Siemens’ Solido SPICE Certified for Multiple Leading-edge Samsung Foundry Processes
Nov 27, 2024 · By Siemens Digital Industries Software · Press Releases
Latest Posts - Page 44
TechSearch International Analysis Predicts Growth for Fan-in and FO-WLP
TechSearch International Analysis Predicts Growth for Fan-in and FO-WLP TechSearch International predicts strong market growth for fan-in wafer level packages...
Fan-out is the Most Dynamic IP Landscape in Advanced Packaging
In the fast-growing fan-out market showing 80% increase between 2015 and 2017[1], it is today essential to deeply understand the...
SiP Impact, Smartphone Market Saturation… What is the Future of Fan-in Packaging?
Fan-in packaging has been a successful and steadily growing platform for over a decade. However, fan-in packaging should face a... 3D TSV IP Landscape for Memory Applications: Who Owns What?
The last two years have shown some important changes within the 3D through silicon via (TSV) memory market. First commercial... TechSearch International Analysis Shows CSP Growth Remains Strong
Despite a slowing growth rate for smartphones, the industry is experiencing strong growth for CSP packages such as QFNs and...
Orbotech’s SPTS Technologies Extends Leadership in FOWLP PVD Equipment
NEWPORT, UK, November 3, 2016 | SPTS Technologies, an Orbotech company and a supplier of advanced wafer-processing solutions for the... What Will Happen With the Chinese Advanced Packaging Ecosystem?
In 2015, more than US$1 billion was invested in China’s advanced packaging ecosystem, announces Yole Développement (Yole) in its report...Fraunhofer EMFT Signs Agreement to Implement ZiBond and DBI Technologies in MEMS Applications
Invensas Corporation, a wholly owned subsidiary of Tessera Technologies, Inc., (Nasdaq: TSRA) has announced that Fraunhofer EMFT has signed a... Leti Orders HERCULES® NIL System from EV Group for Joint Nanoimprint Lithography Program
Nanoimprint lithography (NIL) system will bolster process development and demo capabilities of INSPIRE program EV Group (EVG), a leading supplier of... Rudolph Technologies Unveils New Inspection Suite for Front- and Back-end Semiconductor Manufacturing
Rudolph continues to drive the technological innovation of its inspection and metrology products to deliver solutions that address the demanding... Deca Technologies Receives Major Investment for M-Series™ Fan-out Growth
TEMPE, Arizona – September 1, 2016 – Deca Technologies, a wafer level electronic interconnect solutions provider to the semiconductor industry,... Will Fan-out Packaging be Sustainable Long-term?
2016 is a turning point for the Fan-Out packaging market since both leaders, Apple and TSMC changed the game and...
Leading Market Analysts to Explore Future of MEMS at the European MEMS Summit
The second annual European MEMS Summit takes place in Stuttgart, Germany, on September 15-16, 2016. In addition to top MEMS technologists, the... Rudolph Technologies Announces New Clearfind Technology for Advanced Packaging Inspection
Wilmington, Mass. (July 11, 2016)—Rudolph Technologies, Inc. (NYSE: RTEC) today unveiled its new patented Clearfind™ technology, which can detect organic defects... EV Group Rolls Out Automated Metrology System for Advanced Packaging, MEMS and Photonics Manufacturing
FLORIAN, Austria, July 11, 2016—EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology...
Cast your votes for the 2016 3D InCites Awards
This year’s awards will be decided entirely by your industry peers through this online voting process. The nominees are listed... EV Group Expands High-Vacuum Wafer Bonding Capabilities of EVG ComBond Platform for High-Volume MEMS Manufacturing
EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today... MEMS & Sensors Industry Group Invites Collaboration in MEMS, Sensors and ICs at SEMICON West 2016
PITTSBURGH (June 29, 2016) – MEMS & Sensors Industry Group® (MSIG) invites attendees to a special half-day workshop on the... Rudolph Receives Multi-System Order From a Leading OSAT for Fan-out Wafer Level Packaging Inspection
Wilmington, Mass. (June 28, 2016)—Rudolph Technologies, Inc. (NYSE: RTEC), a leader in the design, development, manufacture and support of defect inspection,... 