Eighteen New Semiconductor Fabs to Start Construction in 2025, SEMI Reports
Jan 07, 2025 · By SEMI · Press Releases
Latest Posts - Page 45
Orbotech’s SPTS Technologies Extends Leadership in FOWLP PVD Equipment
NEWPORT, UK, November 3, 2016 | SPTS Technologies, an Orbotech company and a supplier of advanced wafer-processing solutions for the...
What Will Happen With the Chinese Advanced Packaging Ecosystem?
In 2015, more than US$1 billion was invested in China’s advanced packaging ecosystem, announces Yole Développement (Yole) in its report...Fraunhofer EMFT Signs Agreement to Implement ZiBond and DBI Technologies in MEMS Applications
Invensas Corporation, a wholly owned subsidiary of Tessera Technologies, Inc., (Nasdaq: TSRA) has announced that Fraunhofer EMFT has signed a... Leti Orders HERCULES® NIL System from EV Group for Joint Nanoimprint Lithography Program
Nanoimprint lithography (NIL) system will bolster process development and demo capabilities of INSPIRE program EV Group (EVG), a leading supplier of... Rudolph Technologies Unveils New Inspection Suite for Front- and Back-end Semiconductor Manufacturing
Rudolph continues to drive the technological innovation of its inspection and metrology products to deliver solutions that address the demanding... Deca Technologies Receives Major Investment for M-Series™ Fan-out Growth
TEMPE, Arizona – September 1, 2016 – Deca Technologies, a wafer level electronic interconnect solutions provider to the semiconductor industry,... Will Fan-out Packaging be Sustainable Long-term?
2016 is a turning point for the Fan-Out packaging market since both leaders, Apple and TSMC changed the game and...
Leading Market Analysts to Explore Future of MEMS at the European MEMS Summit
The second annual European MEMS Summit takes place in Stuttgart, Germany, on September 15-16, 2016. In addition to top MEMS technologists, the... Rudolph Technologies Announces New Clearfind Technology for Advanced Packaging Inspection
Wilmington, Mass. (July 11, 2016)—Rudolph Technologies, Inc. (NYSE: RTEC) today unveiled its new patented Clearfind™ technology, which can detect organic defects... EV Group Rolls Out Automated Metrology System for Advanced Packaging, MEMS and Photonics Manufacturing
FLORIAN, Austria, July 11, 2016—EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology...
Cast your votes for the 2016 3D InCites Awards
This year’s awards will be decided entirely by your industry peers through this online voting process. The nominees are listed... EV Group Expands High-Vacuum Wafer Bonding Capabilities of EVG ComBond Platform for High-Volume MEMS Manufacturing
EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today... MEMS & Sensors Industry Group Invites Collaboration in MEMS, Sensors and ICs at SEMICON West 2016
PITTSBURGH (June 29, 2016) – MEMS & Sensors Industry Group® (MSIG) invites attendees to a special half-day workshop on the... Rudolph Receives Multi-System Order From a Leading OSAT for Fan-out Wafer Level Packaging Inspection
Wilmington, Mass. (June 28, 2016)—Rudolph Technologies, Inc. (NYSE: RTEC), a leader in the design, development, manufacture and support of defect inspection,... Amkor Opens MEMS Packaging Line in China
TEMPE, Ariz., June 28, 2016 – Driven by the increase in global demand for sensors from the smartphone and automotive... EV Group Scores Fourth Consecutive Triple Crown Win in Annual VLSIresearch Customer Satisfaction Survey
FLORIAN, Austria, June 21, 2016—EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology... Nanotech company, Smoltek, retains Boucher-Lensch Associates as its financial advisor
Smoltek has appointed Boucher-Lensch Associates LLC (BLA) as financial advisor for its $7 million financing round for the commercialization phase... EV Group Receives Multiple Orders for GEMINI® FB XT Fusion Wafer Bonder for 3D Chip Stacking Production Applications
EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today... Amkor and Cadence to Develop PADK for Amkor’s SLIM and SWIFT Packaging Technologies
TEMPE, Ariz., May 2, 2016 — Amkor Technology, Inc. (NASDAQ: AMKR), a leading outsourced semiconductor packaging and test service provider,... 
