Mycronic Global Technologies Division Acquires Hprobe Mar 13, 2025 · By MRSI Systems, Mycronic Group · Press Releases
Brewer Science Advances Midwest Semiconductor Growth at SEMIEXPO Heartland 2025 Mar 10, 2025 · By Brewer Science · Press Releases
Koh Young Showcases Inspection Innovations at IPC APEX EXPO 2025 Mar 10, 2025 · By Koh Young Europe · Press Releases
UnitySC Acquires HSEB Dresden GmbH to Become a Global Leader in Semiconductor Process ControlMar 20, 2018 · By UnitySC Grenoble, France – March 20, 2018 – UnitySC, a leader in advanced inspection and metrology solutions, today announced it acquired...
Apple selected substrate-like PCBs for its latest iPhones. Who’s next?Mar 15, 2018 · By Yole Development The semiconductor industry’s trends are affecting the semiconductor package and package-to-board interconnect level. Performance-driven applications like PCs and smartphones are...
EV Group and IBM Sign License Agreement on Laser Debonding TechnologyMar 15, 2018 · By EV Group EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, and...
MRSI Systems’ New MRSI-HVM3 Die Bonder System Has Entered Volume ProductionMar 07, 2018 · By MRSI Systems, Mycronic Group North Billerica, MA, March 6, 2018 – MRSI Systems, a leading provider of fully automated, ultra-precision, high speed die bonding and...
TechSearch International Analysis Shows Packaging for Cryptocurrency Provides a WindfallMar 05, 2018 · By TechSearch International, Inc. Projections for PC growth are flat and shipments of smartphones show low growth rates. Demand for cryptocurrency devices in flip-chip...
Well-established Advanced Packaging Manufacturer in Taiwan selects TrymaxMar 05, 2018 · By Trymax NIJMEGEN, The Netherlands (March. 02, 2018) – Semiconductor equipment manufacturer Trymax announced today that a Taiwanese establishes advanced packaging manufacturer selects...
Rudolph Technologies Expands Memory Customer Base with $21 Million in System OrdersJan 24, 2018 · By Onto Innovation Wilmington, Mass. (January 16, 2018)—Rudolph Technologies, Inc. (NYSE: RTEC) announced today that it has received over $21 million (USD) in...
aveni® S.A. Announces Breakthrough Electrical Yield Results for 12:1 Aspect Ratio TSVsJan 23, 2018 · By aveni MASSY, France – Jan. 23, 2018 – aveni S.A., developer and manufacturer of market-disrupting wet deposition technologies and chemistries for...
SEMI ISS 2018: AI, IoT, Automotive to Fuel Industry GrowthJan 19, 2018 · By SEMI HALF MOON BAY, Calif. — January 17, 2018 — The SEMI Industry Strategy Symposium ( SEMI ISS) opened yesterday with the...
Luc Van den hove to Receive SEMI Sales and Marketing Excellence AwardJan 11, 2018 · By SEMI MILPITAS, CA — January 11, 2018 — SEMI today announced that Luc Van den hove, president and CEO of imec,...
TechSearch International Analyzes New Automotive Packaging TrendsJan 03, 2018 · By TechSearch International, Inc. More than 80 companies are developing autonomous vehicles and many more are involved in providing sensors and computational systems for...
New SEMI Japan President to Drive SEMI 2.0 in JapanJan 02, 2018 · By SEMI SEMI today announced the appointment of Masahiko (Jim) Hamajima as president of SEMI Japan. Reporting to SEMI president and CEO...
EV Group Completes Latest Phase of Production Capacity Expansion at Corporate HQDec 20, 2017 · By EV Group EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets,...
EV Group Installs Low-temperature Plasma Activation System for Compound Semiconductor Research at the University of TokyoDec 13, 2017 · By EV Group EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today...
Trymax and AST China Partner to Distribute and Support Customers in ChinaDec 12, 2017 · By Trymax NIJMEGEN, The Netherlands and Beijing, China (Oct. 10, 2017) – Trymax Semiconductor Equipment BV and AST China announced today that...
TechSearch International Forecasts Growth for High-Density FO-WLP and Examines Panel PotentialNov 28, 2017 · By TechSearch International, Inc. Growth for high-density fan-out wafer level packages (FO-WLPs) continues unabated, with Apple’s continued use of TSMC’s InFO process in its...
Merck Brings Material Solutions to the Automotive IndustryNov 17, 2017 · By Merck KGAA Munich, Germany, November 14, 2017– Merck, a leading science and technology company, is offering material solutions to the next generation...
Leti Demonstrates World’s First 300-mm Wafer-to-Wafer Direct Hybrid Bonding with 1-Micron Pitch on EV Group SystemNov 14, 2017 · By EV Group EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, and...
The Memory Packaging Market Shows Steady GrowthNov 03, 2017 · By Yole Development The memory industry is experiencing a strong growth phase: the total memory market is expected to increase at a ~9%...
MEMS Packaging Market is Growing Faster Than The MEMS Devices MarketNov 02, 2017 · By Yole Development According to Yole Développement (Yole), the MEMS packaging market will grow from US$2.56 billion in 2016 to US$6.46 billion in...