE Certified for Multiple Leading-edge Samsung Foundry Processes
Nov 27, 2024 · By Siemens Digital Industries Software · Press Releases
Latest Posts - Page 46
Invensas Licenses BVA Vertical Interconnect Technology to Tong Hsing for MEMS Applications
Invensas Corporation, a wholly owned subsidiary of Tessera Technologies, Inc. (Nasdaq:TSRA), announced that Tong Hsing Electronic Industries Ltd., a leading Taiwanese provider...
Flip Chip Technology: Which Companies will Invest to Support Growth?
Due to the growth of the semiconductor business, the wider adoption of Cu pillar solutions and the introduction of flip...
High Performance Requirements are Driving the Graphics Market
Last June, AMD released a new generation of graphics card, Radeon™ R9 Fury X, dedicated to PC gaming applications and...
System Plus Consulting reveals the Samsung Galaxy S6 hidden technologies
The mobile phone industry has grown to produce more than 1.1 billion devices in 2014 (Source: Camera Module Industry report,... Dow Electronic Materials Wins Prestigious R&D 100 Award for SOLDERON™ Tin-Silver Plating Chemistry
MARLBOROUGH, Mass. – Nov. 17, 2015 – Dow Electronic Materials, a business unit of The Dow Chemical Company (NYSE:DOW), today... Disruptive Impact of FO-WLP Growth Coming for Electronics Industry
Fan-out wafer level packaging (FO-WLP) is a disruptive technology that will have a significant impact on the electronics industry in... Rudolph’s Yield Management System Software Expands Adoption in Advanced Packaging
Flanders, New Jersey (November 2, 2015)—Rudolph Technologies, Inc. (NYSE: RTEC) announced today that it has received a multi-fab order for its... Ziptronix and Fraunhofer IZM-ASSID Collaborate on Development of Low-Cost 3D Integration Solutions
SAN JOSE, Calif. — Ziptronix, Inc., a wholly owned subsidiary of Tessera Technologies, Inc. (NASDAQ:TSRA) (“Tessera” or the “Company”) and... Photolithography Equipment & Materials Market Attracts New Players; Success Not Guaranteed
“Growing photolithography equipment markets in advanced packaging, MEMS and LEDs are attracting new players; but they have to navigate complex... Business Opportunities in Advanced Packaging Drive Photolithography Equipment Demand
Within the photolithography equipment market reaching US$ 150M 2014 (Source: Photolithography Equipment & Materials for Advanced Packaging, MEMS and LED... The More-than-Moore Supply Chain Dream has Become a Reality
The “More than Moore” revolution has already happened. Semiconductor manufacturing processes are no longer exclusive to the integrated circuit (IC)... The Semiconductor Industry: The Mastery of Time and Volumes
Since the dawn of the industry, semiconductor companies have developed disruptive technologies and solutions that have met the most ambitious... Rudolph Acquires Inspection Technology of Stella Alliance, LLC
Flanders, New Jersey (September 29, 2015)—Rudolph Technologies, Inc. (NYSE: RTEC) announced today that it has purchased Stella Alliance, LLC, a... SUSS MicroTec Receives Large Volume Order for Lithography Projection Scanners
Garching, September 24, 2015 – SUSS MicroTec, a leading supplier of equipment and process solutions for the semiconductor industry and... SUSS MicroTec Launches XB8 – a New Semi-Automated High-Force Wafer Bonder
Garching, September 17, 2015 – SUSS MicroTec, a global supplier of equipment and applications for the semiconductor industry and related... MEMS Technology for your Senses: What can you Expect?
LYON, France – September 11, 2015 — Hearing, touching, smelling and seeing… what will be the next improvement that MEMS technology... Rudolph Technologies’ NSX 330 Series Widely Adopted for Advanced Packaging Inspection and Metrology
Flanders, New Jersey (September 1, 2015) — Rudolph Technologies, Inc. (NYSE: RTEC) announced the widespread adoption and success of its newest... Advanced Materials Enable a Smart and Interconnected World: SEMI Strategic Materials Conference 2015
The SEMI Strategic Materials Conference (SMC), taking place September 22–23 in Mountain View, Calif., will uncover the drivers for new materials and how... BeSang Inc. announces 3D super-NAND flash memory
BeSang Inc., a pioneer in the monolithic 3-dimensional integrated circuits (3D ICs), announced today its proprietary 3D super-NAND development. “We are... 