Siemens’ Solido SPICE Certified for Multiple Leading-edge Samsung Foundry Processes
Nov 27, 2024 · By Siemens Digital Industries Software · Press Releases
Latest Posts - Page 45
EV Group Scores Fourth Consecutive Triple Crown Win in Annual VLSIresearch Customer Satisfaction Survey
FLORIAN, Austria, June 21, 2016—EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology... Nanotech company, Smoltek, retains Boucher-Lensch Associates as its financial advisor
Smoltek has appointed Boucher-Lensch Associates LLC (BLA) as financial advisor for its $7 million financing round for the commercialization phase... EV Group Receives Multiple Orders for GEMINI® FB XT Fusion Wafer Bonder for 3D Chip Stacking Production Applications
EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today... Amkor and Cadence to Develop PADK for Amkor’s SLIM and SWIFT Packaging Technologies
TEMPE, Ariz., May 2, 2016 — Amkor Technology, Inc. (NASDAQ: AMKR), a leading outsourced semiconductor packaging and test service provider,... Cypress Subsidiary Deca Technologies to Receive $60 Million Investment from ASE
SAN JOSE, Calif.,- Advanced Semiconductor Engineering, Inc. (TAIEX: 2311, NYSE: ASX and Deca Technologies, a subsidiary of Cypress Semiconductor Corp.... Invensas Announces That Sandia National Laboratories Has Licensed ZiBond and DBI Technologies for Advanced 3D Semiconductor Applications
Invensas Corporation, a wholly owned subsidiary of Tessera Technologies, Inc. (Nasdaq: TSRA), announced today that Sandia National Laboratories signed a...
Extended Supply Chain Presents Exhibitors with New Opportunities at SEMICON West
SAN JOSE, Calif. — April 18, 2016 — Leading innovators in today’s integrated electronics supply chain are preparing to showcase...
Semiconductor Experts Chart Chip Industry’s Future Direction Beyond the “Moore’s Law” Horizon
HONOLULU, HI (APRIL 20, 2016) – Reflecting the semiconductor industry’s ongoing transition from a focus on geometric scaling to the... FOGALE Nanotech Acquires Altatech: Expanded Portfolio Includes Wafer Inspection and Deposition Tools
Nimes, France, April 15, 2016 – FOGALE Nanotech today announced that it has acquired Altatech, a specialized technology leader in... Rudolph Adds High-speed 3D Metrology to the NSX Series for Advanced Packaging Process Control
Wilmington, Mass.—Rudolph Technologies, Inc. (NYSE: RTEC) is pleased to announce the availability of new, high-speed 3D metrology on its flagship...
The Advanced Packaging Industry Reaches its Zenith
To overcome the current market and technology constraints taking place today within the semiconductor industry, new advanced packaging technologies have... Amkor Technology Takes Leadership Position in Advanced System-in-Package Market
TEMPE, Ariz. – March 23, 2016 – Amkor Technology Inc. (Nasdaq: AMKR), a leading semiconductor packaging and test service provider,... KLA-Tencor Corp. Receives Intel’s Preferred Quality Supplier Award
KLA-Tencor Corp. has been recognized as one of 26 companies receiving Intel Corporation’s Preferred Quality Supplier (PQS) award for their...
EV Group Joins IRT Nanoelec 3D Integration Program
ST. FLORIAN, Austria – Feb. 5, 2016 – EV Group (EVG), an industry-leading supplier of wafer-bonding, lithography/nanoimprint lithography (NIL), metrology,... Rudolph JetStep Lithography System Selected for First Panel Fan-out Packaging Manufacturing Line
Flanders, New Jersey —Rudolph Technologies, Inc. (NYSE: RTEC) announced today that a leading outsourced assembly and test facility (OSAT) has placed... Presto Engineering Expands Turnkey IC Production Management Services with Three New Operations in Asia
San Jose, Calif., USA – Presto Engineering Inc., a world leader in semiconductor product engineering and supply chain management, announced... SET joins IRT Nanoelec 3D Integration Program
SAINT-JEOIRE, France – Jan. 15, 2016 – SET, Smart Equipment Technology, the leading supplier in high-accuracy die-to-die and die-to-wafer bonders,...
Advanced Packaging Industry: What’s New on the Market?
The mobile sector is driving production and market growth; however a new market driver, the Internet of Things (IoT) is on...
Panel-level Packaging: a Promising Market
For many years now, the semiconductor industry development has been governed by Moore’s law and the increasing demand for higher...
